Method for inspecting electric device
    1.
    发明专利
    Method for inspecting electric device 有权
    检查电气设备的方法

    公开(公告)号:JP2006177971A

    公开(公告)日:2006-07-06

    申请号:JP2006005111

    申请日:2006-01-12

    CPC classification number: G01R1/06711 G01R1/07342 G01R1/0735

    Abstract: PROBLEM TO BE SOLVED: To surely attain sufficient scrubbing pressure and reliable tilting and returning effect of each contact in a membrane probing assembly.
    SOLUTION: The membrane probing assembly 42 includes a membrane assembly 72 having a central region 80 interconnected to a support 54 by an elastomeric layer 98. Flexible traces form data/signal lines 76 to contacts 88 on the central region 80. Each contact 88 comprises a rigid beam 90 and a bump 92 located in off-centered location on the beam 90, which bump 92 includes a contacting portion 93. After initial touchdown of these contacting portions 93, further overtravel of pads 100 causes each beam 90 to independently tilt locally so that different portions of each beam 90 move different distances relative to the support 54 thus driving each contact into lateral scrubbing movement across the pads 100.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:确保在膜探测组件中获得足够的洗涤压力和可靠的倾斜和每个接触的返回效果。 解决方案:膜探测组件42包括膜组件72,膜组件72具有通过弹性体层98互连到支撑件54的中心区域80.柔性迹线将数据/信号线76形成到中心区域80上的触点88。 88包括刚性梁90和位于梁90上的偏心位置的凸起92,凸起92包括接触部分93.在这些接触部分93初始接触之后,垫100的进一步超行使每个梁90独立地 每个梁90的不同部分相对于支撑件54移动不同的距离,从而将每个接触件驱动穿过垫片100进行横向擦洗运动。版权所有:(C)2006,JPO&NCIPI

    PROBE FOR TESTING A DEVICE UNDER TEST
    3.
    发明申请
    PROBE FOR TESTING A DEVICE UNDER TEST 审中-公开
    用于测试测试中的设备的探测

    公开(公告)号:WO2004107401A3

    公开(公告)日:2005-03-31

    申请号:PCT/US2004012806

    申请日:2004-04-26

    CPC classification number: G01R1/07342 G01R1/06738 G01R1/06772

    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits at high frequencies include a coaxial cable (40) for supporting and electrically connected to a microstrip probe having a dielectric substrate (88), an elongated conductor (92), a conductive member (90) electrically connected to a ground signal support by a second side of the substrate (88) and wherein the conductive member is under a majority of the length of an elongate conductor located on a first side of the substrate, a conductive path (94) between the first and second side of the substrate (88), and a contact electrically connected to the conductive path for making contact with a device under test.

    Abstract translation: 用于测量高频集成电路的电特性的探针测量系统包括用于支撑并电连接到具有电介质基片(88)的微带探针的同轴电缆(40),细长导体(92),导电部件 90),其由所述基板(88)的第二侧电连接到接地信号支撑件,并且其中所述导电构件位于位于所述基板的第一侧上的细长导体的长度的大部分,导电路径(94) 在基板(88)的第一和第二侧之间,以及电连接到导电路径以便与被测器件接触的触点。

    Membrane probing system with local contact scrub

    公开(公告)号:AU3007797A

    公开(公告)日:1998-03-06

    申请号:AU3007797

    申请日:1997-05-02

    Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.

    5.
    发明专利
    未知

    公开(公告)号:DE19614506A1

    公开(公告)日:1996-10-17

    申请号:DE19614506

    申请日:1996-04-12

    Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.

    6.
    发明专利
    未知

    公开(公告)号:AT254289T

    公开(公告)日:2003-11-15

    申请号:AT97924735

    申请日:1997-05-02

    Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.

    RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME
    7.
    发明申请
    RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME 审中-公开
    活动电气插件,包括插入器的系统及其使用和形成方法

    公开(公告)号:WO2012061568A3

    公开(公告)日:2014-04-10

    申请号:PCT/US2011059091

    申请日:2011-11-03

    Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

    Abstract translation: 可用于在第一装置和第二装置之间形成多个电连接的弹性电插入件,以及可利用弹性电插入件及其使用和/或制造方法的系统。 弹性电插入件可以包括弹性介电体,其中包含多个电导管。 多个电导管可以被配置为在电插入器的第一表面和/或弹性电介质体之间提供多个电连接以及电插入器和/或弹性介电体的第二相对的表面。 本文公开的系统和方法可以提供弹性电插入器的改进的垂直顺应性,改进的接触力控制和/或改进的尺寸稳定性。

    HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME
    8.
    发明申请
    HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME 审中-公开
    高频互连结构,利用高频互联结构的电子组件及其操作方法

    公开(公告)号:WO2012167014A2

    公开(公告)日:2012-12-06

    申请号:PCT/US2012040366

    申请日:2012-06-01

    CPC classification number: G01R23/02 H01P3/16 H01P3/18

    Abstract: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.

    Abstract translation: 高频互连结构,利用高频互连结构的电子组件及其操作方法。 高频互连结构包括多个介质波导,并且被配置为将多个发射器与多个接收器通信连接并且在其间传送多个信号。 多个信号可以包括多个电磁波,并且可以具有至少200GHz的频率。 高频互连结构还可以被配置为降低由多个介质波导的第一介电波导传送的第一信号与由多个介质波导的第二介质波导传送的第二信号之间的串扰的电位 波导,例如通过控制第一介电波导相对于第二介质波导的通带和/或使用串扰减轻结构。

    ACTIVE WAFER PROBE
    9.
    发明申请
    ACTIVE WAFER PROBE 审中-公开
    主动波形探测器

    公开(公告)号:WO2005065258A3

    公开(公告)日:2006-01-05

    申请号:PCT/US2004043231

    申请日:2004-12-21

    CPC classification number: G01R1/06711 G01R1/06772

    Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit (16). The probe may include a flexible interconnection (14) between the active circuit (16) and a support structure (10). The probe may impose a relatively low capacitance on the device under test.

    Abstract translation: 一种适用于探测包括有源电路(16)的半导体晶片的探针。 探针可以包括在有源电路(16)和支撑结构(10)之间的柔性互连(14)。 探头可能会在被测器件上施加相对较低的电容。

    Active wafer probe
    10.
    发明专利

    公开(公告)号:GB2425844B

    公开(公告)日:2007-07-11

    申请号:GB0611823

    申请日:2004-12-21

    Abstract: The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).

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