公开(公告)号：EP4033603A1

公开(公告)日：2022-07-27

申请号：EP22151920.0

申请日：2022-01-18

Applicant: STMicroelectronics S.r.l.

Inventor： GRAZIOSI, Giovanni ,  SANNA, Aurora ,  VILLA, Riccardo

IPC: H01Q1/22 ,  H01Q9/32 ,  H01Q1/40

Abstract: An antenna-in-package (AiP) semiconductor device (10) comprises a semiconductor chip (14) coupled to a planar substrate (12) and a rectilinear wire antenna (100) extending along an antenna axis (X100) transverse to the planar substrate (12). The rectilinear wire antenna (100) is electrically coupled (12) to the semiconductor chip (14) and bonded to the planar substrate (12), thus projecting from the planar substrate (12).
A mass of encapsulation material (20) encapsulates the semiconductor chip (14) coupled to the planar substrate (12) with a cavity (100A) formed in the mass of encapsulation material (20) extending to the planar substrate (12) along the antenna axis (X100).
The rectilinear wire antenna (100) is bonded to the planar substrate (12) at the bottom of the at least one cavity (100A) and thus extends in the cavity (100A) formed (LB) in the mass of encapsulation material (20).

公开(公告)号：EP4009365A1

公开(公告)日：2022-06-08

申请号：EP21210940.9

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l.

Inventor： SOMMA, Cristina ,  SANNA, Aurora ,  HALICKI, Damian

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/498 ,  H01L23/50 ,  H01L23/00 ,  H05K1/02 ,  H05K7/14

Abstract: A semiconductor device comprises a semiconductor die mounted at a die area of a package (10) such as an BGA package with an array of electrically-conductive balls (12) providing electrical contact for the semiconductor die. A power channel (16) is provided to convey a power supply current (CF) to the semiconductor die (14).
The power channel (16) comprises one or more electrically-conductive planes (12A) extending in a longitudinal direction of the electrically-conductive plane (12A) between a distal end at the periphery of the package (10) and a proximal end at the die area (14) of the package (10) and a distribution of electrically-conductive balls (12) distributed along a longitudinal direction of the electrically conductive plane (12A).
The one or more electrically-conductive planes (12A) comprise subsequent portions in the longitudinal direction between adjacent electrically-conductive balls (12). These subsequent portions have respective electrical resistance values, which are monotonously decreasing (Rshape_8
A uniform distribution of power supply current (CF) over the length of the power channel is thus facilitated.