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    PRESSURE SENSOR HAVING IMPROVED REJECTION OF UNDESIRED STIMULI
    2.
    发明公开
    PRESSURE SENSOR HAVING IMPROVED REJECTION OF UNDESIRED STIMULI 审中-公开

    公开(公告)号：EP4545927A1

    公开(公告)日：2025-04-30

    申请号：EP24206565.4

    申请日：2024-10-15

    Applicant: STMicroelectronics International N.V.

    Inventor： DANIELE, Filippo ,  DUQI, Enri ,  BALDO, Lorenzo

    IPC: G01L9/00 ,  G01L13/02 ,  G01L19/06

    Abstract: A pressure sensor (1) has a body (5) having a first chamber (12) and a second chamber (13) hermetically separated from the first chamber; a first detection structure (18) which is arranged in the first chamber (12), has a first deformable element (25) and a first buried cavity (24) within the first detection structure, wherein the first deformable element is configured to undergo a deformation as a function of a pressure difference between the first chamber and the first buried cavity. The sensor also has a second detection structure (19) which is arranged in the second chamber (13), has a second deformable element (32) and a second buried cavity (30) within the second detection structure, wherein the second deformable element is configured to undergo a deformation as a function of a pressure difference between the second chamber and the second buried cavity. The sensor also has a first channel (40) that extends into the body (5) and is configured to fluidically couple the first buried cavity (24) with the second chamber (13); and a second channel (41) that extends into the body (5) and is configured to fluidically couple the second buried cavity (30) to the first chamber (12).

    MICROELECTROMECHANICAL PIEZORESISTIVE PRESSURE SENSOR WITH SELF-TEST CAPABILITY AND CORRESPONDING MANUFACTURING PROCESS
    3.
    发明公开
    MICROELECTROMECHANICAL PIEZORESISTIVE PRESSURE SENSOR WITH SELF-TEST CAPABILITY AND CORRESPONDING MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP3511688A1

    公开(公告)日：2019-07-17

    申请号：EP19152183.0

    申请日：2019-01-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： DUQI, Enri ,  BALDO, Lorenzo

    IPC: G01L27/00 ,  G01L9/00

    Abstract: A microelectromechanical pressure sensor (1) provided with: a monolithic body (2) of semiconductor material having a front surface (2a); and a sensing structure (4) integrated in the monolithic body (2) and having a buried cavity (5), completely contained within the monolithic body (2), at the front surface (2a); a sensing membrane (6), suspended above the buried cavity (5) and formed by a surface portion (2') of the monolithic body (2); and sensing elements (8), of a piezoresistive type, arranged in the sensing membrane (5) and designed to detect a deformation of the sensing membrane (5) as a result of a pressure. The pressure sensor (1) is further provided with a self-test structure (12), integrated within the monolithic body (2), wherein the sensing structure (4) is integrated, such as to cause application of a testing deformation of the sensing membrane (6) in order to verify proper operation of the sensing structure (4).

    PROCESS FOR MANUFACTURING A MEMS MICROMIRROR DEVICE, AND ASSOCIATED DEVICE
    4.
    发明公开
    PROCESS FOR MANUFACTURING A MEMS MICROMIRROR DEVICE, AND ASSOCIATED DEVICE 有权
    制造MEMS微反射镜装置的工艺及相关装置

    公开(公告)号：EP3276392A1

    公开(公告)日：2018-01-31

    申请号：EP17162626.0

    申请日：2017-03-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  CARMINATI, Roberto ,  VILLA, Flavio Francesco

    IPC: G02B26/08 ,  B81C1/00

    Abstract: A process for manufacturing a MEMS micromirror device from a monolithic body (104) of semiconductor material. Initially, a buried cavity (106) is formed in the monolithic body and delimits at the bottom a suspended membrane (105) arranged between the buried cavity (106) and a main surface (104A) of the monolithic body (104). Then, the suspended membrane (105) is defined to form a supporting frame (115) and a mobile mass (114) rotatable about an axis (C) and carried by the supporting frame (115). The mobile mass forms an oscillating mass (107), supporting arms (109), spring portions (111), and mobile electrodes (112) combfingered to fixed electrodes (113). A reflecting region (145) is formed on top of the oscillating mass (107).

