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公开(公告)号：DE69332196D1
公开(公告)日：2002-09-19
申请号：DE69332196
申请日：1993-03-22
Applicant: IBM
Inventor： FERENCE THOMAS GEORGE , GRUBER PETER ALFRED , HERNANDEZ BERNARDO , PALMER MICHAEL JOHN , ZINGHER ARTHUR RICHARD
Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir (46) for molten solder which is disposed over a cavity in an injection plate (34). The injection plate is disposed over a mold (32) having an array of cavities therein into which solder is injection molded. The mold is disposed over a workpiece (50), such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity (68) in the injection plate (34) disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate (34) is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.
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公开(公告)号：DE69332196T2
公开(公告)日：2003-05-15
申请号：DE69332196
申请日：1993-03-22
Applicant: IBM
Inventor： FERENCE THOMAS GEORGE , GRUBER PETER ALFRED , HERNANDEZ BERNARDO , PALMER MICHAEL JOHN , ZINGHER ARTHUR RICHARD
Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir (46) for molten solder which is disposed over a cavity in an injection plate (34). The injection plate is disposed over a mold (32) having an array of cavities therein into which solder is injection molded. The mold is disposed over a workpiece (50), such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity (68) in the injection plate (34) disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate (34) is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.
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公开(公告)号：DE69300229D1
公开(公告)日：1995-08-10
申请号：DE69300229
申请日：1993-02-08
Applicant: IBM
Inventor： HERNANDEZ BERNARDO , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON , RITTER MARK B
Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.
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公开(公告)号：DE69300229T2
公开(公告)日：1996-02-29
申请号：DE69300229
申请日：1993-02-08
Applicant: IBM
Inventor： HERNANDEZ BERNARDO , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON , RITTER MARK B
Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.
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