公开(公告)号：JP2004042253A

公开(公告)日：2004-02-12

申请号：JP2003113542

申请日：2003-04-18

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： LIEBAU MAIK ,  UNGER EUGEN ,  DUESBERG GEORG

IPC: B82B3/00 ,  B05D3/02 ,  B05D5/00 ,  B32B9/00 ,  C01B31/02 ,  H01L21/288 ,  H01L21/768 ,  H01L29/06 ,  H01L29/15

CPC classification number: H01L21/288 ,  B82Y10/00 ,  B82Y30/00 ,  H01L21/76838 ,  H01L2221/1094 ,  Y10S977/843 ,  Y10S977/857 ,  Y10T428/24132 ,  Y10T428/24744 ,  Y10T428/30

Abstract: PROBLEM TO BE SOLVED: To provide a method for depositing a carbon nanotube on a flat surface according to a target. SOLUTION: Vapor deposition of the nanotube is performed by using a capillary of a range not more than a micrometer or a nanometer. A ram having a relief structure composed of an elastomer material is contacted with the flat surface. When liquid of a nanotube dispersing liquid is dripped on a certain surface, this liquid diffuses by receiving capillary force. Mobility of the nanotube in the capillary is determined by the size and an individual capillary shape, and a surface state has influence on the mobility of the nanotube. COPYRIGHT: (C)2004,JPO

公开(公告)号：WO2006039907A2

公开(公告)日：2006-04-20

申请号：PCT/DE2005001816

申请日：2005-10-11

Applicant: INFINEON TECHNOLOGIES AG ,  DUESBERG GEORG ,  KREUPL FRANZ ,  SEIDEL ROBERT ,  STEINLESBERGER GERNOT

Inventor： DUESBERG GEORG ,  KREUPL FRANZ ,  SEIDEL ROBERT ,  STEINLESBERGER GERNOT

IPC: H01L51/40

CPC classification number: H01L51/0048 ,  B82Y10/00 ,  H01L51/0021

Abstract: The invention relates to an electrical circuit with at least one nanostructure and a carbon conductor track, said carbon conductor track being embodied by a layer essentially made from carbon, whereby the nanostructure and the carbon conductor track are in direct contact.

Abstract translation: 一种电路包括：至少一个纳米结构，和碳导体，它是由基本上由碳 - 碳层导体轨道的一个组，其中所述纳米结构和碳导体轨道直接接触的方式形成。

公开(公告)号：DE102006010512A1

公开(公告)日：2007-06-21

申请号：DE102006010512

申请日：2006-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DUESBERG GEORG ,  KREUPL FRANZ ,  LIEBAU MAIK ,  UNGER EUGEN

IPC: C23C16/26 ,  C23C16/02

Abstract: One embodiment of the present invention provides a method for the deposition of a Carbon containing layer on a Silicon surface wherein a (i) substantially Silicon-oxide-free or reduced oxide interface results between Silicon and the Carbon containing layer during the deposition. In another embodiment, the present invention provides a method for deposition of a Carbon containing layer wherein the deposition process is substantially soot (particle)-free or reduction of soot.

公开(公告)号：DE102005004366A1

公开(公告)日：2006-08-10

申请号：DE102005004366

申请日：2005-01-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STEINLESBERGER GERNOT ,  STEINHOEGL WERNER ,  DUESBERG GEORG ,  SCHINDLER GUENTHER

IPC: H01L21/768

Abstract: The method involves applying an electrically insulating layer (72) on a planarized surface of an integrated switching arrangement after the application of an electro conductive nucleation layer (74) on the surface. The insulating layer is structured so that areas of the nucleation layer are laid open. An electro conductive material is galvanically deposited on the areas laid open.

