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公开(公告)号：DE3485758D1
公开(公告)日：1992-07-09
申请号：DE3485758
申请日：1984-10-19
Applicant: IBM DEUTSCHLAND
Inventor： ARAPS CONSTANCE JOAN , KANDETZKE STEVEN MICHAEL , TAKACS MARK ANTHONY
IPC: H01L23/29 , C08F290/00 , C08F299/02 , C08G73/10 , H01L21/312 , H01L23/31
Abstract: Thin dielectric films are formed on an electronic component by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. An electronic component comprising the cured product is also disclosed.
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公开(公告)号：DE3750684D1
公开(公告)日：1994-12-01
申请号：DE3750684
申请日：1987-03-10
Applicant: IBM
Inventor： ANDERSON HERBERT , DIVAKARUNI RENUKA SHASTRI , DYNYS JOSEPH MICHAEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , MASTER RAJ NAVINCHANDRA , CASEY JON ALFRED
Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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公开(公告)号：DE3851647T2
公开(公告)日：1995-04-06
申请号：DE3851647
申请日：1988-02-19
Applicant: IBM
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公开(公告)号：ES2062972T3
公开(公告)日：1995-01-01
申请号：ES87103375
申请日：1987-03-10
Applicant: IBM
Inventor： ANDERSON HERBERT RUDOLF JR , DIVAKARUNI RENUKA SHASTRI , DYNYS JOSEPH MICHAEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , MASTER RAJ NAVINCHANDRA , CASEY JON ALFRED
Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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公开(公告)号：DE3485828D1
公开(公告)日：1992-08-27
申请号：DE3485828
申请日：1984-10-19
Applicant: IBM
Inventor： ARAPS CONSTANCE JOAN , KANDETZKE STEVEN MICHAEL , TAKACS MARK ANTHONY
IPC: C08F299/00 , C08F290/00 , C08F299/02 , C08G73/00 , C08G73/10 , G11C11/416 , H01B3/30 , H01L21/312 , H01L21/76 , H01L21/762 , H01L23/532 , H03F3/45 , H05K1/00 , H05K1/03 , H05K3/46 , H01L23/52
Abstract: Electronic components are disclosed comprising an insulator which is the in situ cured reaction product of a polymerizable oligomer which is end capped with a vinyl and/or acetylenic end groups. A process for forming the same is also disclosed.
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Patent Agency Ranking
公开(公告)号：DE68923717T2
公开(公告)日：1996-04-18
申请号：DE68923717
申请日：1989-02-28
Applicant: IBM
Inventor： BAISE ARNOLD IVAN , CASEY JON ALFRED , CLARKE DAVID RICHARD , DIVAKARUNI RENUKA SHASTRI , DUNKEL WERNER ERNEST , HUMENIK JAMES NOEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , KNICKERBOCKER JOHN ULRICH , MATTS AMY TRESTMAN , TAKACS MARK ANTHONY , WIGGINS LOVELL BERRY
IPC: H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , H01L23/15 , H01L23/52
Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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公开(公告)号：DE68923717D1
公开(公告)日：1995-09-14
申请号：DE68923717
申请日：1989-02-28
Applicant: IBM
Inventor： BAISE ARNOLD IVAN , CASEY JON ALFRED , CLARKE DAVID RICHARD , DIVAKARUNI RENUKA SHASTRI , DUNKEL WERNER ERNEST , HUMENIK JAMES NOEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , KNICKERBOCKER JOHN ULRICH , MATTS AMY TRESTMAN , TAKACS MARK ANTHONY , WIGGINS LOVELL BERRY
IPC: H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , H01L23/15 , H01L23/52
Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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公开(公告)号：DE3750684T2
公开(公告)日：1995-05-18
申请号：DE3750684
申请日：1987-03-10
Applicant: IBM
Inventor： ANDERSON HERBERT , DIVAKARUNI RENUKA SHASTRI , DYNYS JOSEPH MICHAEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , MASTER RAJ NAVINCHANDRA , CASEY JON ALFRED
Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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公开(公告)号：DE3851647D1
公开(公告)日：1994-11-03
申请号：DE3851647
申请日：1988-02-19
Applicant: IBM
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公开(公告)号：DE3485828T2
公开(公告)日：1993-03-11
申请号：DE3485828
申请日：1984-10-19
Applicant: IBM
Inventor： ARAPS CONSTANCE JOAN , KANDETZKE STEVEN MICHAEL , TAKACS MARK ANTHONY
IPC: C08F299/00 , C08F290/00 , C08F299/02 , C08G73/00 , C08G73/10 , G11C11/416 , H01B3/30 , H01L21/312 , H01L21/76 , H01L21/762 , H01L23/532 , H03F3/45 , H05K1/00 , H05K1/03 , H05K3/46 , H01L23/52
Abstract: Electronic components are disclosed comprising an insulator which is the in situ cured reaction product of a polymerizable oligomer which is end capped with a vinyl and/or acetylenic end groups. A process for forming the same is also disclosed.
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