公开(公告)号：BR8701784A

公开(公告)日：1988-02-09

申请号：BR8701784

申请日：1987-04-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  DIVAKARUNI RENUKA SHASTRI ,  DYNYS JOSEPH MICHAEL ,  KANDEZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  MASTER RAJ N ,  CASEY JON ALFRED

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28 ,  B32B31/24 ,  B32B18/00

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：ES2062972T3

公开(公告)日：1995-01-01

申请号：ES87103375

申请日：1987-03-10

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLF JR ,  DIVAKARUNI RENUKA SHASTRI ,  DYNYS JOSEPH MICHAEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  MASTER RAJ NAVINCHANDRA ,  CASEY JON ALFRED

IPC: H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  H05K1/09 ,  H05K3/28

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：DE3750684D1

公开(公告)日：1994-12-01

申请号：DE3750684

申请日：1987-03-10

Applicant: IBM

Inventor： ANDERSON HERBERT ,  DIVAKARUNI RENUKA SHASTRI ,  DYNYS JOSEPH MICHAEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  MASTER RAJ NAVINCHANDRA ,  CASEY JON ALFRED

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：DE68923717T2

公开(公告)日：1996-04-18

申请号：DE68923717

申请日：1989-02-28

Applicant: IBM

Inventor： BAISE ARNOLD IVAN ,  CASEY JON ALFRED ,  CLARKE DAVID RICHARD ,  DIVAKARUNI RENUKA SHASTRI ,  DUNKEL WERNER ERNEST ,  HUMENIK JAMES NOEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  KNICKERBOCKER JOHN ULRICH ,  MATTS AMY TRESTMAN ,  TAKACS MARK ANTHONY ,  WIGGINS LOVELL BERRY

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  H01L23/15 ,  H01L23/52

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：DE68923717D1

公开(公告)日：1995-09-14

申请号：DE68923717

申请日：1989-02-28

Applicant: IBM

Inventor： BAISE ARNOLD IVAN ,  CASEY JON ALFRED ,  CLARKE DAVID RICHARD ,  DIVAKARUNI RENUKA SHASTRI ,  DUNKEL WERNER ERNEST ,  HUMENIK JAMES NOEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  KNICKERBOCKER JOHN ULRICH ,  MATTS AMY TRESTMAN ,  TAKACS MARK ANTHONY ,  WIGGINS LOVELL BERRY

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  H01L23/15 ,  H01L23/52

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：DE3750684T2

公开(公告)日：1995-05-18

申请号：DE3750684

申请日：1987-03-10

Applicant: IBM

Inventor： ANDERSON HERBERT ,  DIVAKARUNI RENUKA SHASTRI ,  DYNYS JOSEPH MICHAEL ,  KANDETZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  MASTER RAJ NAVINCHANDRA ,  CASEY JON ALFRED

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：DE3778741D1

公开(公告)日：1992-06-11

申请号：DE3778741

申请日：1987-01-09

Applicant: IBM

Inventor： ANDERSON JR ,  ARAPS CONSTANCE JOAN ,  DIVAKARUNI RENUKA SHASTRI ,  SACHDEV KRISHNA GANDHI ,  ZALAR STOYAN MATHIAS ,  KIRBY DANIEL PATRICK ,  WOLFFNUFER ROBERT ,  SACHDEV HARBANS SINGH ,  SURYANARAYANA DARBHA

IPC: C03C10/00 ,  C04B35/622 ,  C04B35/628 ,  C04B35/63 ,  C04B35/632 ,  C04B35/634 ,  H01L21/48 ,  H05K1/03 ,  C04B35/00 ,  H05K3/46

Abstract: Prepn. comprises (a) forming a finely divided cpd. that includes particles of ceramic particles, (b) coating the particles with a heat decomposable surface modification organo cpd. (I) selected from organo silanes, organo silazanes, titanium chelates and titanium esters, (c) combining and mixing the coated particles of finely divided cpd. with an organic resin binder and solvent for the binder to form a slurry, (d) shaping the slurry to form the desired element, heating the element to remove the coating, the binder and the solvent and (e) continuing the heating to fuse the particles of finely divided cpd.