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    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES
    2.
    发明专利
    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES 未知

    公开(公告)号：SG10201509551PA

    公开(公告)日：2015-12-30

    申请号：SG10201509551P

    申请日：2013-01-18

    Applicant: SKORPIOS TECHNOLOGIES INC

    Inventor： DALLESASSE JOHN ,  KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  MARCHENA ELTON

    Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES
    3.
    发明专利
    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES 未知

    公开(公告)号：SG11201403688RA

    公开(公告)日：2014-10-30

    申请号：SG11201403688R

    申请日：2013-01-18

    Applicant: SKORPIOS TECHNOLOGIES INC

    Inventor： DALLESASSE JOHN ,  KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  MARCHENA ELTON ,  DALLESASSE JOHN ,  KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  MARCHENA ELTON

    IPC: H01L21/762 ,  H01L27/12 ,  H01L27/146

    Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS
    4.
    发明申请
    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS 审中-公开
    用于监视和控制RF信号的电路的单片集成方法和系统

    公开(公告)号：WO2014025683A3

    公开(公告)日：2015-04-09

    申请号：PCT/US2013053606

    申请日：2013-08-05

    Applicant: SKORPIOS TECHNOLOGIES INC

    Inventor： KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  JHA KALPIT ,  MARCHENA ELTON ,  MIZRAHI AMIT

    CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

    Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号，并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分，在BPSK调制器的第二臂处接收第二部分，向BPSK调制器的第一臂应用第一音调，并将第二音调应用于 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率，并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

    METHOD AND SYSTEM FOR PERFORMING TESTING OF PHOTONIC DEVICES
    5.
    发明申请
    METHOD AND SYSTEM FOR PERFORMING TESTING OF PHOTONIC DEVICES 审中-公开
    执行光电器件测试的方法和系统

    公开(公告)号：WO2014025824A2

    公开(公告)日：2014-02-13

    申请号：PCT/US2013053856

    申请日：2013-08-06

    Applicant: SKORPIOS TECHNOLOGIES INC

    Inventor： STONE ROBERT J ,  KRASULICK STEPHEN B

    IPC: H04B17/00

    CPC classification number: G01J1/08 ,  G01J1/42 ,  G01J2001/083 ,  G01J2001/4247 ,  G01R31/3187 ,  H04B10/035 ,  H04B10/0731 ,  H04B10/0779 ,  H04B17/0082

    Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

    Abstract translation: 光子系统包括发射光子模块和接收光子模块。 光子系统还包括耦合到发射光子模块的发射波导，与发射波导集成的第一光开关，以及光耦合到第一光开关的诊断波导。 光子系统还包括耦合到接收光子模块的接收波导和与接收波导集成并与光学耦合到诊断波导的第二光开关。

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