Abstract:
A micromechanical device (50) comprising: a semiconductor body (51); a first mobile structure (53; 253); an elastic assembly (57, 59; 259), coupled to the first mobile structure and to the semiconductor body (51) and adapted to undergo deformation in a direction (X) ; and at least one abutment element (66b; 66a). The elastic assembly (57, 59; 259) is configured to enable an oscillation of the first mobile structure (53; 253) as a function of a force applied thereto. The first mobile structure (53; 253), the abutment element (66b; 66a) and the elastic assembly (57, 59; 259) are arranged with respect to one another in such a way that: when said force is lower than a force threshold, the elastic assembly (57, 59; 259) operates with a first elastic constant (K 1 ; K 4 ); and when said force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant (K 1 + K 2 ; K 5 ) different from the first elastic constant. Main figure: Figure 2
Abstract:
The accelerometric sensor has a suspended region (21), mobile with respect to a supporting structure (24), and a sensing assembly (37) coupled to the suspended region and configured to detect a movement of the suspended region with respect to the supporting structure. The suspended region (21) has a geometry variable between at least two configurations associated with respective centroids, different from each other. The suspended region (21) is formed by a first region (22) rotatably anchored to the supporting structure (24) and by a second region (23) coupled to the first region (22) through elastic connection elements (25) configured to allow a relative movement of the second region (23) with respect to the first region (22). A driving assembly (40) is coupled to the second region (23) so as to control the relative movement of the latter with respect to the first region.
Abstract:
A MEMS triaxial magnetic sensor device (51) is provided with a sensing structure (2) having: a substrate (6); an outer frame (4), which internally defines a window (5) and is elastically coupled to first anchorages (7) fixed with respect to the substrate by means of first elastic elements (8); a mobile structure (10) arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements (12) and carries a conductive path (P) for flow of an electric current (I); and an elastic arrangement (22, 24) operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and of the arrangement of elastic elements, a first sensing movement in response to Lorentz forces originating from a first magnetic-field component (B x ), a second sensing movement in response to Lorentz forces originating from a second magnetic-field component (B y ), and a third sensing movement in response to Lorentz forces originating from a third magnetic-field component (B z ); the first, second, and third sensing movements are distinct and decoupled from one another.
Abstract:
An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.
Abstract:
A MEMS tri-axial accelerometer (32) is provided with a sensing structure (1) having: a single inertial mass (2), with a main extension in a horizontal plane (xy) defined by a first horizontal axis (x) and a second horizontal axis (y) and internally defining a first window (4) that traverses it throughout a thickness thereof along a vertical axis (z) orthogonal to the horizontal plane (xy); and a suspension structure (29), arranged within the window for elastically coupling the inertial mass to a single anchorage element (8), which is fixed with respect to a substrate and arranged within the window, so that the inertial mass (2) is suspended above the substrate and is able to carry out, by the inertial effect, a first sensing movement, a second sensing movement, and a third sensing movement in respective sensing directions parallel to the first, second, and third horizontal axes following upon detection of a respective acceleration component (a x ). In particular, the suspension structure has at least one first decoupling element (6) for decoupling at least one of the first, second, and third sensing movements from the remaining sensing movements.
Abstract:
A MEMS accelerometer, including: a support structure (3); a suspended region (2; 62; 92) made of semiconductor material, mobile with respect to the support structure; at least one modulation electrode (20; 68; 114), which is fixed to the support structure and is biased with an electrical modulation signal including at least one periodic component having a first frequency; at least one variable capacitor (30; 80; 130), formed by the suspended region and by the modulation electrode, in such a way that the suspended region is subjected to an electrostatic force that depends upon the electrical modulation signal; and a sensing assembly (12, 14, 16, 18, 5a; 12, 14, 16, 18, 65a; 102, 104, 95a), which generates, when the accelerometer is subjected to an acceleration, an electrical sensing signal, which indicates the position of the suspended region with respect to the support structure and includes a frequency-modulated component, which is a function of the acceleration and of the first frequency.
Abstract:
An out-of-plane MEMS accelerometric sensor, including: a supporting structure (3); a suspended region (92) of semiconductor material, mobile with respect to the supporting structure; at least one first modulation electrode (114), which is fixed to the supporting structure and is biased, in use, with an electrical modulation signal including at least one periodic component having a first frequency; and at least one first variable capacitor (130), formed by the suspended region and by the first modulation electrode, in such a way that the suspended region is subjected to a first electrostatic force that depends upon the electrical modulation signal. The accelerometric sensor further includes a sensing assembly (102, 104, 95a) which generates, when the accelerometric sensor is subjected to an acceleration, an electrical sensing signal, which indicates the position of the suspended region with respect to the supporting structure and includes a frequency-modulated component, which is a function of the acceleration and of the first frequency. The suspended region overlies the first modulation electrode and is anchored to the supporting structure by means of elastic suspension elements (98, 99), which enable rotation of the suspended region about an axis of rotation, which is parallel to a surface of main extension of the suspended region.
Abstract:
An inertial sensor (1) for sensing an external acceleration, comprising: a first and a second proof mass (6, 8); a first and a second capacitor formed between first and second fixed electrodes and the first proof mass; a third and a fourth capacitor formed between third and fourth fixed electrodes and the second proof mass; a driving assembly (14a, 14b, 18a, 18b) configured to cause an antiphase oscillation of the first and second proof masses; a biasing circuit (49, 51) configured to bias the first and third capacitors, thus generating first variation of the oscillation frequency in a first time interval, and to bias the second and fourth capacitors, thus generating first variation of the oscillation frequency in a second time interval; a sensing assembly (16a, 16b, 20a, 20b, 40), configured to generate an differential output signal which is a function of a difference between a value of the oscillating frequency during the first time interval and a value of the oscillating frequency during the second time interval. Such differential output signal can be correlated to the value and direction of the external acceleration.