A method for the production and control of plates for electronics comprising a first step in which a plate is positioned, by means of positioning means, in a loading station; a second step in which the plate is disposed in a deposition station associated with a unit for depositing metal, or other material, in which the metal is deposited on the plate, in order to generate on the plates metal tracks, according to a pre-determined and desired topological disposition; a third step in which the plate is disposed in an exit station and a detection means is activated so as to detect the presence of defects in the plate; and a fourth step in which the plate is discharged from the exit station. In the first step the detection means is activated to identify defects in the plate disposed in the loading station. In the second step the deposition unit is activated in order to deposit the metal on the plate when in the first step the detection means has not detected any defect in the plate.