公开(公告)号：DE68916523T2

公开(公告)日：1995-02-02

申请号：DE68916523

申请日：1989-11-17

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：DE69116015T2

公开(公告)日：1996-07-04

申请号：DE69116015

申请日：1991-06-26

Applicant: IBM

Inventor： BARD STEVEN L ,  CHRISTENSEN DAVID N ,  GLENNING JOHN J ,  NICOLETTI JAMES A ,  URDANICK MARK W

IPC: B05C3/12 ,  B08B3/04 ,  C23F1/08 ,  H05K3/06 ,  H05K13/00 ,  B05C3/00 ,  B05C3/15

Abstract: A device (10) for applying fluid (e.g., etchant) to a substrate (19) (e.g., thin metallic tape) wherein the device (19) includes a head member (11) having means (13) therein for directing a first fluid (15) (e.g, etchant) at an established first pressure against the substrate (19) and means (23) for directing a second fluid (25) (e.g., air) at an established second pressure equal to or greater than the first pressure (at the location of fluid intersection) and against the substrate (19) in the area proximate the first fluid so as to substantially contain and limit the first fluid (15) to impingement substantially only at the location against which the first fluid (15) is designed to strike. Preferably, two opposing head members (11, 11') are utilized, and these may serve to maintain the substrate (19) therebetween in a suspended state. Both head members (11, 11') are movable relative to each other during fluid application. As stated, the device is particularly suited to function as an etcher, but may also serve other purposes (e.g., coating, cleaning, rinsing, etc.).

公开(公告)号：DE68907324T2

公开(公告)日：1994-01-20

申请号：DE68907324

申请日：1989-11-14

Applicant: IBM

Inventor： GLENNING JOHN J ,  JOHNSON CARYN J ,  PAWLOWSKI WALTER P ,  SAKORAFOS KENNETH G

IPC: G02F1/1337 ,  C08J7/12 ,  C08J7/14 ,  C09K13/02 ,  C09K13/04 ,  G03F7/32 ,  H01L21/311 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L21/90

公开(公告)号：DE69116015D1

公开(公告)日：1996-02-15

申请号：DE69116015

申请日：1991-06-26

Applicant: IBM

Inventor： BARD STEVEN L ,  CHRISTENSEN DAVID N ,  GLENNING JOHN J ,  NICOLETTI JAMES A ,  URDANICK MARK W

IPC: B05C3/12 ,  B08B3/04 ,  C23F1/08 ,  H05K3/06 ,  H05K13/00 ,  B05C3/00 ,  B05C3/15

Abstract: A device (10) for applying fluid (e.g., etchant) to a substrate (19) (e.g., thin metallic tape) wherein the device (19) includes a head member (11) having means (13) therein for directing a first fluid (15) (e.g, etchant) at an established first pressure against the substrate (19) and means (23) for directing a second fluid (25) (e.g., air) at an established second pressure equal to or greater than the first pressure (at the location of fluid intersection) and against the substrate (19) in the area proximate the first fluid so as to substantially contain and limit the first fluid (15) to impingement substantially only at the location against which the first fluid (15) is designed to strike. Preferably, two opposing head members (11, 11') are utilized, and these may serve to maintain the substrate (19) therebetween in a suspended state. Both head members (11, 11') are movable relative to each other during fluid application. As stated, the device is particularly suited to function as an etcher, but may also serve other purposes (e.g., coating, cleaning, rinsing, etc.).

公开(公告)号：DE68916523D1

公开(公告)日：1994-08-04

申请号：DE68916523

申请日：1989-11-17

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：CA1335340C

公开(公告)日：1995-04-25

申请号：CA605524

申请日：1989-07-13

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  B32B31/12 ,  C08J7/14 ,  C25D5/56

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

公开(公告)号：DE68907324D1

公开(公告)日：1993-07-29

申请号：DE68907324

申请日：1989-11-14

Applicant: IBM

Inventor： GLENNING JOHN J ,  JOHNSON CARYN J ,  PAWLOWSKI WALTER P ,  SAKORAFOS KENNETH G

IPC: G02F1/1337 ,  C08J7/12 ,  C08J7/14 ,  C09K13/02 ,  C09K13/04 ,  G03F7/32 ,  H01L21/311 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L21/90