公开(公告)号：EP4365944A1

公开(公告)日：2024-05-08

申请号：EP23207394.0

申请日：2023-11-02

Applicant: STMicroelectronics S.r.l.

Inventor： SANNA, Auroroa ,  SOMMA, Cristina ,  HALICKI, Damian

IPC: H01L23/498 ,  H01L23/50

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838

Abstract: A semiconductor device comprises a semiconductor die mounted at a die area (14) of a package (10) such as a BGA package with an array of electrically conductive balls (12) providing electrical contact for the semiconductor die. A power channel (16) is provided to convey power supply current towards the semiconductor die (14). The power channel (16) comprises a stack of electrically conductive planes (12A) between a current inflow plane (L8) opposite the die area (14) and a current outflow plane (L3) towards the die area (14). A distribution of electrically conductive balls (12) is coupled to the current inflow plane (L8) of the power channel (16) so that the power channel (16) provides current conduction paths towards the die area (14) for electrically conductive balls (12) in that distribution. Adjacent electrically conductive planes (12A) in the stack of the power channel (16) are electrically coupled with electrically conductive vias (120) extending therebetween. The electrically conductive planes (12A) are stacked in a stepped arrangement (Step1, Step2, Step3, Step4) wherein the number of stacked planes (12A) increases in steps in the direction from the distal end (PE) to the proximal end of the power channel (16). The current conduction paths towards the die area (14) thus have resistance values that decrease from the distal end (PE) to the proximal end of the power channel (16).
A uniform distribution of power supply current over the length of the power channel (16) is thus facilitated.

公开(公告)号：EP4009365A1

公开(公告)日：2022-06-08

申请号：EP21210940.9

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l.

Inventor： SOMMA, Cristina ,  SANNA, Aurora ,  HALICKI, Damian

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/498 ,  H01L23/50 ,  H01L23/00 ,  H05K1/02 ,  H05K7/14

Abstract: A semiconductor device comprises a semiconductor die mounted at a die area of a package (10) such as an BGA package with an array of electrically-conductive balls (12) providing electrical contact for the semiconductor die. A power channel (16) is provided to convey a power supply current (CF) to the semiconductor die (14).
The power channel (16) comprises one or more electrically-conductive planes (12A) extending in a longitudinal direction of the electrically-conductive plane (12A) between a distal end at the periphery of the package (10) and a proximal end at the die area (14) of the package (10) and a distribution of electrically-conductive balls (12) distributed along a longitudinal direction of the electrically conductive plane (12A).
The one or more electrically-conductive planes (12A) comprise subsequent portions in the longitudinal direction between adjacent electrically-conductive balls (12). These subsequent portions have respective electrical resistance values, which are monotonously decreasing (Rshape_8
A uniform distribution of power supply current (CF) over the length of the power channel is thus facilitated.

公开(公告)号：EP4312239A1

公开(公告)日：2024-01-31

申请号：EP23186653.4

申请日：2023-07-20

Applicant: STMicroelectronics S.r.l.

Inventor： HALICKI, Damian ,  DERAI, Michele

IPC: H01F27/28 ,  H01F41/04 ,  H01F17/00

Abstract: Semiconductor devices of the type currently referred to as a System in a Package or SiP and having embedded therein a transformer are produced by embedding at least one semiconductor chip (14) in an insulating encapsulation (180) at a first portion thereof.
Over a second portion of the substrate at least partly non-overlapping with the first portion of the substrate (180) having the at least one semiconductor chip (14) embedded therein, stacked structure is formed including a plurality of layers of electrically insulating material (Ll, L2, L3, L4) as well as respective patterns of electrically conductive material. The respective patterns of electrically conductive material have:
a planar coil geometry, thus providing electrically conductive coils such as the windings of a transformer (181, 182) or
a geometrical distribution providing electrically conductive connections to one or more semiconductor chips (14).