Abstract:
A method of fabricating a wafer-size photovoltaic cell module capable of drastically reducing the overall costs of photovoltaic cells of enhanced efficiency realized on a monocrystalline silicon substrate comprises the steps of:
defining an integrated cellular structure, of a light converting monolateral or bilateral junction diode in the epitaxially grown detachable layer, including a first deposited metal current collecting terminal of the diode; laminating onto the surface the processed epitaxially grown detachable layer a film of an optical grade plastic material resistant to hydrofluoric acid solutions; immersing the wafer in a hydrofluoric acid solution causing detachment of the processed epitaxially grown silicon layer laminated with the film of optical grade plastic material; polishing the surface of separation of the detached processed epitaxially grown layer and forming a second metal current collecting terminal of the diode by masked deposition of a metal at a relatively low temperature tolerable by the film of optical grade plastic material.