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    BALL GRID ARRAY PACKAGE WHERE STRESS IS ALLEVIATED
    1.
    发明专利
    BALL GRID ARRAY PACKAGE WHERE STRESS IS ALLEVIATED 失效

    公开(公告)号：JP2000294686A

    公开(公告)日：2000-10-20

    申请号：JP2000065422

    申请日：2000-03-09

    Applicant: IBM

    Inventor： JOHNSON ERIC A ,  KRESGE JOHN S

    IPC: H01L23/28 ,  H01L23/12 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To reduce strain induced by the heat of the solder ball of a ball grid array module attached to a circuit card by a vacant part substantially surrounding the second section of a dielectric layer, and a pad containing the step positioned above the second section. SOLUTION: A solder ball 48 is attached to a circuit card bad 54, and a BGA module 40 is connected to a circuit card 50. A circular vacant space 43 of height ΔH1 inside a board 42 surrounds board material under the GBA pad 44, and a circular vacant space 56 of height ΔH2 inside a board 52 surrounds board material under a circuit card pad 54. The transformation of heat-induced strain is dispersed to the height H+ΔH1+ΔH2, whereby the strain of the solder ball decreases. This protects the preservability of solder connection, and extends the fatigue life of the BGA module, and further it can be used together with other method with a slight additional cost.

    Method and structure for reducing strains in solder joints
    2.
    发明专利
    Method and structure for reducing strains in solder joints 未知

    公开(公告)号：GB2349014B

    公开(公告)日：2003-10-22

    申请号：GB0004103

    申请日：2000-02-23

    Applicant: IBM

    Inventor： JOHNSON ERIC A ,  KRESGE JOHN S

    IPC: H01L23/28 ,  H01L23/12 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H01L23/485

    Abstract: A method and structure for reducing thermally induced strains on the solder joints that couple a ball grid array (BGA) module to a circuit card, so as to improve the fatigue life of the BGA module. The thermally induced strains arise from a mismatch in thermal expansion coefficient between the dielectric substrate of the BGA module and the dielectric board of the circuit card. The method generates void annular regions around portions of the BGA dielectric substrate to which the BGA solder balls are to be attached and/or around portions of the circuit card dielectric material to which the BGA module is to be attached. This results in the formation of dielectric islands or peninsulas that bound the solder balls of the BGA module after installation on the circuit card. The dielectric islands or peninsulas thus formed serve to increase the effective height over which the differential expansion is accommodated, thereby reducing the strains throughout the solder joints. Additionally, the void annular regions provide space for the deformation of the dielectric islands or peninsulas, thereby increasing their compliance and transferring strain from the solder joints to the dielectric islands or peninsulas.

    STRESS RELIEVED CALL GRID ARRAY PACKAGE
    5.
    发明专利
    STRESS RELIEVED CALL GRID ARRAY PACKAGE 未知

    公开(公告)号：CA2291402C

    公开(公告)日：2004-11-16

    申请号：CA2291402

    申请日：1999-12-02

    Applicant: IBM

    Inventor： JOHNSON ERIC A ,  KRESGE JOHN S

    IPC: H01L23/28 ,  H01L23/12 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/22

    Abstract: A method and structure for reducing thermally induced strains on the solder joints that couple a ball grid array (BGA) module to a circuit card, so as to improve the fatig ue life of the BGA module. The thermally induced strains arise from a mismatch in thermal expansion coefficient between the dielectric substrate of the BGA module and the dielectric board of the circuit card. The method generates void annular regions around portions of the BGA dielectric substrate to which the BGA solder balls are to be attached and/or around portions of the circuit ca rd dielectric material to which the BGA module is to be attached. This results in the formation of dielectric islands or peninsulas that bound the solder balls of the BGA module after installation on the circuit card. The dielectric islands or peninsulas thus formed serve to increase the effective height over which the differential expansion is accommodated, thereby reducing the strains throughout the solder joints. Additionally, the void annular regions provide space for the deformation of the dielectric islands or peninsulas, thereby increasing their compliance and transferring strain from the solder joints to the dielectric islands or peninsulas.

    AN ELECTRICAL STRUCTURE AND A MANUFACTURING METHOD THEREOF
    7.
    发明专利
    AN ELECTRICAL STRUCTURE AND A MANUFACTURING METHOD THEREOF 未知

    公开(公告)号：HK1031041A1

    公开(公告)日：2001-05-25

    申请号：HK01101927

    申请日：2001-03-16

    Applicant: IBM

    Inventor： JOHNSON ERIC A ,  KRESGE JOHN S

    IPC: H01L23/28 ,  H01L23/12 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H01L

    Abstract: A method and structure for reducing thermally induced strains on the solder joints that couple a ball grid array (BGA) module to a circuit card, so as to improve the fatigue life of the BGA module. The thermally induced strains arise from a mismatch in thermal expansion coefficient between the dielectric substrate of the BGA module and the dielectric board of the circuit card. The method generates void annular regions around portions of the BGA dielectric substrate to which the BGA solder balls are to be attached and/or around portions of the circuit card dielectric material to which the BGA module is to be attached. This results in the formation of dielectric islands or peninsulas that bound the solder balls of the BGA module after installation on the circuit card. The dielectric islands or peninsulas thus formed serve to increase the effective height over which the differential expansion is accommodated, thereby reducing the strains throughout the solder joints. Additionally, the void annular regions provide space for the deformation of the dielectric islands or peninsulas, thereby increasing their compliance and transferring strain from the solder joints to the dielectric islands or peninsulas.

