中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.027 seconds)

    ELECTRONIC PACKAGE WITH IMPROVED CAP DESIGN FOR REDUCED INTERFACIAL STRESSES
    1.
    发明申请
    ELECTRONIC PACKAGE WITH IMPROVED CAP DESIGN FOR REDUCED INTERFACIAL STRESSES 审中-公开
    具有改进的盖子设计用于减少接口应力的电子包装

    公开(公告)号：WO02071480A3

    公开(公告)日：2003-02-06

    申请号：PCT/GB0200513

    申请日：2002-02-06

    Applicant: IBM ,  IBM UK

    Inventor： GAYNES MICHAEL ANTHONY ,  JOHNSON ERIC ARTHUR

    IPC: H01L21/56 ,  H01L23/31 ,  H01L23/433

    CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: An electronic package has a substrate (12) having an upper surface; a semiconductor chip (14) mounted on said upper surface of said substrate and electrically and mechanically coupled to said substrate, said semiconductor chip having a substantially planar upper surface (20); a thermally conductive member (22) constituted of a mesh-like material and having upper and lower surfaces, at least said lower surface being thermally coupled to said upper surface of said semiconductor chip; and dielectric material (24) being imparted to at least a portion of said substrate, and to a portion of said upper surface of said thermally conductive member.

    Abstract translation: 电子封装具有具有上表面的基板（12） 安装在所述衬底的所述上表面上并电和机械耦合到所述衬底的半导体芯片（14），所述半导体芯片具有基本平坦的上表面（20）; 由网状材料构成并具有上表面和下表面的导热构件（22），至少所述下表面热耦合到所述半导体芯片的所述上表面; 以及介电材料（24）被赋予所述基片的至少一部分，以及所述导热部件的所述上表面的一部分。

    Reworkable thermoplastic encapsulating material
    3.
    发明专利
    Reworkable thermoplastic encapsulating material 有权
    可重复使用的热塑性防护材料

    公开(公告)号：JPH11274376A

    公开(公告)日：1999-10-08

    申请号：JP36146698

    申请日：1998-12-18

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレイション

    Inventor： KENETH RAYMOND CARTER ,  CRAIG JOHN HOKER ,  JAMES LUPTON HEDRICK ,  ROBERT DENNIS MILLER ,  GAYNES MICHAEL ANTHONY ,  BUCHWALTER STEPHEN LESLIE

    IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

    CPC classification number: H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2224/0401

    Abstract: PROBLEM TO BE SOLVED: To make an encapsulating material reworkable for permitting respective devices to be repaired and replaced under the environment of integrated circuit assembly, by making the encapsulating material contain a thermoplastic polymer, which is formed adjacent to solder bonding and composed of ring- opening polymerization of ring oligomer.
    SOLUTION: An ring oligomer in an encapsulating material forms a thermally stable polymer, which is properly formed upon application at a region applied by ring-opening polymerization. Therefore, the encapsulating material can be simply melted adjacent to a chip from a hotmelt and can be flowed into an assembly by capillary action. The encapsulating material can be reworked by simply concentrating heat on a specific device, heating the thermoplastic polymer to a temperature above its melting temperature Tg and by melting solder. Then, the chip can be removed from a board. The normal reworking temperature is within a range of approximately 250-400°C.
    COPYRIGHT: (C)1999,JPO

    Abstract translation: 要解决的问题：为了使封装材料可再加工以允许在集成电路组件的环境下修复和更换相应的器件，通过使封装材料包含邻近焊接接合形成的热塑性聚合物， 环低聚物的开环聚合。 解决方案：封装材料中的环状低聚物形成热稳定的聚合物，其在通过开环聚合应用的区域适当形成。 因此，封装材料可以从热熔体中简单地熔融到芯片附近，并且可以通过毛细管作用流入组件。 可以通过简单地将热量集中在特定装置上，将热塑性聚合物加热至高于其熔融温度Tg的温度并通过熔化焊料来重新加工封装材料。 然后，可以从电路板上取下芯片。 正常的返工温度在约250-400摄氏度的范围内。

