公开(公告)号：US20250143026A1

公开(公告)日：2025-05-01

申请号：US19009855

申请日：2025-01-03

Applicant: EPISTAR CORPORATION

Inventor： Hsin-Ying WANG ,  Chao-Hsing CHEN ,  Chi-Ling LEE ,  Chen OU ,  Min-Hsun HSIEH

IPC: H10H20/831 ,  H01L25/13 ,  H10H20/833

Abstract: A semiconductor light-emitting device includes: a semiconductor stack, including; an active layer, formed on the semiconductor stack; a second semiconductor contact layer formed on the active layer; and a recessed region formed in the semiconductor stack and including a part of the upper surface; a transparent electrode on the second semiconductor contact layer; a protective layer on semiconductor stack, including a first and second opening; a first electrode pad in the first opening and connected with the first semiconductor contact layer; and a second electrode pad in the second opening and connected to the transparent electrode. The semiconductor light-emitting device receives an operating current having ratio to the area of the transparent electrode that ranges from 10 mA/mm2 to 1000 mA/mm2. In a top view, the active layer surrounds the recessed region. The semiconductor stack and the transparent electrode layer each includes an edge adjacent to the recessed region.

公开(公告)号：US20240120437A1

公开(公告)日：2024-04-11

申请号：US18535955

申请日：2023-12-11

Applicant: EPISTAR CORPORATION

Inventor： Chia-Chen TSAI ,  Jia-Liang TU ,  Chi-Ling LEE

IPC: H01L33/00 ,  H01L21/66 ,  H01L21/683 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/0095 ,  H01L21/6835 ,  H01L22/22 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0066

Abstract: A manufacturing method for a LED is disclosed. The method includes: providing a substrate with an upper surface; preparing a plurality of LEDs on the upper surface; wherein the upper surface is divided into a plurality of zones, the plurality of LEDs composes a plurality of LED groups, and each of the LED group is disposed in one of the plurality of zones; preparing a testing circuit to electrically connecting the plurality of LEDs in one of the plurality of LED groups; testing the plurality of LEDs in the one of the plurality of LED groups by the testing circuit to obtain photoelectrical characteristics of the plurality of LEDs in the one of the plurality of LED groups; and presenting the photoelectric characteristics in an image.

公开(公告)号：US20210249558A1

公开(公告)日：2021-08-12

申请号：US17169057

申请日：2021-02-05

Applicant: EPISTAR CORPORATION

Inventor： Chia-Chen TSAI ,  Jia-Liang TU ,  Chi-Ling LEE

IPC: H01L33/00 ,  H01L21/683 ,  H01L21/66 ,  H01L25/075 ,  H01L33/62

Abstract: A manufacturing method for an LED includes: providing a substrate having an upper surface divided into a plurality of zones; a LED group formed on each of the zones and wherein: a plurality of the LED groups includes a first LED group; and the LEDs of the first LED group include a defective LED; forming a testing circuit on the substrate to electrically connect the LEDs; testing the first LED group by the testing circuit; recording a position of the defective LED; providing a carrier; and performing one of the following steps by the position of the defective LED: removing the defective LED from the substrate and then transferring the other LEDs in the first LED group to the carrier; transferring the other LEDs other than the defective LED in the first LED group to the carrier; or transferring the LEDs to the carrier and repairing it on the carrier.

公开(公告)号：US20210296536A1

公开(公告)日：2021-09-23

申请号：US17202001

申请日：2021-03-15

Applicant: EPISTAR CORPORATION

Inventor： Hsin-Ying WANG ,  Chao-Hsing CHEN ,  Chi-Ling LEE ,  Chen OU ,  Min-Hsun HSIEH

IPC: H01L33/38 ,  H01L33/42 ,  H01L25/13

Abstract: A semiconductor light-emitting device includes: a substrate; a semiconductor stack on the substrate including a first semiconductor contact layer including an upper surface; a light-emitting stack including an active layer on the upper surface; a second semiconductor contact layer on the light-emitting stack; and a recessed region including part of the upper surface; a transparent electrode on the second semiconductor contact layer; a protective layer on the substrate and the light-emitting stack; and a first and a second electrode pad on the substrate and electrically connected to the first semiconductor contact layer and the transparent electrode via first and second openings of the protective layer. A ratio of an area of the substrate to an area of the transparent electrode ranges from 2 to 100. A ratio of an operating current of the semiconductor light-emitting device to the area of the transparent electrode ranges from 10 mA/mm2 to 1000 mA/mm2.

公开(公告)号：US20170314127A1

公开(公告)日：2017-11-02

申请号：US15653166

申请日：2017-07-18

Applicant: Epistar Corporation

Inventor： Yuan-Hung HUANG ,  Chung-Kuei HUANG ,  Ai-Fa LEE ,  Shang-Po CHIEN ,  Meng-Tu CHIANG ,  Chi-Ling LEE ,  Ying-Chun CHUANG ,  Wen-Hsien LO

IPC: C23C16/458

CPC classification number: C23C16/4585

Abstract: A susceptor is provided. The susceptor comprises: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring, wherein the outer ring comprises multiple sub-elements separated from each other and detachably connected to the base part; wherein the inner ring and the outer ring separate the holders from one another, and the inner ring comprises multiple first extensions each protruding outwardly toward the outer ring, and each sub-element comprises a second extension extending inwardly toward the inner ring.

公开(公告)号：US20150345016A1

公开(公告)日：2015-12-03

申请号：US14790631

申请日：2015-07-02

Applicant: Epistar Corporation

Inventor： Yuan-Hung HUANG ,  Chung-Kuei HUANG ,  Ai-Fa LEE ,  Shang-Po CHIEN ,  Meng-Tu CHIANG ,  Chi-Ling LEE ,  Ying-Chun CHUANG ,  Wen-Hsien LO

IPC: C23C16/458

CPC classification number: C23C16/4585

Abstract: A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another.A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; a cover comprising a first surface facing the base part, and a second surface opposite to the first surface; a first positioning structure; a second positioning structure formed in the first surface; and a third positioning structure formed in the base part, wherein the cover connects to the base part by associating the first positioning structure with the second positioning structure and the third positioning structure.

Abstract translation: 一种感受器，包括：基部; 多个保持器分布在基部上以容纳晶片; 连接到基部的内圈; 以及外圈，其可拆卸地连接到所述基部并与所述内圈分离; 其中所述内环和所述外环将所述保持器彼此分开。 一种感受器，包括：基部; 多个保持器分布在基部上以容纳晶片; 包括面向所述基部的第一表面和与所述第一表面相对的第二表面的盖; 第一定位结构; 形成在所述第一表面中的第二定位结构; 以及形成在所述基部中的第三定位结构，其中所述盖通过将所述第一定位结构与所述第二定位结构和所述第三定位结构相关联而连接到所述基部。