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公开(公告)号：JP2013014777A
公开(公告)日：2013-01-24
申请号：JP2012196932
申请日：2012-09-07
Applicant: Brewer Science Inc , ブルーワー サイエンス アイ エヌ シー.
Inventor： HONG WENBIN , BAI DONGSHUN , FLAIM TONY D , PULIGADDA RAMA
IPC: C09J5/00
CPC classification number: H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
Abstract: PROBLEM TO BE SOLVED: To provide new compositions and methods of using those compositions as bonding compositions.SOLUTION: The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
Abstract translation: 要解决的问题：提供使用这些组合物作为粘合组合物的新组合物和方法。 解决方案：组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以帮助在随后的处理和处理期间保护活性晶片及其活性位点 。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2014158035A
公开(公告)日：2014-08-28
申请号：JP2014061971
申请日：2014-03-25
Applicant: Brewer Science Inc , ブルーワー サイエンス アイ エヌ シー.
Inventor： PULIGADDA RAMA , ZHONG XING-FU , FRAME TONY D , JEREMY MCCUTCHAN
IPC: H01L21/02
CPC classification number: H01L21/6835 , B32B38/0008 , B32B38/10 , B32B43/006 , H01L21/2007 , H01L21/6836 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T156/11 , Y10T156/1126 , Y10T428/24942 , Y10T428/26 , Y10T428/31511 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31935 , Y10T428/31938 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer bonding layer system for temporarily bonding a semiconductor substrate.SOLUTION: In this bonding system, at least one layer is directly contacted with a semiconductor substrate, and at least two layers of this system are directly contacted with each other. Some processing options are provided for execution of a specific function by a different layer in a multilayer structure. The further importance is that performance of a thin-wafer handling solution can be improved by providing improvement in thermal stability, improvement in adaptability with a severe back face processing step, impact protection of a wafer front face by encapsulation, stress alleviation at a peeling step, and reduction in defects in the front face.
Abstract translation: 要解决的问题：提供一种用于临时接合半导体衬底的多层接合层系统。解决方案：在该接合系统中，至少一层与半导体衬底直接接触，并且该系统的至少两层与 彼此。 提供了一些处理选项，用于通过多层结构中的不同层执行特定功能。 更重要的是，可以通过提供热稳定性的改善来提高薄晶片处理方案的性能，通过严格的背面处理步骤提高适应性，通过封装对晶片正面的冲击保护，在剥离步骤的应力缓解 ，并减少前面的缺陷。
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公开(公告)号：DE60237484D1
公开(公告)日：2010-10-07
申请号：DE60237484
申请日：2002-02-11
Applicant: BREWER SCIENCE INC
Inventor： ENOMOTO TOMOYUKI , MIZUSAWA KEN-ICHI , ARASE SHIN-YA , PULIGADDA RAMA
IPC: G03F7/004 , G03F7/11 , C08F18/00 , C08F18/16 , C08F220/12 , C08F220/22 , C08F220/28 , C09D133/16 , G03F7/038 , G03F7/09 , G03F7/26 , G03F7/40 , H01L21/027
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公开(公告)号：AU2003278870A8
公开(公告)日：2004-05-04
申请号：AU2003278870
申请日：2003-09-19
Applicant: BREWER SCIENCE INC
Inventor： NAKAYAMA KEISUKE , ENOMOTO TOMOYUKI , PULIGADDA RAMA
Abstract: The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or an alkoxymethyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.
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公开(公告)号：AU2003278870A1
公开(公告)日：2004-05-04
申请号：AU2003278870
申请日：2003-09-19
Applicant: BREWER SCIENCE INC
Inventor： ENOMOTO TOMOYUKI , NAKAYAMA KEISUKE , PULIGADDA RAMA
Abstract: The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or an alkoxymethyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.
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Patent Agency Ranking
公开(公告)号：SG185250A1
公开(公告)日：2012-11-29
申请号：SG2012069340
申请日：2009-10-22
Applicant: BREWER SCIENCE INC
Inventor： HONG WENBIN , BAI DONGSHUN , FLAIM TONY D , PULIGADDA RAMA
Abstract: CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING AbstractNew compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Figure 1
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公开(公告)号：AU2003294563A8
公开(公告)日：2004-06-23
申请号：AU2003294563
申请日：2003-12-02
Applicant: BREWER SCIENCE INC
Inventor： PULIGADDA RAMA , LAMB JAMES E , FLAIM TONY D
IPC: H01L21/312 , B05D3/02 , B32B17/10 , C08F20/26 , C08F20/32 , C08F220/28 , C08G59/32 , C08J7/04 , C09D163/00 , G03F7/09 , G03F7/11 , H01L20060101 , H01L21/027 , H01L21/311
Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted ring members. In another embodiment, the polymers further comprise recurring monomers comprising ring members reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.
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公开(公告)号：AU2002245460A1
公开(公告)日：2003-09-16
申请号：AU2002245460
申请日：2002-02-11
Applicant: BREWER SCIENCE INC
Inventor： ENOMOTO TOMOYUKI , MIZUSAWA KEN-ICHI , ARASE SHIN-YA , PULIGADDA RAMA
IPC: G03F7/11 , C08F220/22 , C08F220/28 , C09D133/16 , G03F7/038 , G03F7/09 , G03F7/40 , H01L21/027 , G03F7/004 , C08F220/12 , G03F7/26 , C08F18/00 , C08F18/16
Abstract: Anti-reflective coatings formed from polymers and having high etch rates are provided. Broadly, the coatings are formed from a polymer binder and a light attenuating compound. The polymer binder has halogen atoms bonded thereto, preferably to functional groups on the polymer binder rather than to the polymer backbone. Preferred polymer binders comprise acrylic polymers while it is preferred that the halogenated functional groups of the polymer binders be dihalogenated, and more preferably trihalogenated, with chlorine, fluorine, or bromine atoms.
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公开(公告)号：AU7356800A
公开(公告)日：2001-11-07
申请号：AU7356800
申请日：2000-09-06
Applicant: BREWER SCIENCE INC
Inventor： PULIGADDA RAMA , HUANG RUNHUI
IPC: B05D1/40 , B05D7/24 , C08L61/28 , C09D5/32 , C09D101/00 , C09D133/02 , C09D167/00 , C09D179/06 , G02B1/11 , B05D3/02 , B05D5/06
Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., -CH2-, -CH2-O-CH2-) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values, improved etch rates, and can be formulated for both conformal and planar applications.
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公开(公告)号：SG10201506168WA
公开(公告)日：2015-09-29
申请号：SG10201506168W
申请日：2011-08-05
Applicant: BREWER SCIENCE INC
Inventor： PULIGADDA RAMA , ZHONG XING-FU , FLAIM TONY D , MCCUTCHEON JEREMY
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