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    SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE
    3.
    发明公开
    SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE 审中-公开

    公开(公告)号：EP3534126A2

    公开(公告)日：2019-09-04

    申请号：EP19157021.7

    申请日：2019-02-13

    Applicant: STMicroelectronics S.r.l.

    Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  GHIDONI, Marco Omar

    IPC: G01L1/18 ,  H01L29/84

    Abstract: A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be measured. The column (144) is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor (120). The peripheral structure (146) is configured to transfer the remaining fraction of the load to be measured to the base.

    APPARATUS AND METHOD OF LASER SCANNING
    4.
    发明公开
    APPARATUS AND METHOD OF LASER SCANNING 审中-公开

    公开(公告)号：EP4124883A1

    公开(公告)日：2023-02-01

    申请号：EP22181791.9

    申请日：2022-06-29

    Applicant: STMicroelectronics S.r.l.

    Inventor： CALTABIANO, Daniele

    IPC: G01S7/481 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G01S17/931 ,  G01S7/4863

    Abstract: An apparatus (10), comprising: a laser light source (12) configured to transmit at least one beam of light pulses (L) towards a target, projecting at least one corresponding beam spot (P) thereon, and an array of sensors (16) with a plurality of sensors (16ij) distributed according to a grid (G), a sensor (16ij) in the array of sensors (16) configured to sense a light pulse incident thereon in response to reflection of at least one light pulse (P) of the beam of light pulses (L) from a field of view, FOV, region (T) in the target, the sensor (16) of the array of sensors (16) further configured to provide a signal indicative of a time of incidence of at least one light pulse (R).
    A FOV region (T) of the array of sensors (16) is portioned into grid cells (gij) according to the grid (G).
    Each sensor (16i) in the array of sensors (16) is configured to sense at least one echo light pulse (R) reflected from a respective grid cell portion (gij) of the FOV region (T).
    The apparatus (10) comprises a beam steering arrangement (13, 14) configured to cyclically vary a direction of transmission of the beam of light pulses (L), projecting at least one light pulse (P) per grid cell (gij) in the portioned FOV region (T) of the array of sensors (16).

    SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE
    7.
    发明公开
    SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE 审中-公开

    公开(公告)号：EP3534126A3

    公开(公告)日：2019-11-13

    申请号：EP19157021.7

    申请日：2019-02-13

    Applicant: STMicroelectronics S.r.l.

    Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  GHIDONI, Marco Omar

    IPC: G01L1/18 ,  H01L29/84

    Abstract: A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be measured. The column (144) is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor (120). The peripheral structure (146) is configured to transfer the remaining fraction of the load to be measured to the base.

    MULTI-AXIAL FORCE SENSOR, METHOD OF MANUFACTURING THE MULTI-AXIAL FORCE SENSOR, AND METHOD FOR OPERATING THE MULTI-AXIAL FORCE SENSOR
    8.
    发明公开
    MULTI-AXIAL FORCE SENSOR, METHOD OF MANUFACTURING THE MULTI-AXIAL FORCE SENSOR, AND METHOD FOR OPERATING THE MULTI-AXIAL FORCE SENSOR 审中-公开

    公开(公告)号：EP3421959A1

    公开(公告)日：2019-01-02

    申请号：EP18178963.7

    申请日：2018-06-21

    Applicant: STMicroelectronics S.r.l.

    Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  BRAGHIN, Francesco

    IPC: G01L5/16 ,  G01L1/26 ,  G01L1/18 ,  G01L1/22

    Abstract: A microelectromechanical transducer (1), comprising: a semiconductor body (2), having a first surface (2a) and a second surface (2b) opposite to one another; a plurality of trenches (4) extending in the semiconductor body (2) from the first surface (2a) towards the second surface (2b), including a first pair of trenches (4a) having a respective main direction of extension along a first axis (x), and a second pair of trenches (4b) having a respective main direction of extension along a second axis (y) orthogonal to the first axis; a first piezoresistive sensor (6a) and a second piezoresistive sensor (6b) extending at the first surface (2a) of the semiconductor body (2), respectively arranged between said first and second pair of trenches (4a, 4b), wherein the first piezoresistive sensor (6a), the second piezoresistive sensor (6b) and the plurality of trenches (4) form an active region (7a, 7b); and a first structural body (8), mechanically coupled to the first surface (2a) of the semiconductor body (2) in such a way to form a first sealed cavity (10) which encloses the active region.

    MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR
    9.
    发明公开
    MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR 审中-公开

    公开(公告)号：EP3364166A1

    公开(公告)日：2018-08-22

    申请号：EP18156816.3

    申请日：2018-02-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  PICCO, Andrea ,  POMARICO, Anna Angela ,  ROSELLI, Giuditta ,  BRAGHIN, Francesco

    IPC: G01L9/00 ,  B81B7/00 ,  G01L9/06 ,  G01L19/14 ,  G01L1/18 ,  G01L1/26

    CPC classification number: G01L1/18 ,  G01L1/26 ,  G01L9/0002 ,  G01L9/06 ,  G01L19/146 ,  H01C10/10 ,  H01C17/00

    Abstract: A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.

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