公开(公告)号：BR8701784A

公开(公告)日：1988-02-09

申请号：BR8701784

申请日：1987-04-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  DIVAKARUNI RENUKA SHASTRI ,  DYNYS JOSEPH MICHAEL ,  KANDEZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  MASTER RAJ N ,  CASEY JON ALFRED

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28 ,  B32B31/24 ,  B32B18/00

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：DE68908470T2

公开(公告)日：1994-03-17

申请号：DE68908470

申请日：1989-03-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  BOOTH RICHARD BENTON ,  DAVID LAWRENCE DANIEL ,  NEISSER MARK OLIVER ,  SACHDEV HARBANS SINGH ,  TAKACS MARK ANTHONY

IPC: H01L23/373 ,  C09K5/08 ,  F28F13/00 ,  C09K5/00

公开(公告)号：DE3473689D1

公开(公告)日：1988-09-29

申请号：DE3473689

申请日：1984-06-28

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  ARAPS CONSTANCE JOAN ,  LOTSKO CATHERINE AGNES

IPC: H01L21/28 ,  C23C14/04 ,  G03F7/039 ,  G03F7/36 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/312 ,  H01L21/00 ,  G03F7/02

Abstract: The process for forming a desired metal pattern on a substrate (35) comprises forming a mask of a thermally depolymerizable polymer (40) on the substrate (35) with a pattern of openings (70) complementary to the desired metal pattern, blanket coating the substrate (35) and the mask (40) with a metal (60), heating the substrate (35) to depolymerize the depolymerizable polymer (40), cooling the surface of the metal (60) to thereby delaminate the metal coated in areas where thermally depolymerizable polymer (40) is present, removing the delaminated metal where necessary, and optionally plasma etching the depolymerized polymer, if residue thereof remains, to remove the same from said substrate.

公开(公告)号：DE68908470D1

公开(公告)日：1993-09-23

申请号：DE68908470

申请日：1989-03-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  BOOTH RICHARD BENTON ,  DAVID LAWRENCE DANIEL ,  NEISSER MARK OLIVER ,  SACHDEV HARBANS SINGH ,  TAKACS MARK ANTHONY

IPC: H01L23/373 ,  C09K5/08 ,  F28F13/00 ,  C09K5/00