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公开(公告)号：DE68920405D1
公开(公告)日：1995-02-16
申请号：DE68920405
申请日：1989-08-01
Applicant: IBM
Inventor： CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , MURPHY PHILIP , PALMER MICHAEL JON
Abstract: Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.
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公开(公告)号：DE69300229D1
公开(公告)日：1995-08-10
申请号：DE69300229
申请日：1993-02-08
Applicant: IBM
Inventor： HERNANDEZ BERNARDO , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON , RITTER MARK B
Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.
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公开(公告)号：DE69102022T2
公开(公告)日：1994-11-17
申请号：DE69102022
申请日：1991-05-24
Applicant: IBM
Inventor： CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , LANZETTA ALPHONSO PHILLIP , PALMER MICHAEL JON , RITTER MARK B
Abstract: A hitch feeder for a TAB tape is described which comprises: a stationary jaw assembly (12) having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly (10) which includes a lower movable gripper positioned below the tape (22) and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly. A feed control is operative when the movable gripping assembly moves towards the stationary jaw assembly, to move the gripper jaws to grip the tape and to open the opposing jaws, and is further operative when the movable gripper assembly moves away from the stationary jaw assembly, to move the gripper jaws away from the tape and to close the opposing jaws.
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公开(公告)号：DE69300229T2
公开(公告)日：1996-02-29
申请号：DE69300229
申请日：1993-02-08
Applicant: IBM
Inventor： HERNANDEZ BERNARDO , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON , RITTER MARK B
Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.
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公开(公告)号：DE69103436T2
公开(公告)日：1995-03-30
申请号：DE69103436
申请日：1991-01-22
Applicant: IBM
Inventor： BERNARDO HERNANDEZ , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON
Abstract: A high efficiency thermal interposer (150) comprising a first hollow disk (160) and second hollow disk (161), held together by thermally isolating fasteners (162, 163). The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (185) (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means (135) for introducing cold jets of air into the cavity containing the particles, means for circulating (169) the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
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Patent Agency Ranking
公开(公告)号：DE69102022D1
公开(公告)日：1994-06-23
申请号：DE69102022
申请日：1991-05-24
Applicant: IBM
Inventor： CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , LANZETTA ALPHONSO PHILLIP , PALMER MICHAEL JON , RITTER MARK B
Abstract: A hitch feeder for a TAB tape is described which comprises: a stationary jaw assembly (12) having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly (10) which includes a lower movable gripper positioned below the tape (22) and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly. A feed control is operative when the movable gripping assembly moves towards the stationary jaw assembly, to move the gripper jaws to grip the tape and to open the opposing jaws, and is further operative when the movable gripper assembly moves away from the stationary jaw assembly, to move the gripper jaws away from the tape and to close the opposing jaws.
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公开(公告)号：DE68920405T2
公开(公告)日：1995-07-13
申请号：DE68920405
申请日：1989-08-01
Applicant: IBM
Inventor： CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , MURPHY PHILIP , PALMER MICHAEL JON
Abstract: Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.
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公开(公告)号：DE69013643T2
公开(公告)日：1995-05-04
申请号：DE69013643
申请日：1990-08-03
Applicant: IBM
IPC: H05K7/20 , H01L23/538 , H01L25/00 , H01L25/065
Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.
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公开(公告)号：DE69013643D1
公开(公告)日：1994-12-01
申请号：DE69013643
申请日：1990-08-03
Applicant: IBM
IPC: H05K7/20 , H01L23/538 , H01L25/00 , H01L25/065
Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.
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公开(公告)号：DE69103436D1
公开(公告)日：1994-09-22
申请号：DE69103436
申请日：1991-01-22
Applicant: IBM
Inventor： BERNARDO HERNANDEZ , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON
Abstract: A high efficiency thermal interposer (150) comprising a first hollow disk (160) and second hollow disk (161), held together by thermally isolating fasteners (162, 163). The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (185) (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means (135) for introducing cold jets of air into the cavity containing the particles, means for circulating (169) the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
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