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公开(公告)号：AU599706B2
公开(公告)日：1990-07-26
申请号：AU7921187
申请日：1987-09-30
Applicant: IBM
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公开(公告)号：BR8704432A
公开(公告)日：1988-05-24
申请号：BR8704432
申请日：1987-08-27
Applicant: IBM
Inventor： DUERIG URS THEODOR , GIMZEWSKI JAMES K , GRESCHNER JOHANN , POHL WOLFGANG D , WOLTER OLAF
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公开(公告)号：CA1305872C
公开(公告)日：1992-08-04
申请号：CA548420
申请日：1987-10-01
Applicant: IBM
Inventor： DUERIG URS T , GIMZEWSKI JAMES K , GRESCHNER JOHANN , POHL WOLFGANG D , WOLTER OLAF
IPC: G01B7/34 , G01B7/00 , G01B21/30 , G01D5/04 , G01L1/00 , G01L1/04 , G01N13/00 , G01N23/00 , G01N37/00 , G01Q20/04 , G01Q40/00 , G01Q60/38 , G01Q70/14 , H01J37/26 , H01J37/28
Abstract: The micromechanical sensor head is designed to measure forces down to 10-13 N. It comprises a common base from which a cantilever beam and a beam member extend in parallel. The cantilever beam carries a sharply pointed tip of a hard material, dielectric or not, for interaction with the surface of a sample to be investigated. Bulges forming a tunneling junction protrude from facing surfaces of said beams, the gap between said bulges being adjustable by means of electrostatic forces generated by a potential (Vd) applied to a pair of electrodes respectively coated onto parallel surfaces of said beams. The sensor head consists of one single piece of semiconductor material, such as silicon or gallium arsenide (or any other compounds thereof) which is fabricated to the dimensions required for the application by means of conventional semiconductor chip manufacturing techniques. SZ9-86-002
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