公开(公告)号：WO0124228A3

公开(公告)日：2002-03-14

申请号：PCT/US0026355

申请日：2000-09-25

Applicant: INPUT OUTPUT INC

Inventor： YU LIANZHONG ,  GOLDBERG HOWARD D ,  YU DULI

IPC: G02B26/10 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  B44C1/22 ,  G03F7/00 ,  H01L21/306

CPC classification number: B81C1/00142 ,  B81B2201/042 ,  B81B2203/0315 ,  B81C1/00896 ,  B81C2203/0118 ,  B81C2203/036 ,  G02B26/0816

Abstract: A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

Abstract translation: 微加工结构包括用于将微加工结构临时耦合到支撑结构的一个或多个临时桥。

公开(公告)号：DE60034451D1

公开(公告)日：2007-05-31

申请号：DE60034451

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01D11/24 ,  G01P21/00 ,  G01D18/00 ,  G01D21/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：AT285583T

公开(公告)日：2005-01-15

申请号：AT00945370

申请日：2000-07-13

Applicant: INPUT OUTPUT INC

Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P15/135 ,  G02B26/00 ,  C23F1/00 ,  G03F7/26 ,  G03F7/00

Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

公开(公告)号：NO20092749A

公开(公告)日：2002-03-12

申请号：NO20092749

申请日：2009-07-22

Applicant: INPUT OUTPUT INC

Inventor： GOLDBERG HOWARD D ,  YU DULI ,  YU LIANZHONG ,  RIED ROBERT P

IPC: B81B3/00 ,  G02B26/10 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20

CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

公开(公告)号：NO20020139D0

公开(公告)日：2002-01-11

申请号：NO20020139

申请日：2002-01-11

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D ,  RIED ROBERT P

IPC: B81B3/00 ,  G02B26/10 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P

Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

公开(公告)号：CA2366999A1

公开(公告)日：2000-09-21

申请号：CA2366999

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  BEHN LAWRENCE P ,  SELVAKUMAR ARJUN ,  IP MATTHEW ,  SIGMAR AXEL ,  LAROO RICHARD ,  MORGAN DAVID ,  RUSHEFSKY LARRY ,  FABER KEES ,  LEMKE AL ,  BUIE THOMAS ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  MAXWELL PETER ,  MARSH JAMES L ,  ALTMAN SJOERD ,  RINNE RAY ,  BALDERES DEMETRIOS ,  GOLDBERG HOWARD D ,  STALNAKER W MARC

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01D21/00 ,  B65D85/38

Abstract: A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) support ed by a planar surface (345) within a cavity (340) of a housing (205) coupled t o a first end cap (210) by a PC-board connection (355). Housing (205) is furth er coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215 ) by a third coupling member (320) and a fourth coupling member (325). Interfa ce sealing members (330a, 330b, 330c, 330d) seal between housing (205) and firs t end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal betwe en housing (205) and second end cap (215).

公开(公告)号：CA2366320A1

公开(公告)日：2000-09-21

申请号：CA2366320

申请日：2000-03-16

Applicant: INPUT OUTPUT INC

Inventor： IP MATTHEW ,  SCHMIDT MARTIN A ,  YU DULI ,  MARSH JAMES L ,  SELVAKUMAR ARJUN ,  SIMON PHILIP ,  FUNG BING-FAI ,  GOLDBERG HOWARD D

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305 ) also includes a top cap press frame recess (405) and a bottom cap press fram e recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of th e accelerometer (305). A dicing process is performed on the accelerometer (305 ) to isolate the electrical leads of the accelerometer (305). The acceleromete r (305) further includes overshock protection bumpers (720) and patterned meta l electrodes to reduce stiction during the operation of the accelerometer (305 ).

公开(公告)号：CA2366320C

公开(公告)日：2010-05-11

申请号：CA2366320

申请日：2000-03-16

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P15/02 ,  G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：CA2384889C

公开(公告)日：2010-05-04

申请号：CA2384889

申请日：2000-09-25

Applicant: INPUT OUTPUT INC

Inventor： YU LIANZHONG ,  GOLDBERG HOWARD D ,  YU DULI

IPC: B81C1/00 ,  G02B26/10 ,  B81B3/00 ,  B81B7/00 ,  B81C99/00 ,  C23F1/02 ,  G01L1/00 ,  G01P9/04 ,  G01P15/18 ,  G02B26/08 ,  G03F7/00 ,  G03F7/20 ,  H01L21/306

Abstract: A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

公开(公告)号：AT355728T

公开(公告)日：2006-03-15

申请号：AT00914976

申请日：2000-03-15

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  MARSH JAMES L ,  GOLDBERG HOWARD D ,  YU DULI ,  STALNAKER W MARC

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).