公开(公告)号：DE69013643T2

公开(公告)日：1995-05-04

申请号：DE69013643

申请日：1990-08-03

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.

公开(公告)号：DE69013643D1

公开(公告)日：1994-12-01

申请号：DE69013643

申请日：1990-08-03

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.

公开(公告)号：DE69015878T2

公开(公告)日：1995-07-13

申请号：DE69015878

申请日：1990-03-21

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  BUCHWALTER STEPHEN LESLIE ,  HERMANN KARL ,  KOVAC CAROLINE ANN ,  POORE PAIGE ADAMS ,  VIEHBECK ALFRED

IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/00

Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

公开(公告)号：DE68920944D1

公开(公告)日：1995-03-16

申请号：DE68920944

申请日：1989-08-24

Applicant: IBM

Inventor： BICKFORD HARRY RANDALL ,  BREGMAN MARK FIELDING ,  CIPOLLA THOMAS MARIO ,  GOW JOHN ,  LEDERMANN PETER GERARD ,  MIERSCH EKKEHARD FRITZ ,  OLSON LEONARD THEODORE ,  PAGNINI DAVID PETER ,  REILEY TIMOTHY CLARK ,  TSOU UH-PO ERIC ,  VILKELIS WALTER VALERIAN

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/64

公开(公告)号：DE68920944T2

公开(公告)日：1995-08-10

申请号：DE68920944

申请日：1989-08-24

Applicant: IBM

Inventor： BICKFORD HARRY RANDALL ,  BREGMAN MARK FIELDING ,  CIPOLLA THOMAS MARIO ,  GOW JOHN ,  LEDERMANN PETER GERARD ,  MIERSCH EKKEHARD FRITZ ,  OLSON LEONARD THEODORE ,  PAGNINI DAVID PETER ,  REILEY TIMOTHY CLARK ,  TSOU UH-PO ERIC ,  VILKELIS WALTER VALERIAN

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/64

公开(公告)号：DE69015878D1

公开(公告)日：1995-02-23

申请号：DE69015878

申请日：1990-03-21

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  BUCHWALTER STEPHEN LESLIE ,  HERMANN KARL ,  KOVAC CAROLINE ANN ,  POORE PAIGE ADAMS ,  VIEHBECK ALFRED

IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/00

Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.