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1.
公开(公告)号:EP3913681A3
公开(公告)日:2022-03-16
申请号:EP21174210.1
申请日:2021-05-17
Applicant: STMicroelectronics S.r.l.
Inventor: FERRARI, Paolo , VILLA, Flavio Francesco , ZULLINO, Lucia , NOMELLINI, Andrea , SEGHIZZI, Luca , ZANOTTI, Luca , SCOLARI, Martina , MURARI, Bruno
IPC: H01L27/16 , H01L35/22 , H01L35/34 , H01L31/052
Abstract: A method of fabricating a thermoelectric converter comprises: providing a layer (115; 215) of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements (133a; 237; 330a) of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements (133b; 249; 330b) of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer (115; 215) thickness, from the first surface to the second surface; forming electrically conductive interconnections (143, 413; 257, 413) in correspondence of the first surface and of the second surface of the layer of Silicon-based material (115; 215),, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal (257') and an output electrical terminal (257") electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.
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公开(公告)号:EP4005972A1
公开(公告)日:2022-06-01
申请号:EP21211139.7
申请日:2021-11-29
Inventor: DUQI, Enri , BALDO, Lorenzo , FERRARI, Paolo , VIGNA, Benedetto , VILLA, Flavio Francesco , CASTOLDI, Laura Maria , GELMI, Ilaria
Abstract: A semiconductor device includes: a substrate (2); a transduction microstructure (3) integrated in the substrate (2); a cap (5) joined to the substrate (2) and having a first face (5a) adjacent to the substrate (2) and a second, outer, face (5b); and a channel (15) extending through the cap (5) from the second face (5b) to the first face (5a) and communicating with the transduction microstructure (3). A protective membrane (17) made of porous polycrystalline silicon permeable to aeriform substances is set across the channel (15).
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3.
公开(公告)号:EP3913681A2
公开(公告)日:2021-11-24
申请号:EP21174210.1
申请日:2021-05-17
Applicant: STMicroelectronics S.r.l.
Inventor: FERRARI, Paolo , VILLA, Flavio Francesco , ZULLINO, Lucia , NOMELLINI, Andrea , SEGHIZZI, Luca , ZANOTTI, Luca , SCOLARI, Martina , MURARI, Bruno
IPC: H01L27/16 , H01L35/22 , H01L35/34 , H01L31/052
Abstract: A method of fabricating a thermoelectric converter comprises: providing a layer (115; 215) of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements (133a; 237; 330a) of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements (133b; 249; 330b) of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer (115; 215) thickness, from the first surface to the second surface; forming electrically conductive interconnections (143, 413; 257, 413) in correspondence of the first surface and of the second surface of the layer of Silicon-based material (115; 215),, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal (257') and an output electrical terminal (257") electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.
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4.
公开(公告)号:EP4284148A1
公开(公告)日:2023-11-29
申请号:EP23172050.9
申请日:2023-05-08
Applicant: STMicroelectronics S.r.l.
Inventor: FERRARI, Paolo , VILLA, Flavio Francesco , DEL SARTO, Marco
Abstract: MEMS thermoelectric generator (10) comprising: a thermoelectric cell (100) including one or more thermoelectric elements (110) partially extending on a cavity of the thermoelectric cell (100); a total thermoplastic layer (20; 20, 48) extending on the thermoelectric cell (100) and having a top surface (20a; 52a) and a bottom surface (20b) opposite to each other along a first axis (Z), the bottom surface (20b) facing the thermoelectric cell (100) and the total thermoplastic layer (20; 20, 48) being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink (14) configured to exchange heat with the thermoelectric cell (100) interposed, along the first axis (Z), between the heat sink (14) and the total thermoplastic layer (20; 20, 48); and a thermal via (30; 30, 50) of metal material, extending through the total thermoplastic layer (20; 20, 48) from the top surface (20a; 52a) to the bottom surface (20b) so that it is superimposed, along the first axis (Z), on the cavity (115), wherein the thermoelectric cell (100) may exchange heat with a thermal source (12) through the thermal via (30; 30, 50).
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公开(公告)号:EP4144687A1
公开(公告)日:2023-03-08
申请号:EP22190201.8
申请日:2022-08-12
Applicant: STMicroelectronics S.r.l.
Inventor: FERRARI, Paolo , CORSO, Lorenzo , VILLA, Flavio Francesco , NICOLI, Silvia , LAMAGNA, Luca
Abstract: Method for manufacturing a micro-electro-mechanical system, MEMS, (50) integrating a first MEMS device (51) and a second MEMS device (52). The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.
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公开(公告)号:EP4140942A1
公开(公告)日:2023-03-01
申请号:EP22190178.8
申请日:2022-08-12
Applicant: STMicroelectronics S.r.l.
Inventor: FERRARI, Paolo , VILLA, Flavio Francesco , CAMPEDELLI, Roberto , LAMAGNA, Luca , DUQI, Enri , AZPEITIA URQUIA, Mikel , NICOLI, Silvia , TURI, Maria Carolina
IPC: B81C1/00
Abstract: Method for manufacturing a micro-electro-mechanical device (30; 30'), comprising the steps of: forming, on a substrate (2), a first protection layer (5) of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer (5), a sacrificial layer (8, 8') of silicon oxide removable with HF; forming, on the sacrificial layer (8, 8'), a second protection layer (15) of crystallized aluminum oxide; exposing a sacrificial portion (8') of the sacrificial layer (8, 8'); forming, on the sacrificial portion (8'), a first membrane layer (20) of a porous material, permeable to HF; forming a cavity (22) by removing the sacrificial portion (8') through the first membrane layer (20); and sealing pores of the first membrane layer (20) by forming a second membrane layer (24) on the first membrane layer (20).
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