Abstract:
본 발명은 깊이 이미지에서 적외선 이미지로의 도메인 전이학습을 기반으로 빠른 손 동작에 대한 3차원 손 자세를 추정하는 손 자세 추정 방법 및 시스템에 관한 것으로서, 손 움직임에 대한 깊이 이미지 및 적외선 이미지를 처리하는 단계, 손 이미지 생성기(HIG)를 이용하여 상기 적외선 이미지에서 깊이 맵을 합성하며, 상기 깊이 맵 및 적외선 맵 각각에서 손 관절의 골격 위치를 추정하는 단계 및 상기 골격 위치와 손 깊이 이미지의 중심을 이용하여 3차원 손 자세를 산출하는 단계를 포함한다.
Abstract:
The present invention relates to an electronic-hole double layer tunnel field effect transistor, where a source region, a channel and a drain region are arranged at a substrate in a vertical direction, including a double gate structure. The present invention relates to the electronic-hole double layer tunnel field effect transistor and a manufacturing method thereof capable of increasing the degree of integration of the transistor at the substrate by having a vertical structure, being the electronic-hole double layer tunnel field effect transistor by applying different electrodes to the double gate structure, improving the inclination under threshold voltage and increasing operating current by using a double gate p-i-n structure and tunneling between bands, and having an implementable symmetrical double gate structure by proposing a gate of a symmetrical structure.
Abstract:
The purpose of the present invention is to provide a transistor having improved performance than a conventional FinFET by manufacturing a UTFinFET having an ultra-thin fin (UTFin) whose thickness is thinner than that of a fin which can be manufactured by a conventional FinFET manufacturing process. In order to achieve the purpose, a semiconductor device according to the present invention comprises a step of forming two Si-UTFins which protrude from a substrate and are formed on both sides of a fin made of Si and SiGe layers using an epitaxy method. The UTFin formed in this method replaces the role of a fin of a conventional FinFET. A UTFin formed using an epitaxy method overcomes a thickness limit which a fin formed by lithography has, and can have a thickness of less than 10 nm. [Reference numerals] (AA) Step of preparing a Si substrate; (BB) Step of forming a SiGe layer; (CC) Step of placing a hard mask on a Si-Fin area by patterning the hard mask on the SiGe layer; (DD) Step of forming a Si-Fin through an etching process; (EE) Step of growing a Si layer on both sides of the Si-Fin and both sides of the SiGe layer in an epitaxy method; (FF) Step of forming a first impurity resign by firstly doping an impurity into a Si-UTFin; (GG) Step of etching the hard mask; (HH) Step of firstly depositing oxide in a region etched while forming the Si-Fin, making an oxide surface even, and etching the oxide; (II) Step of forming two Si-UTFins on both sides of the Si-Fin and both sides of the SiGe layer; (JJ) Step of forming an air filled structure in a space formed by a secondly deposited oxide, the lower part of the Si-UTFin, and the Si-Fin by secondly depositing oxide onto inner walls, outer walls, top between two Si-UTFins under poor step coverage conditions and making an oxide surface even; (KK) Step of depositing a gate stack electrode; (LL) Step of forming source and drain regions which are second and third impurity regions respectively by secondly and thirdly doping on left and right sides of the Si-UTFin
Abstract:
The purpose of the present invention is to provide a transistor having improved performance than a conventional FinFET by manufacturing a UTFinFET having an ultra-thin fin (UTFin) whose thickness is thinner than that of a fin which can be manufactured by a conventional FinFET manufacturing process. In order to achieve the purpose, a semiconductor device according to the present invention comprises a step of forming two Si-UTFins which protrude from a substrate and are formed on both sides of a fin made of Si and SiGe layers using an epitaxy method. The UTFin formed in this method replaces the role of a fin of a conventional FinFET. A UTFin formed using