公开(公告)号：DE10217362A1

公开(公告)日：2003-11-13

申请号：DE10217362

申请日：2002-04-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LIEBAU MAIK ,  UNGER EUGEN ,  DUESBERG GEORG

IPC: B82B3/00 ,  B05D3/02 ,  B05D5/00 ,  B32B9/00 ,  C01B31/02 ,  H01L21/288 ,  H01L21/768 ,  H01L29/06 ,  H01L29/15

Abstract: Process for nanotube deposition on planar surfaces comprises preparing stamp from elastomeric material having relief structure on one stamp surface, applying stamp to substrate so that substrate and stamp form microfluidic capillary system having inlet and outlet and made from one or more capillaries, contacting nanotube dispersion with capillary system inlet so that dispersion spreads in system under capillary force, drying dispersion, and removing stamp. An Independent claim is also included for an electronic component made from a substrate having discrete structures of nanotubes.

公开(公告)号：DE10344814B3

公开(公告)日：2005-07-14

申请号：DE10344814

申请日：2003-09-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GRAHAM ANDREW ,  KREUPL FRANZ ,  DUESBERG GEORG

IPC: G11C13/02 ,  H01L21/02 ,  H01L21/8242 ,  H01L27/108 ,  H01L51/00 ,  H01L51/30 ,  G11C11/40 ,  H01L27/08 ,  H01L21/822 ,  B82B1/00 ,  B82B3/00

Abstract: The present device relates to memory devices for storing electric charge having memory cells and transistors arranged spatially next to them, and relates in particular to memory devices having memory cells with a high capacitance. In the memory cells which form a memory device to which the invention relates, there is a substrate and at least one memory cell which is arranged on the substrate and includes a first electrode element, which is electrically connected to the substrate, an insulation layer, which has been applied to the first electrode element, and a second electrode element, which has been applied to the insulation layer and is electrically insulated from the first electrode element.

公开(公告)号：DE10217362B4

公开(公告)日：2004-05-13

申请号：DE10217362

申请日：2002-04-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LIEBAU MAIK ,  UNGER EUGEN ,  DUESBERG GEORG

IPC: B82B3/00 ,  B05D3/02 ,  B05D5/00 ,  B32B9/00 ,  C01B31/02 ,  H01L21/288 ,  H01L21/768 ,  H01L29/06 ,  H01L29/15

Abstract: Process for nanotube deposition on planar surfaces comprises preparing stamp from elastomeric material having relief structure on one stamp surface, applying stamp to substrate so that substrate and stamp form microfluidic capillary system having inlet and outlet and made from one or more capillaries, contacting nanotube dispersion with capillary system inlet so that dispersion spreads in system under capillary force, drying dispersion, and removing stamp. An Independent claim is also included for an electronic component made from a substrate having discrete structures of nanotubes.

公开(公告)号：DE102005004365A1

公开(公告)日：2006-08-10

申请号：DE102005004365

申请日：2005-01-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STEINLESBERGER GERNOT ,  STEINHOEGL WERNER ,  DUESBERG GEORG ,  SCHINDLER GUENTHER

IPC: H01L21/768 ,  H01L23/522

Abstract: The method involves creating a through-hole (403) through a substrate of an integrated circuit arrangement, where the hole passes from a cover surface to a base surface of the arrangement. An electrically conductive nucleation layer (402) is superimposed at the base surface or cover surface before or after creating the hole. An electrically conductive material of a conducting structure is galvanically deposited in the hole. An independent claim is also included for an integrated circuit arrangement comprising a conducting structure.

公开(公告)号：DE10345157A1

公开(公告)日：2005-05-19

申请号：DE10345157

申请日：2003-09-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DUESBERG GEORG ,  STEINHOEGL WERNER

IPC: H01L23/31 ,  H01L23/373 ,  H01L23/42 ,  H01L23/28

Abstract: The invention relates to a heat-conducting coating of electronic circuit assemblies ( 102 ), comprising a coating agent ( 100 ), which encloses the electronic circuit assembly ( 102 ) and which is electrically insulating, with dispersed particles in the coating agent ( 100 ) which have a high thermal conductivity, whereby the particles dispersed in the coating agent ( 100 ) are embodied as nanoelements ( 101 ).