    Abstract translation: 一种由半导体材料的单片体（104）制造MEMS微镜器件的方法。 最初，埋入式空腔（106）形成在整体式主体中，并且在底部限定了布置在埋入式空腔（106）与整体式主体（104）的主表面（104A）之间的悬浮膜（105）。 然后，限定悬挂膜105以形成支撑框架115和可围绕轴线C旋转并由支撑框架115承载的可移动质量块114。 可移动块形成摆动块（107），支撑臂（109），弹簧部分（111）和梳状地连接到固定电极（113）的可移动电极（112）。 反射区域（145）形成在振动块（107）的顶部上。

    WATERPROOF MEMS BUTTON DEVICE, INPUT DEVICE COMPRISING THE MEMS BUTTON DEVICE AND ELECTRONIC APPARATUS
    5.
    发明公开
    WATERPROOF MEMS BUTTON DEVICE, INPUT DEVICE COMPRISING THE MEMS BUTTON DEVICE AND ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：EP3799311A1

    公开(公告)日：2021-03-31

    申请号：EP20196998.7

    申请日：2020-09-18

    Applicant: STMicroelectronics S.r.l.

    Inventor： GATTERE, Gabriele ,  VALZASINA, Carlo ,  DUQI, Enri

    IPC: H03K17/975

    Abstract: A button device (6) includes a MEMS sensor (30), having a MEMS strain detection structure (42) and a deformable substrate (37) configured to undergo deformation under the action of an external force (F). In particular, the MEMS strain detection structure (42) includes a mobile element (62) carried by the deformable substrate (37) via at least a first and a second anchorage (67, 69), the latter fixed with respect to the deformable substrate (37) and are configured to displace and generate a deformation force (F t ) on the mobile element (62) in the presence of the external force (F); and stator elements (70, 72) capacitively coupled to the mobile element (62). The deformation of the mobile element (62) causes a capacitance variation (ΔC) between the mobile element (62) and the stator elements (70, 72). Furthermore, the MEMS sensor (30) is configured to generate detection signals (s C1 , S C2 ; S MEMS , s ref ) correlated to the capacitance variation (ΔC).

    MICRO-ELECTRO-MECHANICAL TYPE PRESSURE DEVICE HAVING LOW SENSITIVITY TO TEMPERATURE
    9.
    发明公开
    MICRO-ELECTRO-MECHANICAL TYPE PRESSURE DEVICE HAVING LOW SENSITIVITY TO TEMPERATURE 审中-公开
    具有低温灵敏度的微电机械式压力装置

    公开(公告)号：EP3210934A1

    公开(公告)日：2017-08-30

    申请号：EP16194672.8

    申请日：2016-10-19

    Applicant: STMicroelectronics S.r.l.

    Inventor： DUQI, Enri ,  CONTI, Sebastiano ,  BALDO, Lorenzo ,  VILLA, Flavio Francesco

    IPC: B81B3/00

    CPC classification number: B81B7/0038 ,  B81B3/0086 ,  B81B7/0019 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00269

    Abstract: A micro-electro-mechanical pressure sensor device (100), formed by a cap region (102) and by a sensor region (101) of semiconductor material. An air gap (107) extends between the sensor region (101) and the cap region (102; 103); a buried cavity (109) extends underneath the air gap, in the sensor region (101), and delimits a membrane (111) at the bottom. A through trench (110) extends within the sensor region (101) and laterally delimits a sensitive portion (121) housing the membrane, a supporting portion (120), and a spring portion (122), the spring portion connecting the sensitive portion (121) to the supporting portion (120). A channel (123) extends within the spring portion (122) and connects the buried cavity (109) to a face (101A) of the second region (101). The first air gap (107) is fluidically connected to the outside of the device, and the buried cavity (109) is isolated from the outside via a sealing region (106B) arranged between the sensor region (101) and the cap region (102).

    Abstract translation: 一种微电子机械压力传感器装置（100），其由帽区（102）和半导体材料的传感器区域（101）形成。 气隙（107）在传感器区域（101）和盖区域（102; 103）之间延伸; 埋入空腔（109）在传感器区域（101）中的气隙下方延伸，并在底部界定膜（111）。 贯穿沟槽（110）在传感器区域（101）内延伸并横向限定容纳薄膜的敏感部分（121），支撑部分（120）和弹簧部分（122），弹簧部分连接敏感部分 121）连接到支撑部分（120）。 通道（123）在弹簧部分（122）内延伸并且将掩埋腔（109）连接到第二区域（101）的面（101A）。 第一气隙107流体连接到装置的外部，并且掩埋腔109经由布置在传感器区域101和帽区域102之间的密封区域106B与外部隔离。 ）。

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