MOUNTING FRAME FOR A SCREWING MACHINE
    2.
    发明公开

    公开(公告)号:US20240091893A1

    公开(公告)日:2024-03-21

    申请号:US18450687

    申请日:2023-08-16

    Applicant: Jabil Inc.

    CPC classification number: B23P19/069

    Abstract: A mounting frame for being mounted with either one of first and second screwdrivers, includes a main frame, a mounting seat, and first and second mounting plates. The mounting seat has a plate attachment hole set. The first mounting plate has a first seat attachment hole set operable to be connected to the plate attachment hole set, and a first driver attachment hole set for the first screwdriver to be attached thereto. The second mounting plate has a second seat attachment hole set operable to be connected to the plate attachment hole set, and a second driver attachment hole set for the second screwdriver to be attached thereto.

    TOOL SET
    3.
    发明公开
    TOOL SET 审中-公开

    公开(公告)号:US20240116148A1

    公开(公告)日:2024-04-11

    申请号:US18457129

    申请日:2023-08-28

    Applicant: Jabil Inc.

    CPC classification number: B23Q3/15536 B23Q3/1556

    Abstract: A tool set includes a tool holder, a tool and a tool rack. The tool has a groove unit. The tool holder has a latch unit that engages the groove unit. The tool rack includes a rack body and a blocking member. When the tool holder is moved away from the rack body after the tool is moved into the rack body by the tool holder and after the blocking member moves to a blocking position, the tool is blocked by the blocking member so that the latch unit is separated from the groove unit and that the tool holder is separated from the tool.

    AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM

    公开(公告)号:US20240248463A1

    公开(公告)日:2024-07-25

    申请号:US18560535

    申请日:2022-05-11

    Applicant: JABIL INC.

    Abstract: An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.

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