    Electronic device
    4.
    发明专利
    Electronic device 有权
    电子设备

    公开(公告)号：JP2009278089A

    公开(公告)日：2009-11-26

    申请号：JP2009113560

    申请日：2009-05-08

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： COLGAN EVAN GEORGE ,  MAGERLEN JOHN HAROLD ,  SCHMIDT ROGER R ,  GAYNES MICHAEL ANTHONY ,  MARSTON KENNETH CHARLES ,  HILTON T TOY

    IPC: H01L23/473 ,  H01L25/04 ,  H01L25/18

    CPC classification number: H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  F28F2260/02 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a multi-chip module having a liquid-cooling module which provides a thermal conductive path having a different thermal resistance for each chip, and minimizes a stress at a thermally conductive adhesive portion by heat in order to dissipate effectively heat from the plurality of chips having cooling requirements different from each other, and to provide a method for manufacturing the same. SOLUTION: An electronic apparatus is thermally conductively connected to a first chip 12 and a second chip 13, and includes a cooling liquid inlet, a cooling liquid outlet, and a cooling module 20 having a cooling liquid flow path extending from the cooling liquid inlet to the cooling liquid outlet. The first chip is thermally conductively connected to a first portion to be cooled by a cooling liquid flowing in the cooling liquid flow path in the cooling module, and the second chip is thermally conductively connected to a second portion to be cooled by the cooling liquid being warmed as a result of cooling the first chip and flowing in the cooling liquid flow path in the cooling module. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种具有液体冷却模块的多芯片模块，其为每个芯片提供具有不同热阻的导热路径，并且通过热量按顺序将热导电粘合剂部分处的应力最小化 有效地散热来自具有彼此不同的冷却要求的多个芯片的热量，并提供其制造方法。 解决方案：电子设备与第一芯片12和第二芯片13导热连接，并包括冷却液入口，冷却液出口和冷却模块20，冷却模块20具有从冷却 冷却液出口的液体入口。 第一芯片与通过在冷却模块中的冷却液流路中流动的冷却液冷却的第一部分导热连接，第二芯片与第二部分导热连接，第二部分被冷却液冷却 由于冷却第一芯片并在冷却模块中的冷却液流动路径中流动而加热。 版权所有（C）2010，JPO＆INPIT

    Attaching heat sinks directly to chip carrier modules using flexible-epoxy
    7.
    发明专利
    Attaching heat sinks directly to chip carrier modules using flexible-epoxy 未知

    公开(公告)号：SG45096A1

    公开(公告)日：1998-01-16

    申请号：SG1995000349

    申请日：1995-04-27

    Applicant: IBM

    Inventor： SHAUKATULLAH HUSSAIN ,  GAYNES MICHAEL ANTHONY ,  SETO PING KWONG ,  CULNANE THOMAS MORAN

    IPC: H01L21/56 ,  H01L23/40 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H05K7/20

    Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0 DEG to 100 DEG C. for 1,500 cycles, -25 DEG to 125 DEG C. for 400 cycles, and -40 DEG to 140 DEG C. for 300 cycles; and withstand continuous exposure at 130 DEG C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25 DEG C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone. The flexible epoxy may contain a material having a low coefficient of thermal expansion (CTE) in order to provide a CTE between that of the silicon die and the metal of the heat sink.

    8.
    发明专利
    未知

    公开(公告)号：ID25443A

    公开(公告)日：1996-02-01

    申请号：ID20000416

    申请日：1995-05-11

    Applicant: IBM

    Inventor： CULNANE THOMAS MORAN ,  GAYNES MICHAEL ANTHONY ,  SETO PING KWANG ,  SHAUKATULLAH HUSSAIN

    IPC: H01L23/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42

    Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0 DEG to 100 DEG C. for 1,500 cycles, -25 DEG to 125 DEG C. for 400 cycles, and -40 DEG to 140 DEG C. for 300 cycles; and withstand continuous exposure at 130 DEG C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25 DEG C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone. The flexible epoxy may contain a material having a low coefficient of thermal expansion (CTE) in order to provide a CTE between that of the silicon die and the metal of the heat sink.

Patent Agency Ranking