公开(公告)号：CA2045227A1

公开(公告)日：1992-03-10

申请号：CA2045227

申请日：1991-06-21

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  BARBOSA JOSE A ,  DIBBLE ERIC P ,  FUNARI JOSEPH ,  KRESGE JOHN S ,  LAMB CHARLES R ,  MURPHY RICHARD G ,  REYNOLDS SCOTT D ,  SAMMAKIA BAHGAT G ,  SHOLTES TAMAR A ,  STORR WAYNE R JR

IPC: H01L23/36 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18

Abstract: HIGH MEMORY DENSITY PACKAGE Disclosed is a high density microelectronic circuit package. The circuit package includes a plurality of IC chips, as memory chips, on a circuitized flexible tape, which is, in turn, bonded to a printed circuit board. The circuitized flexible tape extends outwardly from the printed circuit board and has a plurality of IC chips mounted on I/O pads on the tape. The individual IC chips are in thermal contact with a heat sink means on the surfaces thereof opposite the circuitized flexible tape. The circuitized flexible tape and the heat sink are bonded to a printed circuit board.

公开(公告)号：HK1029660A1

公开(公告)日：2001-04-06

申请号：HK01100424

申请日：2001-01-16

Applicant: IBM

Inventor： DIBBLE ERIC P ,  JOHNSON ERIC A ,  PHILLIPS RAYMOND A JR

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/36 ,  H01L23/373 ,  H01L

Abstract: An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.

公开(公告)号：CA1263217A

公开(公告)日：1989-11-28

申请号：CA533596

申请日：1987-04-01

Applicant: IBM

Inventor： CUOMO JEROME J ,  DIBBLE ERIC P ,  LEVINE SOLOMON L

IPC: H01B1/06 ,  C23C14/06 ,  C23C14/34 ,  H01H1/023 ,  H01H11/04 ,  C23C14/14 ,  C22C29/02 ,  C22C29/16 ,  C23C14/16

Abstract: LOW CONTACT ELECTRICAL RESISTANT COMPOSITION SUBSTRATES COATED THEREWITH, AND PROCESS FOR PREPARING SUCH A composition of a metallic compound represented by the formula MT, and G is provided by sputtering an MxG100-x target. M is a metal selected from the group of titanium, hafnium, zirconium, and mixtures thereof. T is selected from the group of N, C, and mixtures thereof. G is a metal selected from the group of gold, platinum, and palladium. X is an integer from about 65 to about 95. Also provided are substrates coated with the composition and process for depositing the composition on substrates.