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公开(公告)号：EP3113509A1
公开(公告)日：2017-01-04
申请号：EP16175518.6
申请日：2016-06-21
Applicant: STMicroelectronics S.r.l. , Stmicroelectronics (Malta) Ltd
Inventor： BRIOSCHI, Roberto , GRITTI, Alex , FORMOSA, Kevin
CPC classification number: H04R1/04 , B81B7/0061 , B81B7/008 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/11
Abstract: A microelectromechanical microphone includes: a substrate (2); a sensor chip (5), integrating a microelectromechanical electroacoustic transducer (35); and a control chip (6) operatively coupled to the sensor chip (5). The sensor chip (5) and the control chip (6) are bonded to the substrate (2), and the sensor chip (5) in part overlies the control chip (6). The sensor chip (5) the has a first portion fixed to a face (6a) of the control chip (6) and comprises a transduction member (37) acoustically communicating with a sound port (11).
Abstract translation: 微电机麦克风包括：基板（2）; 传感器芯片（5），集成微机电电声换能器（35）; 以及可操作地耦合到所述传感器芯片（5）的控制芯片（6）。 传感器芯片（5）和控制芯片（6）结合到基板（2）上，并且传感器芯片（5）部分地覆盖在控制芯片（6）上。 传感器芯片（5）具有固定到控制芯片（6）的面（6a）的第一部分，并且包括与声音端口（11）声学连通的转导构件（37）。
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公开(公告)号：EP4187588A9
公开(公告)日：2023-07-26
申请号：EP22206585.6
申请日：2022-11-10
Applicant: STMicroelectronics S.r.l.
Inventor： MAGGI, Luca , DEL SARTO, Marco , GRITTI, Alex , MAIERNA, Amedeo
IPC: H01L23/13 , H01L23/538 , H05K3/46
Abstract: The electronic module (10) has a three-dimensional frame (12), a printed circuit board (15) and a plurality of electronic devices (17). The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions (37A-37F) which extend transversely to each other in space. The electronic devices (17) are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.
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3.发明公开
公开(公告)号：EP4036968A1
公开(公告)日：2022-08-03
申请号：EP22153019.9
申请日：2022-01-24
Applicant: STMicroelectronics S.r.l.
Inventor： PACI, Dario , ADORNO, Silvia , DEL SARTO, Marco , CERINI, Fabrizio , GRITTI, Alex
IPC: H01L23/48 , H01L23/538
Abstract: A packaged electronic system having a support (55) formed by an insulating organic substrate housing a buried conductive region (56) that is floating. A first die (51) is fixed to the support and carries, on a first main surface, a first die contact region (67) capacitively coupled to a first portion of the buried conductive region. A second die (52) is fixed to the support and carries, on a first main surface, a second die contact region (67) capacitively coupled to a second portion of the buried conductive region. A packaging mass (77) encloses the first die (51), the second die (52), the first die contact region, the second die contact region, and, at least partially, the support (55).
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Patent Agency Ranking
公开(公告)号：EP3113509B1
公开(公告)日：2018-08-01
申请号：EP16175518.6
申请日：2016-06-21
Applicant: STMicroelectronics S.r.l. , Stmicroelectronics (Malta) Ltd
Inventor： BRIOSCHI, Roberto , GRITTI, Alex , FORMOSA, Kevin
CPC classification number: H04R1/04 , B81B7/0061 , B81B7/008 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/11
Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).
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公开(公告)号：EP3330688A1
公开(公告)日：2018-06-06
申请号：EP17177413.6
申请日：2017-06-22
Applicant: STMicroelectronics S.r.l.
Inventor： GRITTI, Alex , GHIDONI, Marco Omar
CPC classification number: G01L19/0092 , G01L9/0042 , G01L9/0054 , G01L9/08 , G01L11/06 , G01L19/147 , G01L2019/0053 , H04R19/005 , H04R2201/003
Abstract: A transducer modulus (11; 51; 61; 71; 81; 91), comprising: a supporting substrate (23); a cap (27), which is arranged on the supporting substrate and defines a chamber (8) therewith; a pressure transducer (12') in the chamber (8); an acoustic transducer (12") in the chamber (8); and a processing chip (22), or ASIC, operatively coupled to the pressure transducer (12') and to the acoustic transducer (12"). The pressure transducer (12') and the acoustic transducer (12") are arranged on top of one another to form a stack.
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公开(公告)号：EP4187588A1
公开(公告)日：2023-05-31
申请号：EP22206585.6
申请日：2022-11-10
Applicant: STMicroelectronics S.r.l.
Inventor： MAGGI, Luca , DEL SARTO, Marco , GRITTI, Alex , MAIERNA, Amedeo
IPC: H01L23/13 , H01L23/538 , H05K3/46
Abstract: The electronic module (10) has a three-dimensional frame (12), a printed circuit board (15) and a plurality of electronic devices (17). The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions (37A-37F) which extend transversely to each other in space. The electronic devices (17) are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.
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7.发明公开
公开(公告)号：EP3974889A1
公开(公告)日：2022-03-30
申请号：EP21198930.6
申请日：2021-09-24
Applicant: STMicroelectronics S.r.l.
Inventor： DEL SARTO, Marco , GRITTI, Alex , MAIERNA, Amedeo , MAGGI, Luca
Abstract: An electronic module (30) comprising: a first die (35) of semiconductor material including a first reflector (10); a second die (36) of semiconductor material including a second reflector (20); and a frame (31) including a first supporting portion and a second supporting portion (32, 33) parallel to one another. The first and second dies (35, 36) are carried, respectively, by the first and second supporting portions (32, 33) and are respectively arranged so that the first reflector (10) faces the second supporting portion and the second reflector (20) faces the first supporting portion (32). An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.
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公开(公告)号：EP3330688B1
公开(公告)日：2020-12-02
申请号：EP17177413.6
申请日：2017-06-22
Applicant: STMicroelectronics S.r.l.
Inventor： GRITTI, Alex , GHIDONI, Marco Omar
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