Invention Grant
- Patent Title: Continuous interconnects between heterogeneous materials
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Application No.: US17663764Application Date: 2022-05-17
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Publication No.: US11882653B2Publication Date: 2024-01-23
- Inventor: Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
- Applicant: Liquid Wire Inc.
- Applicant Address: US OR Portland
- Assignee: Liquid Wire Inc.
- Current Assignee: Liquid Wire Inc.
- Current Assignee Address: US OR Portland
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/42 ; H05K3/30 ; H05K1/18

Abstract:
A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
Public/Granted literature
- US20220377885A1 CONTINUOUS INTERCONNECTS BETWEEN HETEROGENEOUS MATERIALS Public/Granted day:2022-11-24
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