公开(公告)号：DE60034451D1

公开(公告)日：2007-05-31

申请号：DE60034451

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01D11/24 ,  G01P21/00 ,  G01D18/00 ,  G01D21/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：AU7002601A

公开(公告)日：2002-01-02

申请号：AU7002601

申请日：2001-06-21

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  YU DULI ,  YU LIANZHONG ,  JONES BEN W

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01V1/18 ,  G01P15/00

Abstract: An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilient folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405). The folded beams include circular cutouts so as to provide stress relief at connections between foot and leg positions of each folded beam.

公开(公告)号：CA2366999A1

公开(公告)日：2000-09-21

申请号：CA2366999

申请日：2000-03-17

Applicant: INPUT OUTPUT INC

Inventor： YU DULI ,  BEHN LAWRENCE P ,  SELVAKUMAR ARJUN ,  IP MATTHEW ,  SIGMAR AXEL ,  LAROO RICHARD ,  MORGAN DAVID ,  RUSHEFSKY LARRY ,  FABER KEES ,  LEMKE AL ,  BUIE THOMAS ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  MAXWELL PETER ,  MARSH JAMES L ,  ALTMAN SJOERD ,  RINNE RAY ,  BALDERES DEMETRIOS ,  GOLDBERG HOWARD D ,  STALNAKER W MARC

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01D21/00 ,  B65D85/38

Abstract: A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) support ed by a planar surface (345) within a cavity (340) of a housing (205) coupled t o a first end cap (210) by a PC-board connection (355). Housing (205) is furth er coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215 ) by a third coupling member (320) and a fourth coupling member (325). Interfa ce sealing members (330a, 330b, 330c, 330d) seal between housing (205) and firs t end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal betwe en housing (205) and second end cap (215).

公开(公告)号：CA2366320A1

公开(公告)日：2000-09-21

申请号：CA2366320

申请日：2000-03-16

Applicant: INPUT OUTPUT INC

Inventor： IP MATTHEW ,  SCHMIDT MARTIN A ,  YU DULI ,  MARSH JAMES L ,  SELVAKUMAR ARJUN ,  SIMON PHILIP ,  FUNG BING-FAI ,  GOLDBERG HOWARD D

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305 ) also includes a top cap press frame recess (405) and a bottom cap press fram e recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of th e accelerometer (305). A dicing process is performed on the accelerometer (305 ) to isolate the electrical leads of the accelerometer (305). The acceleromete r (305) further includes overshock protection bumpers (720) and patterned meta l electrodes to reduce stiction during the operation of the accelerometer (305 ).

公开(公告)号：DE60033643T2

公开(公告)日：2007-10-31

申请号：DE60033643

申请日：2000-03-15

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  MARSH JAMES L ,  GOLDBERG HOWARD D ,  YU DULI ,  STALNAKER W MARC

IPC: G01P21/00 ,  H05K5/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：NO20026151L

公开(公告)日：2003-02-14

申请号：NO20026151

申请日：2002-12-20

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  YU DULI ,  YU LIANZHONG ,  JONES BEN W

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01V1/18

Abstract: An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilient folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405). The folded beams include circular cutouts so as to provide stress relief at connections between foot and leg positions of each folded beam.

公开(公告)号：CA2413965A1

公开(公告)日：2001-12-27

申请号：CA2413965

申请日：2001-06-21

Applicant: INPUT OUTPUT INC

Inventor： YU LIANZHONG ,  SELVAKUMAR ARJUN ,  JONES BEN W ,  YU DULI

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01V1/18 ,  G01P15/00

Abstract: An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilent folded beams (1415a - 1415d), wherein one or more electrode patterns are coupled to the spring mas s assembly (1400), wherein a top cap wafer, including a top capacitor electrod e, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405).

公开(公告)号：NO20014464A

公开(公告)日：2001-11-16

申请号：NO20014464

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01P

CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：NO20014469L

公开(公告)日：2001-10-24

申请号：NO20014469

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  MARSH JAMES L ,  GOLDBERG HOWARD D ,  YU DULI ,  STALNAKER W MARC

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：NO20014460D0

公开(公告)日：2001-09-14

申请号：NO20014460

申请日：2001-09-14

Applicant: INPUT OUTPUT INC

Inventor： RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  BEHN LAWRENCE P ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MAXWELL PETER ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  G01D

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).