公开(公告)号：CN104503617B

公开(公告)日：2017-10-13

申请号：CN201410834836.1

申请日：2014-12-26

Applicant: 合肥鑫晟光电科技有限公司 ,  京东方科技集团股份有限公司

Inventor： 吴玲艳 ,  张雷 ,  谢涛峰 ,  刘洋

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/111 ,  H05K3/10 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/03 ,  H05K2201/10128

Abstract: 本发明涉及一种触摸屏的边框结构，包括：在基板的背面设置在基板一端的BM部；设置在BM部上的结合区，所述结合区设置有多根金属引线以及多个透明导电焊盘，所述多个透明导电焊盘与对应的金属引线电连接；在基板的厚度方向上设置在透明导电焊盘与金属引线之间的第一绝缘光阻层，所述透明导电焊盘与对应的金属引线利用设置在第一绝缘光阻层中的跳孔电连接；以及在基板的背面设置在基板的两侧的多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成对应的所述透明导电焊盘。本发明还涉及具有该边框结构的触摸屏、具有该触摸屏的显示装置以及制造触摸屏的边框结构的方法。

公开(公告)号：CN104503617A

公开(公告)日：2015-04-08

申请号：CN201410834836.1

申请日：2014-12-26

Applicant: 合肥鑫晟光电科技有限公司 ,  京东方科技集团股份有限公司

Inventor： 吴玲艳 ,  张雷 ,  谢涛峰 ,  刘洋

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/111 ,  H05K3/10 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/03 ,  H05K2201/10128 ,  G06F3/0412 ,  G06F2203/04111

Abstract: 本发明涉及一种触摸屏的边框结构，包括：在基板的背面设置在基板一端的BM部；设置在BM部上的结合区，所述结合区设置有多根金属引线以及多个透明导电焊盘，所述多个透明导电焊盘与对应的金属引线电连接；在基板的厚度方向上设置在透明导电焊盘与金属引线之间的第一绝缘光阻层，所述透明导电焊盘与对应的金属引线利用设置在第一绝缘光阻层中的跳孔电连接；以及在基板的背面设置在基板的两侧的多根透明导电边缘走线，每一根透明导电边缘走线延伸到结合区而形成对应的所述透明导电焊盘。本发明还涉及具有该边框结构的触摸屏、具有该触摸屏的显示装置以及制造触摸屏的边框结构的方法。

公开(公告)号：US11845219B2

公开(公告)日：2023-12-19

申请号：US16864522

申请日：2020-05-01

Applicant: Massachusetts Institute of Technology ,  President and Fellows of Harvard College

Inventor： Theodore H. Fedynyshyn ,  Jennifer A. Lewis ,  Bradley P. Duncan

IPC: B29C64/00 ,  B29C64/165 ,  B29C64/209 ,  B05D5/08 ,  C09D5/24 ,  H01L23/498 ,  H01B1/00 ,  G03G5/05 ,  G03G5/07 ,  H01M10/653 ,  H01M4/66 ,  H05K1/09 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  B29K23/00 ,  B29K25/00 ,  B29K105/00 ,  B29L31/34 ,  G01N33/00

CPC classification number: B29C64/165 ,  B05D5/083 ,  B29C64/209 ,  C09D5/24 ,  G03G5/05 ,  G03G5/07 ,  H01B1/00 ,  H01L23/49883 ,  H01M4/663 ,  H01M10/653 ,  H05K1/092 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2025/06 ,  B29K2105/251 ,  B29K2995/0006 ,  B29K2995/0008 ,  B29K2995/0088 ,  B29K2995/0093 ,  B29K2995/0094 ,  B29L2031/3456 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  G01N2033/0095 ,  H05K2201/015 ,  H05K2201/03

Abstract: A 3-D printed device comprising one or more structures, the structures comprising a plurality of magnetically responsive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a magnetic ink composition; applying the magnetic ink composition to a substrate in a 3-D solvent cast printing process to form one or more structures; and drying the one or more structures formed from the magnetic ink composition. The dried structures can exhibit one or more regions of magnetic permeability greater than 1.3×10−6 H/m.

