公开(公告)号：JP2013014777A

公开(公告)日：2013-01-24

申请号：JP2012196932

申请日：2012-09-07

Applicant: Brewer Science Inc ,  ブルーワー サイエンス アイ エヌ シー.

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: C09J5/00

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: PROBLEM TO BE SOLVED: To provide new compositions and methods of using those compositions as bonding compositions.SOLUTION: The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract translation: 要解决的问题：提供使用这些组合物作为粘合组合物的新组合物和方法。 解决方案：组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以帮助在随后的处理和处理期间保护活性晶片及其活性位点 。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：SG185250A1

公开(公告)日：2012-11-29

申请号：SG2012069340

申请日：2009-10-22

Applicant: BREWER SCIENCE INC

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

Abstract: CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING AbstractNew compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Figure 1

公开(公告)号：SG175217A1

公开(公告)日：2011-11-28

申请号：SG2011074903

申请日：2010-03-19

Applicant: BREWER SCIENCE INC

Inventor： TRICHUR RAMACHANDRAN K ,  TANG TINGJI ,  XU GU ,  ZHONG XING-FU ,  HONG WENBIN ,  FLAIM TONY D ,  YESS KIMBERLY

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

公开(公告)号：SG2014012512A

公开(公告)日：2014-06-27

申请号：SG2014012512

申请日：2010-03-19

Applicant: BREWER SCIENCE INC

Inventor： TANG TINGJI ,  XU GU ,  ZHONG XING-FU ,  HONG WENBIN ,  FLAIM TONY D ,  YESS KIMBERLY ,  TRICHUR RAMACHANDRAN K

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

公开(公告)号：WO2009003029A3

公开(公告)日：2009-04-30

申请号：PCT/US2008068170

申请日：2008-06-25

Applicant: BREWER SCIENCE INC ,  HONG WENBIN ,  PILLALAMARRI SUNIL K

Inventor： HONG WENBIN ,  PILLALAMARRI SUNIL K

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  C09J5/06 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T156/11 ,  Y10T428/24355

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract translation: 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物优选是热塑性的，并且包括分散或溶解在溶剂体系中的酰亚胺，酰胺酰亚胺和/或酰胺酰亚胺 - 硅氧烷（以聚合或低聚形式），并且可用于将活性晶片结合到载体晶片或基底以辅助 在后续处理和处理期间保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化以使晶片在制造过程中的适当阶段分开。

公开(公告)号：WO2010051212A2

公开(公告)日：2010-05-06

申请号：PCT/US2009061633

申请日：2009-10-22

Applicant: BREWER SCIENCE INC ,  HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  H01L21/304

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract translation: 提供了使用这些组合物作为粘合组合物的新组合物和方法。 所述组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或衬底上，以辅助在后续处理和处理期间保护活性晶片及其活性部位。 该组合物形成化学和耐热的粘合层，但也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。

公开(公告)号：EP2419926A4

公开(公告)日：2013-06-05

申请号：EP10810300

申请日：2010-03-19

Applicant: BREWER SCIENCE INC

Inventor： TANG TINGJI ,  XU GU ,  ZHONG XING-FU ,  HONG WENBIN ,  FLAIM TONY D ,  YESS KIMBERLY ,  TRICHUR RAMACHANDRAN K

IPC: H01L21/312 ,  B81C1/00 ,  C08G61/08 ,  G03F7/039

CPC classification number: B81C1/00801 ,  B81C2201/053 ,  C08G61/08 ,  C08G2261/3324 ,  C08G2261/418 ,  G03F7/033 ,  G03F7/094 ,  H01L21/0274 ,  H01L21/3081 ,  Y10T428/31645 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T428/31909

公开(公告)号：EP2362970A4

公开(公告)日：2013-05-29

申请号：EP09824030

申请日：2009-10-22

Applicant: BREWER SCIENCE INC

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  C08L65/00 ,  C09J123/08 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.