5.
    发明专利
    未知

    公开(公告)号:DE3831243A1

    公开(公告)日:1990-03-22

    申请号:DE3831243

    申请日:1988-09-14

    Applicant: BASF AG

    Abstract: Thermoplastic moulding material of the following composition (I): (A) 30 to 97 weight % of a thermoplastic polyester or polyamide or of a mixture of said polymers, whereby said polymers or their mixture have a viscosity index greater than 165; (B) 3 to 40 weight % of an olefin polymerizate, comprised of (b1) 40 to 100 weight % of at least one alpha -olefin with 2 to 8 atoms of C, (b2) 0 to 50 weight % of a diene, (b3) 0 to 45 weight % of a primary or secondary C1 to C12 acrylic acid or methacrylic acid alkylester or mixtures of such esters, (b4) 0 to 40 weight % of an ethylenically unsaturated monocarboxylic or bicarboxylic acid and/or a functional derivative of such an acid, (b5) 0 to 40 weight % of a monomer containing epoxy groups, with the provision that the component (B) is not an olefin homopolymerizate and that it has a gel content no greater than 50 %; (C) 0 to 60 weight % of fillers in fibre or particle form, or mixtures thereof; and (D) 0 to 40 % of a flame protection agent; or of the following composition (II): (A) 20 to 99 weight % of a thermoplastic polyester or polyamide or of a mixture of said polymers; (D) 1 to 40 weight % of a flame protection agent; (B) 0 to 20 % of an olefin polymerizate; and (C) 0 to 60 weight % of fillers in fibre or particle form or mixtures thereof. Said thermoplastic moulding materials can be produced by thermal treatment of mixtures of a type (A) component (component A'), whose viscosity index is lesser than 160, with the remaining components, at temperatures between 60 DEG C below and 60 DEG C above the melting point of the pure component (A).

    7.
    发明专利
    未知

    公开(公告)号:DE3708706A1

    公开(公告)日:1988-10-06

    申请号:DE3708706

    申请日:1987-03-18

    Applicant: BASF AG

    Abstract: The moulding is based on thermoplastics or thermosets having a permanent antielectrostatic finish and is obtainable by applying a 1 to 20 % strength by weight solution of the thermoplastic or thermoset which forms the moulding and contains from 0.05 to 4 % by weight of an electroconductive filler in dissolved or dispersed form, the weight ratio between the thermoplastic or thermoset and the electroconductive filler in the solution being in the range from 1:1 to 50:1.

    8.
    发明专利
    未知

    公开(公告)号:DE3619606A1

    公开(公告)日:1987-12-17

    申请号:DE3619606

    申请日:1986-06-11

    Applicant: BASF AG

    Abstract: Production of an electrically conductive surface layer on moulded articles consisting of plastics which are soluble or can be swelled in organic solvents, the conductivity of which surface layer is based on a system embedded therein of… - organic electron acceptors (I) on the one hand and… - organic electron donors (II), iodides (III) or mixtures of (II) and (III) as electron donors on the other hand,… in that the moulded articles are treated with organic solutions of these components. … The products of the process have a surface resistance between 10 and 10 ohms and have the advantage that the other characteristics of the moulded articles are virtually uninfluenced by the means (I) to (III).

    9.
    发明专利
    未知

    公开(公告)号:DE3542833A1

    公开(公告)日:1987-06-11

    申请号:DE3542833

    申请日:1985-12-04

    Applicant: BASF AG

    Abstract: Wholly aromatic mesomorphic polyether ester imides which form a liquid-crystalline fiber-forming melt below 320 DEG C. and are composed of (a) from 5 to 35 mol % of repeat units of the formula I (I) (b) from 5 to 35 mol % of repeat units of the formula II (II) where X is a chemical bond, -O-, -S-, -SO2-, -CO-, -Ch2- or =C(CH3)2, and n is 0 or 1, (c) from 15 to 30 mol % of repeat units of the formula III (III) (d) a molar amount corresponding to the total amount of (b) plus (c) minus (a) of repeat units of the formulae IV and/or V (IV) (V) (e) repeat units of the formula VI (VI) the mole percentages of components a, b, c, d and e adding up to a 100 mol % in each case, the preparation thereof and fibers, films and molding prepared therefrom.

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