公开(公告)号：JPH1133903A

公开(公告)日：1999-02-09

申请号：JP16029698

申请日：1998-06-09

Applicant: IBM

Inventor： MATTHEW KIRKPATRICK MILLER ,  CLIFFORD OWEN MORGAN ,  MATTHEW JEREMY RUTT ,  ERIC G WALTON ,  TERENCE MONTE WRIGHT

IPC: B24B37/24 ,  B24D3/34 ,  B24D13/12 ,  B24D13/14 ,  H01L21/304 ,  B24B37/04

Abstract: PROBLEM TO BE SOLVED: To supply a special fluid phase chemical to a surface of a board by controllably discharging the capsuled material freely between a chemical and a mechanical polishing processes through the operation of process parameter such as an applying force. SOLUTION: Plural types of capsuled chemical are assembled in a polishing medium such as a polishing pad 63. As plural micro capsuled chemical, a reactive agent micro capsule A, a surface active micro capsule B, a buffer micro capsule C is used. These micro capsules A, B, C are broken at the time of use of them in a polishing process, and an appropriate quantity of a desirable chemical is directly supplied to a surface of a board to be polished or a wafer. Discharge of the content of the micro capsules A, B, C is controlled by the operation of a polishing parameter. The polishing parameter includes an appropriate value of downward force, friction coefficient, platen rotating speed, and wafer and carrier rotating speed for a specified chemical and mechanical polishing process.

公开(公告)号：JPH10296618A

公开(公告)日：1998-11-10

申请号：JP10900898

申请日：1998-04-20

Applicant: IBM

Inventor： MATTHEW KIRKPATRICK MILLER ,  MATTHEW JEREMY RUTON ,  WRIGHT TERRANCE M

IPC: B24B37/10 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a machine and method to chemically and mechanically polish(CMP) semiconductor wafers. SOLUTION: At least one polishing device is provided with a polishing pad polishing face, which can be rotated and is perpendicularly oriented, and a slurry supply mechanism 20. A semiconductor wafer is provided so that it is received by a wafer carrier 40 from a holder/cassette and can be held contacting the polishing area 2 of the polishing pad in parallel with each other. A conditioning module 30 securing a spring 31 can be provided in the area next to the polishing area 2 to clean/condition the polishing pad. In this case, slurry drops through an exit 26 from a slurry conduit 24 and uniformly expanded by a squeeze 22. In such constitution. The floor space for machine installation is substantially reduced, as a result, the prevention of sticking of pollutants to the polishing machine can be promoted.