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    PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GALVANICALLY ISOLATED DICE
    1.
    发明公开
    PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GALVANICALLY ISOLATED DICE 审中-公开

    公开(公告)号：EP4036968A1

    公开(公告)日：2022-08-03

    申请号：EP22153019.9

    申请日：2022-01-24

    Applicant: STMicroelectronics S.r.l.

    Inventor： PACI, Dario ,  ADORNO, Silvia ,  DEL SARTO, Marco ,  CERINI, Fabrizio ,  GRITTI, Alex

    IPC: H01L23/48 ,  H01L23/538

    Abstract: A packaged electronic system having a support (55) formed by an insulating organic substrate housing a buried conductive region (56) that is floating. A first die (51) is fixed to the support and carries, on a first main surface, a first die contact region (67) capacitively coupled to a first portion of the buried conductive region. A second die (52) is fixed to the support and carries, on a first main surface, a second die contact region (67) capacitively coupled to a second portion of the buried conductive region. A packaging mass (77) encloses the first die (51), the second die (52), the first die contact region, the second die contact region, and, at least partially, the support (55).

    PIEZOELECTRIC MICROELECTROMECHANICAL ACOUSTIC TRANSDUCER HAVING IMPROVED CHARACTERISTICS AND CORRESPONDING MANUFACTURING PROCESS
    2.
    发明公开
    PIEZOELECTRIC MICROELECTROMECHANICAL ACOUSTIC TRANSDUCER HAVING IMPROVED CHARACTERISTICS AND CORRESPONDING MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP3745743A1

    公开(公告)日：2020-12-02

    申请号：EP20176922.1

    申请日：2020-05-27

    Applicant: STMicroelectronics S.r.l.

    Inventor： CERINI, Fabrizio ,  ADORNO, Silvia

    IPC: H04R17/02 ,  H04R31/00 ,  H04R7/08 ,  H04R7/14

    Abstract: A piezoelectric microelectromechanical acoustic transducer (10), having a substrate (12) of semiconductor material with a frame portion (14) and a through cavity (13) defined internally by the frame portion; an active membrane (15), suspended above the through cavity and anchored, at a peripheral portion thereof, to the frame portion of the substrate by an anchorage structure (16), a plurality of piezoelectric sensing elements (19) carried by a front surface (15a) of the active membrane so as to detect mechanical stresses of the active membrane; a passive membrane (25), suspended above the through cavity, underneath the active membrane, interposed between the through cavity and a rear surface (15b) of the active membrane; and a pillar element (26), which fixedly couples, and is centrally interposed between, the active membrane and the passive membrane. A ventilation hole (28) passes through the entire active membrane (15), the passive membrane (25) and the pillar element (26) so as to set the through cavity (13) in fluidic communication with the front surface (15a) of the active membrane (15).

    MICRO-ELECTRO-MECHANICAL OPTICAL SHUTTER WITH ROTATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS
    3.
    发明公开
    MICRO-ELECTRO-MECHANICAL OPTICAL SHUTTER WITH ROTATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP4187289A1

    公开(公告)日：2023-05-31

    申请号：EP22207166.4

    申请日：2022-11-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  CERINI, Fabrizio ,  GUERINONI, Luca ,  BONI, Nicolò

    IPC: G02B5/00 ,  G02B26/04

    Abstract: A MEMS shutter including: a substrate (2) of semiconductor material traversed by a main aperture (9), and a first semiconductor layer (14) and a second semiconductor layer (16), which form a supporting structure (28, 71) fixed to the substrate; a plurality of deformable structures (29, 59, 69); a plurality of actuators (36; 96); and a plurality of shielding structures (33; 35; 333; 335; 433), each of which is formed by a corresponding portion of at least one between the first semiconductor layer and the second semiconductor layer, the shielding structures being arranged angularly around the underlying main aperture so as to provide shielding of the main aperture, each shielding structure being further coupled to the supporting structure via a corresponding deformable structure. Each actuator may be controlled so as to cause a rotation of a corresponding shielding structure between a respective first position and a respective second position, thus varying shielding of the main aperture. The first and second positions of the shielding structures are such that, in at least one operating condition of the MEMS shutter (1), pairs of adjacent shielding structures at least partially overlap one another.

