Abstract:
A polymer product with a metal layer coated on the surface thereof is provided. A method for selectively metallizing a surface of a polymer substrate is also provided. The polymer product includes a polymer substrate; and a metal layer formed on at least a part of a surface of the polymer substrate, and the surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide; and a doping element of the doped tin oxide comprises niobium, and the doped tin oxide has a coordinate L*value of about 70 to about 100, a coordinate a value of about -5 to about 5, and a coordinate b value of about -5 to about 5 in a CIELab color space.
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula(I): Cu 2 A α B 2-α O 4-β . A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group13 of the periodic table, 0
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And the surface of the polymer substrate is subjected to chemical plating.
Abstract:
A method for selective metallization of a surface of a polymer article is provided. The polymer article contains a base polymer and at least one metal compound dispersed in the base polymer. The method includes gasifying at least a part of a surface of the polymer article by irradiating the surface with an energy source,and forming at least one metal layer on the surface of the polymer article by chemical plating. The metal compound contains a tin oxide doped with at least one doping element selected from a group including: V,Sb,In,and Mo.
Abstract:
A film and a method for preparing the film are provided. A substrate is provided, and a film is formed on at least a part of a surface of the substrate by magnetron sputtering a target under a protective gas and a reactive gas. The target includes polytetrafluoroethylene and magnesium fluoride, and the reactive gas includes at least one selected from a group consisting of CF 4 and SiF 4 .
Abstract:
A metal-resin composite and method for producing the same are provided. The method comprises steps of: A) forming nanopores in at least a part of the surface of a shaped metal; and B) injection molding a thermoplastic resin directly on the surface of the shaped metal, wherein the 5 thermoplastic resin includes a main resin and a polyolefin resin, the main resin includes a mixture of polyphenylene ether and polyphenylene sulfide, and the polyolefin resin has a melting point of about 65§ to about 105§.
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.
Abstract:
A polyimide film contains a chemical plating accelerant including at least one selected from a group consisting of TiO, Ni 2 O 3 , Co 2 O 3 , CuSiO 3 , NiSiO 3 , CoSiO 3 , CuB 2 O 4 , NiB 2 O 4 , NiC 2 O 4 , CoO and CoC 2 O 4 . A method of preparing the polyimide film, a flexible circuit board including the polyimide film, and a method of preparing the flexible circuit board are also provided.
Abstract translation:聚酰亚胺膜含有包括选自TiO,Ni 2 O 3,Co 2 O 3,CuSiO 3,NiSiO 3,CoSiO 3,CuB 2 O 4,NiB 2 O 4,NiC 2 O 4,CoO和CoC 2 O 4中的至少一种的化学镀层促进剂。 还提供了制备聚酰亚胺膜的方法,包括聚酰亚胺膜的柔性电路板以及制备柔性电路板的方法。
Abstract:
A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO 3 , B 2 O 3 , SiO 2 , Li 2 O, P 2 O 5 , Cs 2 O, Nd 2 O 3 , Al 2 O 3 and TiO 2 .