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公开(公告)号：DE3473969D1
公开(公告)日：1988-10-13
申请号：DE3473969
申请日：1984-11-23
Applicant: IBM
Inventor： ANDERSON JR , ARAPS CONSTANCE JOAN , LOTSKO CATHERINE AGNES
IPC: H01L21/3205 , H01L21/027 , H01L21/306 , H01L21/3105 , H01L21/00 , G03F7/02 , H01L21/312 , H01L21/31
Abstract: A process for forming a desired metal pattern on a substrate which comprises forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating to depolymerize the thermally depolymerizable polymer, and removing the thermally depolymerizable polymer and metal thereover in a mild solvent at moderate temperatures leaving the metal having the desired pattern on the substrate.
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公开(公告)号：DE3851647T2
公开(公告)日：1995-04-06
申请号：DE3851647
申请日：1988-02-19
Applicant: IBM
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公开(公告)号：DE3473689D1
公开(公告)日：1988-09-29
申请号：DE3473689
申请日：1984-06-28
Applicant: IBM
IPC: H01L21/28 , C23C14/04 , G03F7/039 , G03F7/36 , H01L21/302 , H01L21/3065 , H01L21/312 , H01L21/00 , G03F7/02
Abstract: The process for forming a desired metal pattern on a substrate (35) comprises forming a mask of a thermally depolymerizable polymer (40) on the substrate (35) with a pattern of openings (70) complementary to the desired metal pattern, blanket coating the substrate (35) and the mask (40) with a metal (60), heating the substrate (35) to depolymerize the depolymerizable polymer (40), cooling the surface of the metal (60) to thereby delaminate the metal coated in areas where thermally depolymerizable polymer (40) is present, removing the delaminated metal where necessary, and optionally plasma etching the depolymerized polymer, if residue thereof remains, to remove the same from said substrate.
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公开(公告)号：DE3851647D1
公开(公告)日：1994-11-03
申请号：DE3851647
申请日：1988-02-19
Applicant: IBM
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