    STRESS RELIEVED BALL GRID ARRAY PACKAGE
    8.
    发明专利
    STRESS RELIEVED BALL GRID ARRAY PACKAGE 未知

    公开(公告)号：MY117209A

    公开(公告)日：2004-05-31

    申请号：MYPI20000780

    申请日：2000-02-29

    Applicant: IBM

    Inventor： JOHNSON ERIC A ,  KRESGE JOHN S

    IPC: H01L23/28 ,  H05K1/11 ,  H01L23/12 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K7/00

    Abstract: A METHOD AND STRUCTURE FOR REDUCING THERMALLY INDUCED STRAINS ON THE SOLDER JOINTS THAT COUPLE A BALL GRID ARRAY (BGA) MODULE TO A CIRCUIT CARD, SO AS 10 IMPROVE THE FATIGUE LIFE OF THE BGA MODULE. THE THERMALY INDUCED STRAINS ARISE FROM A MISMATCH IN THERMAL EXPANSION COEFFICIENT BETWEEN THE DIELECTRIC SUBSTRATE OF THE BGA MODULE AND THE DIELECTRIC BOARD OF THE CIRCUIT CARD. THE METHOD GENERATES VOID ANNULAR REGIONS AROUND PORTION OF THE BGA DIELECTRIC SUBSTRATE TO WHICH THE BGA SOLDER BALLS ARE TO BE ATTACHED AND/OR AROUND OF THE CIRCUIT CARD DIELECTRIC MATERIAL TO WHICH THE BGA MODULE IS TO BE ATTACHED. THIS RESULTS IN THE FORMATION OF DIELECTRIC ISLANDS OR PENINSULAS THAT BOUND THE SOLDER BALLS OF THE BGA MODULE AFTER INSTALLATION ON THE CIRCUIT CARD. THE DIELECTRIC ISLANDS OR PENINSULAS THUS FORMED SERVE TO INCREASE THE EFFECTIVE HEIGHT OVER WHICH THE DIFFERENTIAL EXPANSION IS ACCOMMODATED, THEREBY REDUCING THE STRAINS THOUGHOUT THE SOLDER JOINTS. ADDITIONALLY, THE VOID ANNULAR REGIONS PROVIDE SPACE FOR THE DEFORMATION OF THE DIELECTRIC ISLANDS OR PENINSULAS, THEREBY INCREASING THEIR COMPLIANCE AND TRANSFERRING STRAINS FROM THE SOLDER JOINTS TO THE DIELECTRIC ISLAND OR PENINSULAS.

    Improved integrated circuit structure.
    9.
    发明专利
    Improved integrated circuit structure. 未知

    公开(公告)号：HK1040569A1

    公开(公告)日：2002-06-14

    申请号：HK02101938

    申请日：2002-03-13

    Applicant: IBM

    Inventor： ALCOE DAVID J ,  DOWNES FRANCIS J JR ,  JONES GERALD W ,  KRESGE JOHN S ,  TYTRAN-PALOMAKI CHERYL L

    IPC: H01L23/498 ,  H05K3/46 ,  H01L ,  H05K

    Abstract: A semiconductor chip carrier having an increased chip connector and plated through hole density. In particular, a substrate having a plurality of plated through holes therein, and a fatigue resistant redistribution layer thereon. The redistribution layer includes a plurality of vias selectively positioned over and contacting the plated through holes. The substrate further including a ground plane, two pair of signal planes, and two pair of power planes, wherein the second pair of power planes are located directly underneath the external dielectric layer. A buried plated through hole within the substrate.

    STRESS RELIEVED CALL GRID ARRAY PACKAGE
    10.
    发明专利
    STRESS RELIEVED CALL GRID ARRAY PACKAGE 未知

    公开(公告)号：CA2291402A1

    公开(公告)日：2000-09-19

    申请号：CA2291402

    申请日：1999-12-02

    Applicant: IBM

    Inventor： JOHNSON ERIC A ,  KRESGE JOHN S

    IPC: H01L23/28 ,  H01L23/12 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/22

    Abstract: A method and structure for reducing thermally induced strains on the solder joints that couple a ball grid array (BGA) module to a circuit card, so as to improve the fatigue life of the BGA module. The thermally induced strains arise from a mismatch in thermal expansion coefficient between the dielectric substrate of the BGA module and the dielectric board of the circuit card. The method generates void annular regions around portions of the BGA dielectric substrate to which the BGA solder balls are to be attached and/or around portions of the circuit card dielectric material to which the BGA module is to be attached. This results in the formation of dielectric islands or peninsulas that bound the solder balls of the BGA module after installation on the circuit card. The dielectric islands or peninsulas thus formed serve to increase the effective height over which the differential expansion is accommodated, thereby reducing the strains throughout the solder joints. Additionally, the void annular regions provide space for the deformation of the dielectric islands or peninsulas, thereby increasing their compliance and transferring strain from the solder joints to the dielectric islands or peninsulas.

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