公开(公告)号：DE68916523T2

公开(公告)日：1995-02-02

申请号：DE68916523

申请日：1989-11-17

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：DE3869884D1

公开(公告)日：1992-05-14

申请号：DE3869884

申请日：1988-08-16

Applicant: IBM

Inventor： LIUTKUS JOHN J ,  KOVAC CAROLINE A

IPC: C04B16/04 ,  C04B24/40 ,  C04B28/10 ,  H01L23/15 ,  H05K1/03 ,  C04B28/06 ,  H01L23/14

Abstract: A cement composition containing cement, water, and a silanol terminated polysiloxane, and cured products thereof exhibiting improved thermal stability and dielectric constant used as substrates for integrated circuit sub-assemblies.

公开(公告)号：DE69118442D1

公开(公告)日：1996-05-09

申请号：DE69118442

申请日：1991-05-15

Applicant: IBM

Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

公开(公告)号：DE68919007T2

公开(公告)日：1995-05-04

申请号：DE68919007

申请日：1989-05-26

Applicant: IBM

Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：DE68919007D1

公开(公告)日：1994-12-01

申请号：DE68919007

申请日：1989-05-26

Applicant: IBM

Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：DE68916523D1

公开(公告)日：1994-08-04

申请号：DE68916523

申请日：1989-11-17

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：DE69118442T2

公开(公告)日：1996-10-10

申请号：DE69118442

申请日：1991-05-15

Applicant: IBM

Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

公开(公告)号：CA1335340C

公开(公告)日：1995-04-25

申请号：CA605524

申请日：1989-07-13

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  B32B31/12 ,  C08J7/14 ,  C25D5/56

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.