    MICRO-ELECTROMECHANICAL OPTICAL SHUTTER WITH TRANSLATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS
    4.
    发明公开
    MICRO-ELECTROMECHANICAL OPTICAL SHUTTER WITH TRANSLATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP4187288A1

    公开(公告)日：2023-05-31

    申请号：EP22207130.0

    申请日：2022-11-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  BONI, Nicolò ,  CERINI, Fabrizio ,  GUERINONI, Luca

    IPC: G02B5/00 ,  G02B26/04 ,  G02B26/02

    Abstract: A MEMS shutter (1) including: a semiconductor substrate (2) traversed by an aperture (9); a first semiconductor layer (14) and a second semiconductor layer (16), which form a supporting structure (28, 71, 87; 28, 171) fixed to the substrate; a plurality of deformable structures (29, 59, 68, 85; 169), each of which is formed by a corresponding portion of at least one between the first and second semiconductor layers; a plurality of actuators (36; 96); a plurality of shielding structures (33; 35; 333; 335; 433), each of which is formed by a corresponding portion of at least one between the first and second semiconductor layers, the shielding structures being arranged angularly around the underlying aperture so as to provide shielding of the aperture, each shielding structure being further coupled to the supporting structure via a deformable structure. Each actuator may be controlled so as to translate a corresponding shielding structure between a first position and a second position, thus varying shielding of the aperture; the first and second positions of the shielding structures are such that, in at least one operating condition, pairs of adjacent shielding structures at least partially overlap one another.

    MICROELECTROMECHANICAL ELECTROACOUSTIC TRANSDUCER WITH PIEZOELECTRIC ACTUATION AND CORRESPONDING MANUFACTURING PROCESS
    7.
    发明公开
    MICROELECTROMECHANICAL ELECTROACOUSTIC TRANSDUCER WITH PIEZOELECTRIC ACTUATION AND CORRESPONDING MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP3687192A1

    公开(公告)日：2020-07-29

    申请号：EP20153473.2

    申请日：2020-01-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： CERINI, Fabrizio ,  DUQI, Enri ,  ADORNO, Silvia ,  BALDO, Lorenzo

    IPC: H04R19/00

    Abstract: An actuation structure (10) of a MEMS electroacoustic transducer (11) is formed in a die (12) of semiconductor material having a monolithic body (13) with a front surface (13a) and a rear surface (13b) extending in a horizontal plane (xy) and defined in which are: a frame (14); an actuator element (15) arranged in a central opening (16) defined by the frame (14); cantilever elements (18), coupled at the front surface (13a) between the actuator element (15) and the frame (14); and piezoelectric regions (19) arranged on the cantilever elements (18) and configured to be biased to cause a deformation of the cantilever elements (18) by the piezoelectric effect. A first stopper arrangement (30) is integrated in the die (12) and configured to interact with the cantilever elements (18) to limit a movement thereof in a first direction of a vertical axis (z) orthogonal to the horizontal plane (xy), towards the underlying central opening (16).

    CAPACITIVE, MEMS-TYPE ACOUSTIC TRANSDUCER HAVING SEPARATE SENSITIVE AND TRANSDUCTION AREAS AND MANUFACTURING PROCESS THEREOF
    9.
    发明公开
    CAPACITIVE, MEMS-TYPE ACOUSTIC TRANSDUCER HAVING SEPARATE SENSITIVE AND TRANSDUCTION AREAS AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：EP4408023A1

    公开(公告)日：2024-07-31

    申请号：EP24151115.3

    申请日：2024-01-10

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  CERINI, Fabrizio ,  ADORNO, Silvia

    IPC: H04R19/00

    CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R2201/00320130101

    Abstract: Capacitive, MEMS-type acoustic transducer, having a sound collection part (51) and a transduction part (52). A substrate region (63) surrounds a first chamber (59) arranged in the sound collection part (51) and open towards the outside; a fixed structure (62) is coupled to the substrate region (63); a cap region (56) is coupled to the fixed structure (62). A sensitive membrane (70) is arranged in the sound collection part (51), is coupled to the fixed structure (62) and faces the first chamber (59) . A transduction chamber (58) is arranged in the transduction part (52), hermetically closed with respect to the outside and accommodates a detection membrane (72). An articulated structure (67) extends between the sensitive membrane (70) and the detection membrane (72), through the walls of the transduction chamber (58). A fixed electrode (92; 69C) faces and is capacitively coupled to the detection membrane (72). Conducive electrical connection regions (69A, 69C, 69D) extend above the substrate region (63), into the transduction chamber (58).

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