Abstract:
It is possible to realize a DRAM of a simple circuit structure capable of effectively reducing the refresh current by setting the refresh cycle by a small step. A memory array is divided into 64 sub-arrays, each of which is further divided into eight blocks. A refresh cycle control circuit (RCCC) includes: a fuse circuit (FC0) for setting 1 or 1/2 division ratio; a divider (FD0) for dividing a pre-decode signal(ZLI0) with the division ratio which has been set; fuse circuits (FC1 to FC8) for setting 1 or 1/4 division ratio; and dividers (FD1 to FD8) for dividing pre-decode signals (ZLI1 to ZLI8) with the set division ratio. The refresh cycle control circuit (RCCC) can set the 64 or 128 ms refresh cycle for the 64 sub-arrays and the 64 or 256 ms refresh cycle for the 512 blocks.
Abstract:
An MRAM memory cell structure for preventing a parasitic transistor from generating. A diode is used as an MRAM memory cell switching element to form an n-type semiconductor layer (25) and a p-type semiconductor layer (29) that constitute a diode on the surface semiconductor layer of an SOI substrate. The n-type semiconductor layer (25) and the p-type semiconductor layer (29) are disposed in a lateral direction and separated by an isolation region (5) for electrically isolating from other elements or the substrate.
Abstract:
PROBLEM TO BE SOLVED: To solve such a problem that because a current is required to make to flow for each bit line when data are written simultaneously in a plurality of data bits belonging to the same column address, a current required for write-in is enlarged. SOLUTION: This device comprises a plurality of pairs of bit line comprising a first bit line and a second bit line, a plurality of storage cells storing information in accordance with the direction of a current flowing in the pair of bit line, at least one current driving source connected to at least one of pairs of bit line and making to flow a current in the first bit line and the second bit line of which the directions of current are reverse each other, at least one switch circuit connecting pairs of bit line and pairs of bit line, and a control circuit controlling a connection state of the switch circuit in accordance with information stored in the storage cell. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a nonvolatile magnetic memory cell having a multilayer structure and a storage circuit block using the same. SOLUTION: A nonvolatile magnetic memory cell 40 is constituted to include a second bit line 38b, a second storage device 10b which is connected to the second bit line 38b and includes a ferroelectric layer of which magnetization direction is changed by a direction of a magnetic field generated by an electric current that flows in the second bit line 38b, a second switching device 30b of which one end is connected to a third wiring structure 24, and a second wiring structure 22b which sandwiches the second storage device 10b with the second bit line 38b and allows the second storage device 10b and the other end of the second switching device 30b to connect to each other.
Abstract:
PURPOSE: To realize memory access in the page mode of a single clock memory. CONSTITUTION: A control signal PAGE which is set to one level to indicate the normal mode and is set to the other to indicate the page mode is given to a single clock memory 10 from the outside. In a mode state discrimination circuit 14, the combination of levels of the control signal in two continuous address input cycles is decoded to discriminate four mode states of the normal mode, the page-in mode, the page mode, and the page-out mode. A memory control circuit part 18 of a memory array 16 is controlled based on the discrimination result.
Abstract:
An MRAM memory cell structure for preventing a parasitic transistor from generating. A diode is used as an MRAM memory cell switching element to form an n-type semiconductor layer (25) and a p-type semiconductor layer (29) tha t constitute a diode on the surface semiconductor layer of an SOI substrate. T he n-type semiconductor layer (25) and the p-type semiconductor layer (29) are disposed in a lateral direction and separated by an isolation region (5) for electrically isolating from other elements or the substrate.
Abstract:
Provided is an MRAM memory cell structure capable of preventing generation o f parasitic transistors. Diodes are adopted as switching elements of an MRAM memory cell. An n-type semiconductor layer and a p-type semiconductor layer, which collectively constitute a diod e, are formed on a surface semiconductor layer of an SOI substrate. The n-type semiconductor layer and the p-type semiconductor layer are disposed in a lateral direction and isolated by an isolation region, whereby the diode is isolated electrically from other elements and from the substrat e.
Abstract:
PROBLEM TO BE SOLVED: To provide a pseudo SRAM in which request of external access and request of refresh can be mediated. SOLUTION: The semiconductor memory device is provided with an access standby circuit 20 generating an access standby signal/ECP in accordance with an external access request signal/CE or the like, an access start circuit 21 generating an access start signal/AE in accordance with an L level of the access standby signal/ECP and an H level of a busy signal/BUSY, a refresh standby circuit 22 generating a refresh standby signal/REFP in accordance with a refresh request signal/REFT, and a refresh start circuit 23 generating a refresh start signal/REFE in accordance with an H level of the access standby signal/ECP, an L level of the refresh standby signal/REFP, and an H level of the busy signal/BUSY. An array control circuit 12 performs access operation in accordance with an access start signal/AE, and performs refresh operation in accordance with the refresh start signal/REFE. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a memory cell capable of reducing a writing current, to provide a storage circuit block, and to provide a method for writing data. SOLUTION: Related to a memory cell 12, a second bit line 15 is provided at the position where a storage element 28 is clamped with a bit line 14. The second bit line 15 is at least parallel to the first bit line 14 near the storage element 28, while not contacting to the storage element 28. COPYRIGHT: (C)2003,JPO