公开(公告)号：EP1668685A4

公开(公告)日：2012-02-29

申请号：EP04756585

申请日：2004-06-29

Applicant: IBM

Inventor： POGGE BERNHARD H ,  PRASAD CHANDRIKA ,  YU ROY

IPC: H01L21/44 ,  B23K31/02 ,  H01L21/60 ,  H01L21/68 ,  H01L23/00 ,  H01L23/24 ,  H01L23/498

CPC classification number: H01L23/49816 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83365 ,  H01L2224/83907 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599

公开(公告)号：EP1573799A4

公开(公告)日：2009-02-25

申请号：EP02808338

申请日：2002-12-20

Applicant: IBM

Inventor： POGGE H BERNHARD ,  YU ROY

IPC: H01L25/065 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/48 ,  H01L23/485

CPC classification number: H01L21/44 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method is described for fabricating a three-dimensional integrated device including a plurality of vertically stacked and interconnected wafers. Wafers (1, 2, 3) are bonded together using bonding layers (26, 36) of thermoplastic material such as polyimide; electrical connections are realized by vias (12, 22) in the wafers connected to studs (27, 37). The studs connect to openings (13, 23) having a lateral dimension larger than that of the vias at the front surfaces of the wafers. Furthermore, the vias in the respective wafers need not extend vertically from the front surface to the back surface of the wafers. A conducting body (102), provided in the wafer beneath the device region and extending laterally, may connect the via with the matallized opening (103) in the back surface. Accordingly, the conducting path through the wafer may be led underneath the devices thereof. Additional connections may be made between openings (113) and studs (127) to form vertical heat conduction pathways between the wafers.

公开(公告)号：WO2004043850A3

公开(公告)日：2005-03-24

申请号：PCT/GB0304829

申请日：2003-11-07

Applicant: IBM ,  IBM UK

Inventor： POGGE BERNHARD ,  DESPONT MICHEL ,  DRECHSLER UTE ,  PRASAD CHANDRIKA ,  VETTIGER PETER ,  YU ROY

IPC: B81C3/00 ,  H01L21/768

CPC classification number: B81C1/00238 ,  B81B2203/0307 ,  H01L21/76898 ,  H01L2224/16225

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by which it is connected to a substrate. The chip is attached to the MEMS substrate in a direction normal to the substrate surface, so as to make a conductive path from the chip to the MEMS. The chip may be attached by bonding the conductor to C4 metal pads formed on the chip, or by bonding the conductor to metal studs on the chip. The MEMS substrate may be thinned before attachment to the chip, or may be removed from the underside of the MEMS. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.

Abstract translation: 垂直整合的结构包括微机电系统（MEMS）和用于向MEMS输送信号的芯片。 MEMS具有一个具有穿过其中的导体的锚定部分，通过该锚固部分连接到基底。 该芯片沿着垂直于衬底表面的方向附接到MEMS衬底，从而形成从芯片到MEMS的导电路径。 可以通过将导体接合到形成在芯片上的C4金属焊盘，或者通过将导体粘合到芯片上的金属螺柱来附接芯片。 MEMS基板可以在连接到芯片之前变薄，或者可以从MEMS的下侧移除。 使用临时载体板来促进MEMS的处理和与芯片的对准。

公开(公告)号：EP1470583A4

公开(公告)日：2005-08-03

申请号：EP02789958

申请日：2002-11-26

Applicant: IBM

Inventor： POGGE BERNHARD H ,  YU ROY ,  PRASAD CHANDRIKA ,  NARAYAN CHANDRASEKHAR

IPC: H01L23/12 ,  H01L21/68 ,  H01L21/768 ,  H01L23/48 ,  H01L23/485 ,  H01L23/525 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L24/10 ,  H01L21/6835 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/525 ,  H01L24/13 ,  H01L24/81 ,  H01L25/0652 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2224/81005 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A process is described for semiconductor device integration at chip level or wafer level, in which vertical connections are formed through a substrate (1). A metallized feature (2) is formed in the top surface of a substrate, and a handling plate (35) is attached to the substrate. The substrate is then thinned at the bottom surface thereof to expose the bottom of the feature, to form a conducting through-via (20). The substrate may comprise a chip (44) having a device (30), e.g. a PE chip. The plate may be a wafer (65) attached to the substrate using a vertical stud/via interconnection. The substrate and plate may each have devices (30,60) fabricated therein, so that the process provides vertical wafer-level integration of the devices.