公开(公告)号：US20170177105A1

公开(公告)日：2017-06-22

申请号：US15129907

申请日：2015-07-10

Applicant: BOE Technology Group Co.. Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd

Inventor： Lingyan Wu ,  Lei Zhang ,  Taofeng Xie ,  Yang Liu

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K3/32

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/111 ,  H05K3/10 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/03 ,  H05K2201/10128

Abstract: A bezel structure of a touch screen is disclosed by the invention, including: a BM portion provided at an end on a back surface of the substrate; a bonding area arranged on the BM portion and provided with a plurality of metal leads and a plurality of transparent conductive solder pads, each of the plurality of transparent conductive solder pads being electrically connected with corresponding one metal lead of the plurality of metal leads; a first insulating photoresist layer arranged between the plurality of transparent conductive solder pads and the plurality of metal leads in a thickness direction of the substrate, the transparent conductive solder pads being electrically connected with corresponding metal leads via jumper holes provided in the first insulating photoresist layer; and a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of the plurality of transparent conductive solder pads located within the bonding area. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention. Transparent conductive material is formed as edge-routing wires so as to realize a bezel-free technology, providing an improved user experience.

公开(公告)号：US11770902B2

公开(公告)日：2023-09-26

申请号：US17498767

申请日：2021-10-12

Applicant: WUXI SHENNAN CIRCUITS CO., LTD.

Inventor： Yunfeng Jiao ,  Lei You ,  Zhicheng Yang ,  Lihua Zhang ,  Hua Miao

IPC: H05K1/02 ,  H05K3/32 ,  H05K1/05

CPC classification number: H05K3/32 ,  H05K1/0296 ,  H05K1/05 ,  H05K2201/03 ,  H05K2201/095

Abstract: A circuit board, a preparation method thereof, and an electronic device are provided. The circuit board includes: a substrate, defining a first through-hole; a metal block, embedded in the first through-hole and fixedly connected to the substrate; a conductive line layer, arranged on at least one side surface of the substrate; wherein the conductive line layer partially covers an opening of the first through-hole on a corresponding side surface of the substrate; and a conductive channel, penetrating the conductive line layer and the metal block in turn. The conductive channel comprises a second through-hole and a conductive medium plated on a wall of the second through-hole; an end of the conductive medium is connected to the conductive line layer, and another end of the conductive medium is connected to the metal block.

公开(公告)号：US20190244909A1

公开(公告)日：2019-08-08

申请号：US15891305

申请日：2018-02-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yong-Da CHIU ,  Shiu-Chih WANG ,  Shang-Kun HUANG ,  Ying-Ta CHIU ,  Shin-Luh TARNG ,  Chih-Pin HUNG

IPC: H01L23/532 ,  H01L23/00

CPC classification number: H01L23/53233 ,  H01L23/53238 ,  H01L24/06 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/161 ,  H05K2201/03 ,  H05K2201/09481

Abstract: A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.

公开(公告)号：US10007367B2

公开(公告)日：2018-06-26

申请号：US15129907

申请日：2015-07-10

Applicant: BOE Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Inventor： Lingyan Wu ,  Lei Zhang ,  Taofeng Xie ,  Yang Liu

IPC: G06F3/041 ,  H05K1/11 ,  H05K3/10 ,  H05K3/32 ,  H05K1/02 ,  H05K1/09

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/111 ,  H05K3/10 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/03 ,  H05K2201/10128

Abstract: A bezel structure of a touch screen is disclosed by the invention. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention.

