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公开(公告)号：DE68923740D1
公开(公告)日：1995-09-14
申请号：DE68923740
申请日：1989-05-13
Applicant: IBM
Inventor： ANSCHEL MORRIS , SAMMAKIA BAHGAT GHALEB
IPC: H01L23/34 , H01L23/367 , H01L23/373 , H01L23/433 , H01L23/36 , H01L23/42
Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.
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公开(公告)号：CA1287929C
公开(公告)日：1991-08-20
申请号：CA601600
申请日：1989-06-02
Applicant: IBM
Inventor： ANSCHEL MORRIS , SAMMAKIA BAHGAT G
IPC: H01L23/34 , H01L23/367 , H01L23/373 , H01L23/433 , H01L23/36
Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrcme-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.
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公开(公告)号：FR2296462A1
公开(公告)日：1976-07-30
申请号：FR7537213
申请日：1975-12-01
Applicant: IBM
Inventor： ANSCHEL MORRIS , SHEAR STEPHEN A
IPC: H05K3/18 , C03C17/10 , C04B41/88 , C23C18/18 , C23C18/28 , C23C18/30 , B01J31/22 , B01J31/28 , C23C3/00
Abstract: A catalyst solution for making surfaces receptive to the deposition of adherent electroless metal layers includes a complex of a precious metal salt with dimethyl sulfoxide such as, for example, Pd Cl2 . 2(CH3)2 SO together with a group IV metal salt such as, for example, stannous chloride. A process for rendering surfaces, such as glass, receptive to adherent electroless metal layers using the catalyst solution is also provided.
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公开(公告)号：CA2120557A1
公开(公告)日：1994-12-12
申请号：CA2120557
申请日：1994-04-05
Applicant: IBM
Inventor： ANSCHEL MORRIS , INGRAHAM ANTHONY P , LAMB CHARLES R , LOWELL MICHAEL D , MARKOVICH VOYA R , MAYR WOLFGANG , MURPHY RICHARD G , PIERSON MARK V , POWERS TAMAR A , RENY TIMOTHY S , REYNOLDS SCOTT D , SAMMAKIA BAHGAT G , STORR WAYNE R
Abstract: METHOD AND APPARATUS FOR TESTING OF INTEGRATED CIRCUIT CHIPS A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.
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公开(公告)号：DE68906475D1
公开(公告)日：1993-06-17
申请号：DE68906475
申请日：1989-06-06
Applicant: IBM
Inventor： ANSCHEL MORRIS
Abstract: A metallic layer is coated onto a substrate by sputtering a layer of chromium followed by a layer of copper whereby the temperature of the substrate is at least about 320 DEG C.
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Patent Agency Ranking
公开(公告)号：DE68921849T2
公开(公告)日：1995-10-12
申请号：DE68921849
申请日：1989-10-28
Applicant: IBM
Inventor： ANSCHEL MORRIS , PAWLOWSKI WALTER PAUL
Abstract: Processes are provided for improving the surface properties of polyimide articles, especially of those polyimide articles which contain significant amounts of transimide. The surface of the polyimide is first treated with a base to convert the surface layer of both the polyimides and the transimides to the polyamic salt. Thereafter the surface layer of the converted polyamic salt is treated with an acid to convert the layer to a polyamic acid. This is followed by a cure preferably in infrared radiation at a sufficiently rapid rate to prevent the formation of any significant amounts of transimide and provide only polyimide. Following this treatment metallization is applied to the improved surface layer.
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公开(公告)号：DE68921849D1
公开(公告)日：1995-04-27
申请号：DE68921849
申请日：1989-10-28
Applicant: IBM
Inventor： ANSCHEL MORRIS , PAWLOWSKI WALTER PAUL
Abstract: Processes are provided for improving the surface properties of polyimide articles, especially of those polyimide articles which contain significant amounts of transimide. The surface of the polyimide is first treated with a base to convert the surface layer of both the polyimides and the transimides to the polyamic salt. Thereafter the surface layer of the converted polyamic salt is treated with an acid to convert the layer to a polyamic acid. This is followed by a cure preferably in infrared radiation at a sufficiently rapid rate to prevent the formation of any significant amounts of transimide and provide only polyimide. Following this treatment metallization is applied to the improved surface layer.
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公开(公告)号：DE68914033T2
公开(公告)日：1994-10-20
申请号：DE68914033
申请日：1989-05-13
Applicant: IBM
Inventor： ANSCHEL MORRIS
IPC: B32B15/088 , B32B15/08 , C23C14/02 , C23C14/06 , H01L21/312 , H01L21/48 , H01L23/498 , H05K1/03 , H05K3/38 , H01L23/48
Abstract: The article comprises a polyimide layer and a layer of a metal benzotriazole above said polyimide layer wherein said metal is selected from the group of copper, silver, and gold, and a layer of metal adjoining said metal benzotriazole layer. The method for forming such an article comprises the steps: providing a layer of a metal benzotriazole adjoining a polyamic acid layer that may be a layer of a polyimide substrate being converted to polyamic acid, wherein said metal is selected from the group of copper, silver and gold; providing a layer of metal adjoining said layer of metal benzotriazole and converting said polyamic acid to polyimide.
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公开(公告)号：DE68906475T2
公开(公告)日：1993-11-04
申请号：DE68906475
申请日：1989-06-06
Applicant: IBM
Inventor： ANSCHEL MORRIS
Abstract: A metallic layer is coated onto a substrate by sputtering a layer of chromium followed by a layer of copper whereby the temperature of the substrate is at least about 320 DEG C.
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公开(公告)号：DE3681697D1
公开(公告)日：1991-10-31
申请号：DE3681697
申请日：1986-11-25
Applicant: IBM
Inventor： ANSCHEL MORRIS , GOODRICH LAWRENCE DUANE , HETRICK BARTON MAITLAND
IPC: H01L21/30 , G03F7/30 , G03F7/32 , H01L21/027 , G03F7/26
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