公开(公告)号：JPH1070141A

公开(公告)日：1998-03-10

申请号：JP16599897

申请日：1997-06-23

Applicant: IBM

Inventor： BERNIER WILLIAM EMMETT ,  MICHAEL ANTHONY GEINZU ,  MEMIS IRVING ,  SHAUKATULLAH HUSSAIN

IPC: H01L23/373 ,  H01L21/44 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L23/42

Abstract: PROBLEM TO BE SOLVED: To provide a method of fitting a radiator or heat sink to an electronic component, and its resultant structure. SOLUTION: A heat sink 118 of aluminum or copper is glued to a ceramic cap 100 or an exposed semiconductor chip by the use of a silicon adhesive or flexible epoxy adhesive 120. Aluminum is covered by anode oxidation or chromate conversion, or copper can be covered by nickel or gold chromium. A structure like this is especially beneficial for fitting a flip chip. These adhesive agents contain materials having high thermal conductivities and low coefficients of thermal expansion(CTE), enhance heat performance, and improve the CTE difference between a silicon metal die and the metal of a heat sink.

公开(公告)号：SG45096A1

公开(公告)日：1998-01-16

申请号：SG1995000349

申请日：1995-04-27

Applicant: IBM

Inventor： SHAUKATULLAH HUSSAIN ,  GAYNES MICHAEL ANTHONY ,  SETO PING KWONG ,  CULNANE THOMAS MORAN

IPC: H01L21/56 ,  H01L23/40 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H05K7/20

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0 DEG to 100 DEG C. for 1,500 cycles, -25 DEG to 125 DEG C. for 400 cycles, and -40 DEG to 140 DEG C. for 300 cycles; and withstand continuous exposure at 130 DEG C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25 DEG C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone. The flexible epoxy may contain a material having a low coefficient of thermal expansion (CTE) in order to provide a CTE between that of the silicon die and the metal of the heat sink.

公开(公告)号：ID25443A

公开(公告)日：1996-02-01

申请号：ID20000416

申请日：1995-05-11

Applicant: IBM

Inventor： CULNANE THOMAS MORAN ,  GAYNES MICHAEL ANTHONY ,  SETO PING KWANG ,  SHAUKATULLAH HUSSAIN

IPC: H01L23/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0 DEG to 100 DEG C. for 1,500 cycles, -25 DEG to 125 DEG C. for 400 cycles, and -40 DEG to 140 DEG C. for 300 cycles; and withstand continuous exposure at 130 DEG C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25 DEG C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone. The flexible epoxy may contain a material having a low coefficient of thermal expansion (CTE) in order to provide a CTE between that of the silicon die and the metal of the heat sink.