3.
    发明专利
    未知

    公开(公告)号:DE19927286A1

    公开(公告)日:2001-01-18

    申请号:DE19927286

    申请日:1999-06-15

    Abstract: An abrasive slurry for a chemical mechanical polishing of a precious-metal surface includes abrasive particles, which are in organic and/or aqueous suspension, an oxidizing agent and a complex-forming agent which shifts the equilibrium between the precious metal in elemental form and its ions in solution toward the formation of new ions. A chemical-mechanical polishing method is also provided.

    4.
    发明专利
    未知

    公开(公告)号:DE102006010512A1

    公开(公告)日:2007-06-21

    申请号:DE102006010512

    申请日:2006-03-07

    Abstract: One embodiment of the present invention provides a method for the deposition of a Carbon containing layer on a Silicon surface wherein a (i) substantially Silicon-oxide-free or reduced oxide interface results between Silicon and the Carbon containing layer during the deposition. In another embodiment, the present invention provides a method for deposition of a Carbon containing layer wherein the deposition process is substantially soot (particle)-free or reduction of soot.

Patent Agency Ranking