公开(公告)号：WO2004043850A3

公开(公告)日：2005-03-24

申请号：PCT/GB0304829

申请日：2003-11-07

Applicant: IBM ,  IBM UK

Inventor： POGGE BERNHARD ,  DESPONT MICHEL ,  DRECHSLER UTE ,  PRASAD CHANDRIKA ,  VETTIGER PETER ,  YU ROY

IPC: B81C3/00 ,  H01L21/768

CPC classification number: B81C1/00238 ,  B81B2203/0307 ,  H01L21/76898 ,  H01L2224/16225

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by which it is connected to a substrate. The chip is attached to the MEMS substrate in a direction normal to the substrate surface, so as to make a conductive path from the chip to the MEMS. The chip may be attached by bonding the conductor to C4 metal pads formed on the chip, or by bonding the conductor to metal studs on the chip. The MEMS substrate may be thinned before attachment to the chip, or may be removed from the underside of the MEMS. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.

Abstract translation: 垂直整合的结构包括微机电系统（MEMS）和用于向MEMS输送信号的芯片。 MEMS具有一个具有穿过其中的导体的锚定部分，通过该锚固部分连接到基底。 该芯片沿着垂直于衬底表面的方向附接到MEMS衬底，从而形成从芯片到MEMS的导电路径。 可以通过将导体接合到形成在芯片上的C4金属焊盘，或者通过将导体粘合到芯片上的金属螺柱来附接芯片。 MEMS基板可以在连接到芯片之前变薄，或者可以从MEMS的下侧移除。 使用临时载体板来促进MEMS的处理和与芯片的对准。

公开(公告)号：AU2003301975A1

公开(公告)日：2004-06-03

申请号：AU2003301975

申请日：2003-11-07

Applicant: IBM

Inventor： POGGE BERNHARD ,  DESPONT MICHEL ,  DRECHSLER UTE ,  PRASAD CHANDRIKA ,  VETTIGER PETER ,  YU ROY

IPC: B81C3/00 ,  H01L21/768

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.