公开(公告)号：DE69204340D1

公开(公告)日：1995-10-05

申请号：DE69204340

申请日：1992-03-13

Applicant: IBM

Inventor： DIPAOLO NUNZIO ,  KUMAR ANANDA HOSAKERE ,  WIGGINS LOVELL BERRY

IPC: C03C17/06 ,  C03C27/04 ,  C04B37/02 ,  H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/22

Abstract: Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.

公开(公告)号：DE69204340T2

公开(公告)日：1996-03-21

申请号：DE69204340

申请日：1992-03-13

Applicant: IBM

Inventor： DIPAOLO NUNZIO ,  KUMAR ANANDA HOSAKERE ,  WIGGINS LOVELL BERRY

IPC: C03C17/06 ,  C03C27/04 ,  C04B37/02 ,  H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/22

Abstract: Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.

公开(公告)号：DE68923717T2

公开(公告)日：1996-04-18

申请号：DE68923717

申请日：1989-02-28

Applicant: IBM

Inventor： BAISE ARNOLD IVAN ,  CASEY JON ALFRED ,  CLARKE DAVID RICHARD ,  DIVAKARUNI RENUKA SHASTRI ,  DUNKEL WERNER ERNEST ,  HUMENIK JAMES NOEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  KNICKERBOCKER JOHN ULRICH ,  MATTS AMY TRESTMAN ,  TAKACS MARK ANTHONY ,  WIGGINS LOVELL BERRY

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  H01L23/15 ,  H01L23/52

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：DE68923717D1

公开(公告)日：1995-09-14

申请号：DE68923717

申请日：1989-02-28

Applicant: IBM

Inventor： BAISE ARNOLD IVAN ,  CASEY JON ALFRED ,  CLARKE DAVID RICHARD ,  DIVAKARUNI RENUKA SHASTRI ,  DUNKEL WERNER ERNEST ,  HUMENIK JAMES NOEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  KNICKERBOCKER JOHN ULRICH ,  MATTS AMY TRESTMAN ,  TAKACS MARK ANTHONY ,  WIGGINS LOVELL BERRY

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  H01L23/15 ,  H01L23/52

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.