公开(公告)号：DE69025036D1

公开(公告)日：1996-03-07

申请号：DE69025036

申请日：1990-10-09

Applicant: IBM

Inventor： CORFITS WILLIAM DALE ,  MOTSCHMAN DAVID ROY ,  HOLAHAN MAURICE FRANCIS ,  MARTINO SUSAN JEAN ,  THORPE JAMES ROBERT

IPC: G06F1/20 ,  H05K7/14 ,  H05K7/20

Abstract: A side-by-side double row of electronics packages (11) plug into a common backplane (30). Cooling air flows in an (upside down) omega-shaped path turning into one row of packages, flowing through that row, turning through an air-moving device into a plenum chamber, then turning into the second row of packages, and out of the second row turning again to an outlet.

公开(公告)号：DE69025036T2

公开(公告)日：1996-08-22

申请号：DE69025036

申请日：1990-10-09

Applicant: IBM

Inventor： CORFITS WILLIAM DALE ,  MOTSCHMAN DAVID ROY ,  HOLAHAN MAURICE FRANCIS ,  MARTINO SUSAN JEAN ,  THORPE JAMES ROBERT

IPC: G06F1/20 ,  H05K7/14 ,  H05K7/20

Abstract: A side-by-side double row of electronics packages (11) plug into a common backplane (30). Cooling air flows in an (upside down) omega-shaped path turning into one row of packages, flowing through that row, turning through an air-moving device into a plenum chamber, then turning into the second row of packages, and out of the second row turning again to an outlet.

公开(公告)号：DE69022018T2

公开(公告)日：1996-04-18

申请号：DE69022018

申请日：1990-11-27

Applicant: IBM

Inventor： CASANOVA WAYNE JOSEPH ,  CORFITS WILLIAM DALE ,  DIMMICK ROGER FRANCIS ,  THOMPSON GARY ALLEN ,  THORPE JAMES ROBERT ,  WHEELER STEPHEN EDWARD

IPC: G06F1/16 ,  H05K7/14

Abstract: A double-sided central electronics complex (CEC) (20) is provided for increasing the logic card density in a logic cage or CEC. Specifically, two logic cages or sub-enclosures (22, 24) are integrated, sharing one backplane card so that logic elements may be plugged into the CEC from both sides. The CEC is formed by unitary sheet metal side plates, top and bottom cast or guides (26, 28) and a single double-sided backplane assembly (38).

公开(公告)号：DE69012305D1

公开(公告)日：1994-10-13

申请号：DE69012305

申请日：1990-11-27

Applicant: IBM

Inventor： CASANOVA WAYNE JOSEPH ,  RECKINGER ARTHUR PIERRE ,  SEYFERT MICHAEL DAVID ,  THORPE JAMES ROBERT ,  WHEELER STEPHEN EDWARD

IPC: H05K7/14 ,  G06F1/16

Abstract: An enclosure is provided for containing the logic elements and ancillary components for computing systems. The enclosure is a unitized central electronics enclosure (20) (CEC) wherein the primary structural element is the enclosure for the logic elements. This enclosure or logic cage includes unitary side plates (24, 25), a double-sided backplane and top and bottom cast guides (29, 30). The integrated structural and enclosure functions accommodate the structural needs of a CEC, as well as containing and supporting the logic elements and ancillary equipment.

公开(公告)号：DE69022018D1

公开(公告)日：1995-10-05

申请号：DE69022018

申请日：1990-11-27

Applicant: IBM

Inventor： CASANOVA WAYNE JOSEPH ,  CORFITS WILLIAM DALE ,  DIMMICK ROGER FRANCIS ,  THOMPSON GARY ALLEN ,  THORPE JAMES ROBERT ,  WHEELER STEPHEN EDWARD

IPC: G06F1/16 ,  H05K7/14

Abstract: A double-sided central electronics complex (CEC) (20) is provided for increasing the logic card density in a logic cage or CEC. Specifically, two logic cages or sub-enclosures (22, 24) are integrated, sharing one backplane card so that logic elements may be plugged into the CEC from both sides. The CEC is formed by unitary sheet metal side plates, top and bottom cast or guides (26, 28) and a single double-sided backplane assembly (38).

公开(公告)号：DE69012305T2

公开(公告)日：1995-03-30

申请号：DE69012305

申请日：1990-11-27

Applicant: IBM

Inventor： CASANOVA WAYNE JOSEPH ,  RECKINGER ARTHUR PIERRE ,  SEYFERT MICHAEL DAVID ,  THORPE JAMES ROBERT ,  WHEELER STEPHEN EDWARD

IPC: H05K7/14 ,  G06F1/16

Abstract: An enclosure is provided for containing the logic elements and ancillary components for computing systems. The enclosure is a unitized central electronics enclosure (20) (CEC) wherein the primary structural element is the enclosure for the logic elements. This enclosure or logic cage includes unitary side plates (24, 25), a double-sided backplane and top and bottom cast guides (29, 30). The integrated structural and enclosure functions accommodate the structural needs of a CEC, as well as containing and supporting the logic elements and ancillary equipment.