公开(公告)号：AT456860T

公开(公告)日：2010-02-15

申请号：AT02808338

申请日：2002-12-20

Applicant: IBM

Inventor： POGGE H ,  YU ROY

IPC: H01L25/065 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/48 ,  H01L23/485

公开(公告)号：AU2002368524A1

公开(公告)日：2004-07-22

申请号：AU2002368524

申请日：2002-12-20

Applicant: IBM

Inventor： POGGE H BERNHARD ,  YU ROY

IPC: H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065 ,  H01L21/30 ,  H01L21/331 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50

公开(公告)号：DE60235267D1

公开(公告)日：2010-03-18

申请号：DE60235267

申请日：2002-12-20

Applicant: IBM

Inventor： POGGE BERNHARD H ,  YU ROY

IPC: H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065

公开(公告)号：AU2003301975A1

公开(公告)日：2004-06-03

申请号：AU2003301975

申请日：2003-11-07

Applicant: IBM

Inventor： POGGE BERNHARD ,  DESPONT MICHEL ,  DRECHSLER UTE ,  PRASAD CHANDRIKA ,  VETTIGER PETER ,  YU ROY

IPC: B81C3/00 ,  H01L21/768

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.

公开(公告)号：DE112019002691T5

公开(公告)日：2021-02-18

申请号：DE112019002691

申请日：2019-05-21

Applicant: IBM

Inventor： HOLMES STEVEN ,  DORIS BRUCE ,  DELIGIANNI HARIKLIA ,  YU ROY

IPC: G01N33/483 ,  G01N21/00 ,  G01N27/00 ,  G01N27/26

Abstract: Es werden Techniken in Bezug auf eine implantierbare Biosensor-Packung bereitgestellt. Eine oder mehrere hierin beschriebene Ausführungsformen können sich zum Beispiel auf eine Vorrichtung beziehen, die ein Biosensor-Modul aufweisen kann. Das Biosensor-Modul kann ein Halbleitersubstrat und einen Prozessor aufweisen. Das Halbleitersubstrat kann einen Sensor aufweisen, der mit dem Prozessor funktionsfähig gekoppelt ist. Die Vorrichtung kann außerdem eine Polymer-Schicht aufweisen. Das Biosensor-Modul kann in der Polymer-Schicht derart eingebettet sein, dass die Polymer-Schicht auf einer Mehrzahl von Seiten des Biosensor-Moduls bereitgestellt sein kann.

公开(公告)号：DE112018005416T5

公开(公告)日：2020-07-02

申请号：DE112018005416

申请日：2018-11-02

Applicant: IBM

Inventor： DELIGIANNI HARIKLIA ,  LI NING ,  LEE KO-TAO ,  SADANA DEVENDRA ,  YU ROY

IPC: A61B5/00

Abstract: Es werden technische Lösungen zum Realisieren einer Optogenetikbehandlung unter Verwendung einer Sonde und einer Sondensteuerung beschrieben. Eine Sondensteuerung steuert eine Sonde, das Verfahren durchzuführen, welches Emittieren einer Lichtwelle durch eine Lichtquelle der Sonde umfasst, wobei die Sonde in ein Gewebe einbettbar ist, um mit einer entsprechenden Chemikalie in einer oder mehreren Zellen in dem Gewebe zu interagieren. Das Verfahren umfasst ferner Aufnehmen einer Spektroskopie der Lichtwelle, die mit der entsprechenden Chemikalie interagiert, durch einen Sensor der Sonde. Das Verfahren umfasst ferner Senden der Spektroskopie an ein Analysesystem durch die Sonde. Das Verfahren umfasst ferner Empfangen angepasster Parameter für die Lichtquelle von dem Analysesystem durch die Sonde und Anpassen von Einstellungen der Lichtquelle gemäß den empfangenen angepassten Parametern durch eine Steuerung der Sonde, um eine andere Lichtwelle zum Interagieren mit der entsprechenden Chemikalie zu emittieren.