Abstract:
PROBLEM TO BE SOLVED: To use a membrane suspended probe as a component of a probe assembly of a needle type probe head.SOLUTION: The probe head includes: an elastic membrane 170 having a first surface and a second surface formed on the opposite side to the first surface and, when one of the first and second surfaces is distorted, capable of exerting restoring force; a beam 164 having a first end part and a second end part; a probe tip part 168 existing in the vicinity of the one end part of the beam 164 and coming into contact with a device to be inspected; and a membrane suspended probe 104 existing in the vicinity of the second end part of the beam 164 and including a beam contact part exposed from the first surface of the elastic membrane 170. In the probe head, the beam 164 can be moved to deform the second surface of the elastic membrane 170.
Abstract:
PROBLEM TO BE SOLVED: To provide an improved imaging method and system. SOLUTION: A system and a method for extending a range of digital zoom are provided, wherein an imaging system provides a continuous magnification on a plurality of separated optical paths and a plurality of digital zoom imaging devices. The system and method that also bring an image to the center along with a view field change and remove an undesirable obstacle from a magnified image by means of the mask. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To surely attain sufficient scrubbing pressure and reliable tilting and returning effect of each contact in a membrane probing assembly. SOLUTION: The membrane probing assembly 42 includes a membrane assembly 72 having a central region 80 interconnected to a support 54 by an elastomeric layer 98. Flexible traces form data/signal lines 76 to contacts 88 on the central region 80. Each contact 88 comprises a rigid beam 90 and a bump 92 located in off-centered location on the beam 90, which bump 92 includes a contacting portion 93. After initial touchdown of these contacting portions 93, further overtravel of pads 100 causes each beam 90 to independently tilt locally so that different portions of each beam 90 move different distances relative to the support 54 thus driving each contact into lateral scrubbing movement across the pads 100. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PURPOSE: To correct the error factor of an error model, which involves N error factors, by reducing a modeled error with new error factor obtained by changing at least one of the error factors of quantity N. CONSTITUTION: A theoretical network analyzer 22 is connected to a device (DUT) 24 to be tested, and an error network 28 for modeling the characteristics of a transmission line and a testing instrument inserted between the DUT 24 and an actual measuring surface 30, probe head and other circuits is put between a desired measuring surface 26 and an analyzer 22. In the error model having the error factors of quantity N, at least one of the error factors of quantity N is changed to obtain a new error factor. By reducing modeled errors with the new error factor, it is possible to correct the error due to the error factor of the error model.
Abstract:
PURPOSE: To minimize the variation of impedance by using an overlapped end part of a different shape between respective signal lines/ground lines of transmission lines for interface structure for connecting a pair of shared face transmission lines. CONSTITUTION: In a pair of shared face transmission lines 20, 20a, each end part 24 or 25 of one transmission line 20 has lateral dimensions larger than the dimensions of the end part 24a or 25a of the other transmission line 20a and the end parts 24a, 25a have lateral dimensions remarkably reduced from the remaining parts of respective lines. In the case of overlapping narrow corresponding end part 24a or 25a, respective end parts 24, 25 have excessively conductive materials 21', 23', and when respective transmission lines 21, 21a are unaligned in the lateral direction, the lateral dimensions 26 of the signal line end part and a lateral interval between the signal line end part and a ground line end part are included within the valid limit of non-alignment. Consequently the impedance variation of the interface can be minimized.
Abstract:
PURPOSE: To compensate reactance accurately by measuring the level and phase of each compound reflection factor at each multiple frequency of an impedance reference value. CONSTITUTION: Three primary impedance reference values provided on an impedance reference substance are contacted with a probe chip 20 and the individual reflection factor is measured to determine three initial error coefficients Ed, Er, and Es according to a convention. Then, in addition to the three primary impedance standard values, in this case, a fourth impedance standard value can be an open-circuited or short-circuited stab, a capacitor with a high Q, or an inductance with a high Q. After the initial error coefficients are adjusted by this system and reactance generated by a superposition distance 42 is compensated, the superposition distance is retained during the next measurement by the probe chip 20 of a device during next measurement, thus retaining the same reactance and hence enabling the adjusted error coefficient to compensate reactance applied at the next measurement accurately.
Abstract:
PURPOSE: To pass a high-frequency signal without power loss by providing an adjustable stopper which positions the top surface of the microstrip transmission line in a changeable state as to the external conductor of the launcher and a tapered contact pin which comes into linear contact with the upper conductor of the microstrip transmission line. CONSTITUTION: The shape of the launcher 10 is so optimized that the tapered pin 42 maintains characteristic impedance along the length of a hole 28, and the launcher is used for the microstrip transmission line 12 which has expected substrate thickness satisfying gap-thickness relation. When the launcher 10 is used for a microstrip transmission line 12 having different substrate thickness, the front end of the tapered pin 42 needs to be moved elastically to outside an optimum position along the axis of the hole 28 so as to obtain the necessary gap-thickness relation. Consequently, the characteristic impedance varies along the length of the hole 28, but total signal reflection is reduced and the adjustable stopper 46 can correct an error in diameter generated between the pin 42 and hole 28 because of manufacture tolerance. Consequently, the launcher 10 can minimize a reflected signal.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for an assembly of many contact points type probe which is easy configuration in order to perform a high-frequency test of an integrated circuit or other microelectronics elements. SOLUTION: The probe assembly method includes (a) the process of forming a supporting member 14, (b) the process of preparing one-assembly consisting of a plurality of contact fingers 16 and the supporting members 14 in which the plurality of contact fingers 16 are maintained with a predetermined arrangement with the supporting tab 26 at the non-supporting state by the supporting part 14, (c) the process of attaching the plurality of the contact fingers 16 to the supporting part 14, and (d) the process of removing the supporting tab 26. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a chuck which can keep flatness of an upper chuck assembly element which holds a wafer when a probe is applied on a wafer. SOLUTION: This chuck comprises the upper chuck assembly element 180 having a top surface 198 that holds a wafer, and a chuck spacing device including three independent pins 204 which form a clearance between the upper chuck assembly element 180 and a central chuck assembly element 182 under the element 180. This chuck spacing device includes an insulative U-shaped component of which the first surface is pressed on a upper surface 224 of the central chuck assembly element 182, and the second surface is pressed each other with a first surface of a conductive U-shaped member. A second surface of the conductive U-shaped member is pressed each other with an under surface of the upper chuck assembly element 180. The thickness in the first surface of the insulative U-shaped member 246 is thinner than one third of the thickness of the conductive U-shaped member 244.
Abstract:
PROBLEM TO BE SOLVED: To enhance the insulation between traces where stressed leak currents appear and suppress the crosstalk between trace sets by electrically connecting guard traces having a top surface shape of a card to auxiliary guard traces at a set of conductor pairs formed through a top dielectric layer. SOLUTION: A laminate board 158 includes a top dielectric layer, bottom dielectric and guide traces 204 disposed between the top and bottom dielectric layers and has an opening 166 and top and bottom main surfaces. The probe device comprises a probe needle 164 and electric contact electrically connected to the needle 164 and is disposed on the top main surface on which the probe devices are radially disposed with respect to the opening 166 and extends down below the opening 166. Pogo-pin accepting pad sets 170, first conductors for electrically connecting the sets 170 to the guard traces 204 and second conductors for connecting electric contacts to the sets 170 are provided.