an epitaxy method overcomes a thickness limit which a fin formed by lithography has, and can have a thickness of less than 10 nm. [Reference numerals] (AA) Step of preparing a Si substrate; (BB) Step of forming a SiGe layer; (CC) Step of placing a hard mask on a Si-Fin area by patterning the hard mask on the SiGe layer; (DD) Step of forming a Si-Fin through an etching process; (EE) Step of growing a Si layer on both sides of the Si-Fin and both sides of the SiGe layer in an epitaxy method; (FF) Step of forming a first impurity doped resign by firstly doping an impurity into a Si-UTFin; (GG) Step of etching the hard mask; (HH) Step of firstly depositing oxide in a region etched while forming the Si-Fin, making an oxide surface even, and etching the oxide; (II) Step of forming two Si-UTFins on both sides of the Si-Fin and both sides of the SiGe layer; (JJ) Step of forming an intermediate dielectric layer by filling dielectric material between two Si-UTFins; (KK) Step of leaving the intermediate dielectric layer between two Si-UTFins and removing the intermediate dielectric layer on outer walls of two Si-UTFins through an etching process; (LL) Step of secondly depositing oxide on the outer walls of two Si-UTFins and the intermediate dielectric layer and making an oxide surface even; (MM) Step of depositing a gate stack electrode; (NN) Step of forming source and drain regions which are second and third impurity regions respectively by secondly and thirdly doping on left and right sides of the Si-UTFin
Abstract:
PURPOSE: A tunnel structure for reducing micro pressure wave in a tunnel is provided to reduce pressure wave and micro pressure wave generated due to the progress of a vehicle. CONSTITUTION: A tunnel structure for reducing micro pressure wave in a tunnel comprises a tunnel wall(20) and a pressure wave reduction module(40). The tunnel wall is formed with a tunnel(10) inside to pass a high speed train. The pressure wave reduction module comprises a pressure wave reduction pipe(42) and a plunger(44). The pressure wave reduction pipe is connected to the tunnel and is lengthily extended in the longitudinal direction of the tunnel wall. The plunger is arranged inside the pressure wave reduction pipe. The plunger longitudinally moves inside the pressure wave reduction pipe.
Abstract:
The present invention relates to a method for detecting and blocking distributed denial of service (DDos) evolved from an application layer DDoS attack and a device for the same. The method for detecting and blocking the application layer DDoS attack comprises the steps of: transmitting a link address of a web page to a client after modification and obfuscation; determining reliability by comparing a link address that the client accesses and the link address transmitted to the client; setting a reference value as a reference for blocking access to the web page, and deciding whether to block access to the web page of the client by comparing the reliability and the reference value. [Reference numerals] (110) Whether a server is overloaded?; (111) Change a link address of a web page transmitted based on each client information; (112) Obfuscate the changed link address; (113) Waiting for connection after transmitting the changed link address to a client; (120) Client access link address is the changed link address?; (121) Negative points on client's reliability; (122) Plus points on the client's reliability; (130) Reliability
Abstract:
본 발명에 따른 열차가 통과되는 터널구조에 있어서, 열차가 지나갈 수 있도록 내부에 터널(10)이 형성된 터널벽(20); 상기 터널(10)과 연통되고 상기 터널벽(20) 내부로 연장되어 형성되며, 저감시키고자 하는 압력파의 1/4 파장 길이로 형성된 압력파저감모듈(40)을 포함하고, 상기 압력파저감모듈(40)은 상기 터널(10)과 연통되어 상기 터널벽(20)의 길이방향으로 길게 연장되어 형성된 압력파저감관(42); 상기 압력파저감관(32)을 따라 이동되게 구성되어 상기 압력파저감관(32) 내부의 길이를 조절시키는 플런저(44)를 포함하기 때문에, 터널(10) 내부에서 발생되는 압력파 및 미기압파를 효과적으로 저감할 수 있고, 이를 통해 승객 귀에서 느끼는 압박감 및 터널 출입구 주변에서의 충격성 환경 압력파를 저감시키는 효과가 있다.