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    APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS
    1.
    发明申请
    APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS 审中-公开
    装有内层的装置支持表面装配组件

    公开(公告)号：WO9524730A3

    公开(公告)日：1996-02-15

    申请号：PCT/US9502678

    申请日：1995-03-09

    Applicant: PANDA PROJECT

    Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

    IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01L

    CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

    Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多层绝缘材料（12a-12d ），每个层包括在该层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到完全延伸通过至少一个层的相应的阱（15），并且在一个层的一个表面上底部，阱（15）不通过该表面延伸并电耦合 涉及形成在其对应的井（15）内的导电接合结构（13）。

    A COMPUTER SYSTEM
    3.
    发明申请
    A COMPUTER SYSTEM 审中-公开
    计算机系统

    公开(公告)号：WO9530945A2

    公开(公告)日：1995-11-16

    申请号：PCT/US9505210

    申请日：1995-05-02

    Applicant: PANDA PROJECT

    Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M ,  CRUZ EDWARD V ,  RAZO VINCENT R ,  FYNN SHAUN

    IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H05K7/20

    CPC classification number: G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  G06F1/181 ,  G06F1/183 ,  G06F2200/1639

    Abstract: A computer system including a plurality of air circulation areas to facilitate cooling of components within the air circulation areas. Specifically, the system includes an air circulation area for a plurality of printed circuit boards, for a power supply, and for a plurality of internal and external peripherals, such as disk drives. The system also includes an automatic door that covers the external peripherals. The external peripherals slide forward, out of a casing of the system to facilitate upgrade and/or repair of the peripherals. In addition, the system includes cabling slots and structure to effect electromagnetic interference (EMI) shielding.

    Abstract translation: 一种计算机系统，包括多个空气循环区域，以便于冷却空气循环区域内的部件。 具体而言，该系统包括用于多个印刷电路板，用于电源以及多个内部和外部外围设备（例如磁盘驱动器）的空气循环区域。 该系统还包括一个覆盖外部外围设备的自动门。 外部外围设备从系统的外壳中向前滑动，以便于外围设备的升级和/或修理。 此外，该系统还包括布线槽和结构以实现电磁干扰（EMI）屏蔽。

    Contact beam for electrical interconnect component
    4.
    发明专利
    Contact beam for electrical interconnect component 未知

    公开(公告)号：AU6258396A

    公开(公告)日：1996-12-30

    申请号：AU6258396

    申请日：1996-06-05

    Applicant: PANDA PROJECT

    Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

    IPC: H01R13/11 ,  H01R13/26 ,  H01R23/10

    Abstract: An electrically conductive contact beam for use in an electrical interconnect component. The contact beam includes a stabilizing section for securing the contact beam within a support substrate, and a contact section, connected to the stabilizing section, for establishing contact between the contact beam and an electrically conductive contact from another electrical interconnect component. The contact section includes a merge radius section connecting the contact section to the stabilizing section, a flexible section connected to the merge radius section and having an elongated curvature, a contact area, disposed at an end of the curvature opposite the merge radius section, for contacting the conductive contact from the other electrical interconnect component, and a lead-in section, connected to the contact area, for initiating deflection of the contact section upon contact of the lead-in section with a portion of the other electrical interconnect component.

    Apparatus having inner layers supporting surface-mount components
    6.
    发明专利
    Apparatus having inner layers supporting surface-mount components 未知

    公开(公告)号：AU2093895A

    公开(公告)日：1995-09-25

    申请号：AU2093895

    申请日：1995-03-09

    Applicant: PANDA PROJECT THE

    Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

    IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01L21/00

    Abstract: A semiconductor die package (30) includes a plurality of conductive leads (11) and a multi-layer structure (10) for carrying electrical signals, the multi-layer structure (10) including a plurality of layers of insulative material (12a-12d), each of the layers including a first surface and a second surface on an opposing side of the layer. Each of the leads (11) extends into a corresponding well (15) extending completely through at least one of the layers and bottoming at one of the surfaces of one of the layers through which the well (15) does not extend and is electrically coupled to an electrically conductive bonding structure (13) formed within its corresponding well (15).

    Low profile semiconductor die carrier
    10.
    发明专利
    Low profile semiconductor die carrier 未知

    公开(公告)号：AU6091596A

    公开(公告)日：1996-12-30

    申请号：AU6091596

    申请日：1996-06-04

    Applicant: PANDA PROJECT THE

    Inventor： MOSLEY JOSEPH M ,  PORTUONDO MARIA M ,  TAYLOR DREW L

    IPC: H01L23/50 ,  H01L23/057 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34 ,  H01L23/495

    Abstract: A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.

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