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公开(公告)号:DE68916523T2
公开(公告)日:1995-02-02
申请号:DE68916523
申请日:1989-11-17
Applicant: IBM
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公开(公告)号:DE68907324T2
公开(公告)日:1994-01-20
申请号:DE68907324
申请日:1989-11-14
Applicant: IBM
Inventor: GLENNING JOHN J , JOHNSON CARYN J , PAWLOWSKI WALTER P , SAKORAFOS KENNETH G
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公开(公告)号:DE68916523D1
公开(公告)日:1994-08-04
申请号:DE68916523
申请日:1989-11-17
Applicant: IBM
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公开(公告)号:CA1335340C
公开(公告)日:1995-04-25
申请号:CA605524
申请日:1989-07-13
Applicant: IBM
Inventor: VIEHBECK ALFRED , BUCHWALTER STEPHEN L , DONSON WILLIAM A , GLENNING JOHN J , GOLDBERG MARTIN J , GREBE KURT R , KOVAC CAROLINE A , MATTHEW LINDA C , PAWLOWSKI WALTER P , SCHADT MARK J , SCHEUERMANN MICHAEL R , TISDALE STEPHEN L
IPC: C23C18/20 , C08J5/12 , C08J7/00 , C23C18/16 , C23C18/28 , H05K3/38 , B32B31/12 , C08J7/14 , C25D5/56
Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.
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5.
公开(公告)号:CA1330020C
公开(公告)日:1994-06-07
申请号:CA607389
申请日:1989-08-02
Applicant: IBM
Inventor: ANSCHEL MORRIS , PAWLOWSKI WALTER P
Abstract: A process is provided for improving the surface properties of polyimide articles which contain significant amounts of transimide. The surface of the polyimide containing the transimide is first treated with a base to convert the surface layer of both the polyimides and the transimides to the polyamic salt. Thereafter the surface layer of the converted polyamic salt is treated with an acid to convert the layer to a polyamic acid. This is followed by a cure preferably in infrared radiation at a sufficiently rapid rate to prevent the formation of any significant amounts of transimide and provide only polyimide. Following this treatment metallization is applied to the improved surface layer.
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公开(公告)号:DE68907324D1
公开(公告)日:1993-07-29
申请号:DE68907324
申请日:1989-11-14
Applicant: IBM
Inventor: GLENNING JOHN J , JOHNSON CARYN J , PAWLOWSKI WALTER P , SAKORAFOS KENNETH G
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