公开(公告)号：DE3778741D1

公开(公告)日：1992-06-11

申请号：DE3778741

申请日：1987-01-09

Applicant: IBM

Inventor： ANDERSON JR ,  ARAPS CONSTANCE JOAN ,  DIVAKARUNI RENUKA SHASTRI ,  SACHDEV KRISHNA GANDHI ,  ZALAR STOYAN MATHIAS ,  KIRBY DANIEL PATRICK ,  WOLFFNUFER ROBERT ,  SACHDEV HARBANS SINGH ,  SURYANARAYANA DARBHA

IPC: C03C10/00 ,  C04B35/622 ,  C04B35/628 ,  C04B35/63 ,  C04B35/632 ,  C04B35/634 ,  H01L21/48 ,  H05K1/03 ,  C04B35/00 ,  H05K3/46

Abstract: Prepn. comprises (a) forming a finely divided cpd. that includes particles of ceramic particles, (b) coating the particles with a heat decomposable surface modification organo cpd. (I) selected from organo silanes, organo silazanes, titanium chelates and titanium esters, (c) combining and mixing the coated particles of finely divided cpd. with an organic resin binder and solvent for the binder to form a slurry, (d) shaping the slurry to form the desired element, heating the element to remove the coating, the binder and the solvent and (e) continuing the heating to fuse the particles of finely divided cpd.

公开(公告)号：DE3473969D1

公开(公告)日：1988-10-13

申请号：DE3473969

申请日：1984-11-23

Applicant: IBM

Inventor： ANDERSON JR ,  ARAPS CONSTANCE JOAN ,  LOTSKO CATHERINE AGNES

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/00 ,  G03F7/02 ,  H01L21/312 ,  H01L21/31

Abstract: A process for forming a desired metal pattern on a substrate which comprises forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating to depolymerize the thermally depolymerizable polymer, and removing the thermally depolymerizable polymer and metal thereover in a mild solvent at moderate temperatures leaving the metal having the desired pattern on the substrate.