公开(公告)号：US11894629B2

公开(公告)日：2024-02-06

申请号：US17195738

申请日：2021-03-09

Applicant: TE Connectivity Services GmbH ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： John Joseph Consoli ,  Chad William Morgan ,  Megan Hoarfrost Beers ,  Christopher William Blackburn ,  Nathan Lincoln Tracy ,  Jennifer Love ,  Clarence Leon Yu ,  Shinichi Hashimoto ,  Hiroshi Shirai

IPC: H01R13/24 ,  H01R12/71 ,  H01R12/52 ,  H01R13/6599 ,  H01R13/11 ,  H05K1/09

CPC classification number: H01R13/2407 ,  H01R12/52 ,  H01R12/714 ,  H01R13/11 ,  H01R13/2414 ,  H01R13/6599 ,  H05K1/095 ,  H01R12/712 ,  H05K2201/03 ,  H05K2201/0314 ,  H05K2201/0329

Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

公开(公告)号：US11731346B2

公开(公告)日：2023-08-22

申请号：US17490210

申请日：2021-09-30

Applicant: Honeywell Federal Manufacturing & Technologies, LLC

Inventor： Thomas Matthew Selter ,  Jamie Michael Messman

IPC: B29C64/00 ,  B29C64/135 ,  B29C64/20 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y30/00 ,  B33Y80/00 ,  B22F10/00 ,  B29C64/307 ,  B29C64/255 ,  B29C64/245 ,  B33Y99/00 ,  B29C64/182 ,  B22F12/00 ,  B29C64/30 ,  B29C64/386 ,  B33Y40/10 ,  B33Y40/00 ,  B29C64/40 ,  B29C64/25 ,  B29C64/393 ,  B33Y50/02 ,  B29C64/205 ,  B33Y40/20 ,  B33Y50/00 ,  B22F12/82 ,  B29C64/10 ,  B29C64/176 ,  B29C64/227 ,  B22F10/85 ,  B05D5/08 ,  H01M10/653 ,  C09D5/24 ,  H01L23/498 ,  H01M4/66 ,  G03G5/05 ,  G03G5/07 ,  H05K1/09 ,  H01B1/00 ,  B29K27/12 ,  B29K507/04 ,  B01D67/00 ,  G01N33/00 ,  G03F7/00

CPC classification number: B29C64/135 ,  B05D5/083 ,  B22F10/00 ,  B22F10/85 ,  B22F12/00 ,  B22F12/82 ,  B29C64/00 ,  B29C64/10 ,  B29C64/176 ,  B29C64/182 ,  B29C64/20 ,  B29C64/205 ,  B29C64/227 ,  B29C64/245 ,  B29C64/25 ,  B29C64/255 ,  B29C64/30 ,  B29C64/307 ,  B29C64/386 ,  B29C64/393 ,  B29C64/40 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  C09D5/24 ,  G03G5/05 ,  G03G5/07 ,  H01B1/00 ,  H01L23/49883 ,  H01M4/663 ,  H01M10/653 ,  H05K1/092 ,  B01D67/00045 ,  B01D67/00415 ,  B29K2027/12 ,  B29K2507/04 ,  G01N2033/0095 ,  G03F7/70416 ,  G03G2215/2054 ,  G05B2219/49023 ,  G05B2219/49246 ,  H05K2201/015 ,  H05K2201/03 ,  Y10T156/1722 ,  Y10T156/1798

Abstract: A system and method of additively manufacturing a part including electrically conductive or static dissipating fluorine-containing polymers. The method includes depositing fluorine-containing polymer additive manufacturing material onto a build platform, selectively cross-linking portions of the deposited additive manufacturing material, and curing the selectively cross-linked portions such that the part is at least one of electrically conductive and static dissipating.

公开(公告)号：US20230262901A1

公开(公告)日：2023-08-17

申请号：US18167662

申请日：2023-02-10

Applicant: Skyworks Solutions, Inc.

Inventor： Andrew Christopher Laib

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/185 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/10098 ,  H05K2201/03

Abstract: A printed circuit board for use in an electronics package has a die attach pad and one or more adhesion strips outside the die attach pad. The adhesion strip(s) facilitate adhesion of a mold compound over the die attach pad and die and inhibits (e.g., prevents) delamination of the mold compound from the die attach pad.